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Hexcel® HexPly® F652 Bismaleimide Resin

Category Polymer , Thermoset , Polyimide, TS
Manufacturer Hexcel
Trade Name HexPly®
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Hexcel® HexPly® F652 Bismaleimide Resin.pdf
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Material Notes:
HexPly® F652 is a bismaleimide resin that cures via an addition reaction with no condensation by-products. HexPly® F652 is a controlled flow polyimide resin system designed for alternative processing capabilities such as co-curing over honeycomb core, compression molding, as well as standard autoclave processing.Information provided by HexCel
Physical Properties Metric English Comments
Specific Gravity 1.26 g/cc
1.26 g/cc
Moisture Absorption at Equilibrium 4.4 %
4.4 %
Mechanical Properties Metric English Comments
Fracture Toughness 0.639 MPa-m½
0.582 ksi-in½
Thermal Properties Metric English Comments
CTE, linear 52.0 µm/m-°C

@Temperature 24.0 - 299 °C
28.9 µin/in-°F

@Temperature 75.2 - 570 °F
Glass Transition Temp, Tg >= 232 °C
>= 450 °F
Wet
>= 316 °C
>= 601 °F
Dry
Electrical Properties Metric English Comments
Dielectric Constant 3.01

@Frequency 1.60e+10 Hz,
Temperature 24.0 °C
3.01

@Frequency 1.60e+10 Hz,
Temperature 75.2 °F
+/- 2%; ASTM D2520
3.05

@Frequency 9.00e+9 Hz,
Temperature 24.0 °C
3.05

@Frequency 9.00e+9 Hz,
Temperature 75.2 °F
+/- 2%; ASTM D2520
3.05

@Frequency 1.60e+10 Hz,
Temperature 149 °C
3.05

@Frequency 1.60e+10 Hz,
Temperature 300 °F
+/- 2%; ASTM D2520
3.08

@Frequency 9.00e+9 Hz,
Temperature 149 °C
3.08

@Frequency 9.00e+9 Hz,
Temperature 300 °F
+/- 2%; ASTM D2520
3.09

@Frequency 3.00e+9 Hz,
Temperature 24.0 °C
3.09

@Frequency 3.00e+9 Hz,
Temperature 75.2 °F
+/- 2%; ASTM D2520
3.09

@Frequency 1.60e+10 Hz,
Temperature 232 °C
3.09

@Frequency 1.60e+10 Hz,
Temperature 450 °F
+/- 2%; ASTM D2520
3.12

@Frequency 9.00e+9 Hz,
Temperature 232 °C
3.12

@Frequency 9.00e+9 Hz,
Temperature 450 °F
+/- 2%; ASTM D2520
3.13

@Frequency 3.00e+9 Hz,
Temperature 149 °C
3.13

@Frequency 3.00e+9 Hz,
Temperature 300 °F
+/- 2%; ASTM D2520
3.17

@Frequency 3.00e+9 Hz,
Temperature 232 °C
3.17

@Frequency 3.00e+9 Hz,
Temperature 450 °F
+/- 2%; ASTM D2520
Dielectric Loss Index 0.0050

@Frequency 3.00e+9 Hz,
Temperature 24.0 °C
0.0050

@Frequency 3.00e+9 Hz,
Temperature 75.2 °F
F652 Resin Casting; +/- 0.5; ASTM D2520
0.0060

@Frequency 3.00e+9 Hz,
Temperature 149 °C
0.0060

@Frequency 3.00e+9 Hz,
Temperature 300 °F
F652 Resin Casting; +/- 0.5; ASTM D2520
0.0060

@Frequency 9.00e+9 Hz,
Temperature 24.0 °C
0.0060

@Frequency 9.00e+9 Hz,
Temperature 75.2 °F
F652 Resin Casting; +/- 0.5; ASTM D2520
0.0070

@Frequency 3.00e+9 Hz,
Temperature 232 °C
0.0070

@Frequency 3.00e+9 Hz,
Temperature 450 °F
F652 Resin Casting; +/- 0.5; ASTM D2520
0.0070

@Frequency 9.00e+9 Hz,
Temperature 149 °C
0.0070

@Frequency 9.00e+9 Hz,
Temperature 300 °F
F652 Resin Casting; +/- 0.5; ASTM D2520
0.0070

@Frequency 1.60e+10 Hz,
Temperature 24.0 °C
0.0070

@Frequency 1.60e+10 Hz,
Temperature 75.2 °F
F652 Resin Casting; +/- 0.5; ASTM D2520
0.0080

@Frequency 9.00e+9 Hz,
Temperature 232 °C
0.0080

@Frequency 9.00e+9 Hz,
Temperature 450 °F
F652 Resin Casting; +/- 0.5; ASTM D2520
0.0080

@Frequency 1.60e+10 Hz,
Temperature 149 °C
0.0080

@Frequency 1.60e+10 Hz,
Temperature 300 °F
F652 Resin Casting; +/- 0.5; ASTM D2520
0.0090

@Frequency 1.60e+10 Hz,
Temperature 232 °C
0.0090

@Frequency 1.60e+10 Hz,
Temperature 450 °F
F652 Resin Casting; +/- 0.5; ASTM D2520
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