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Sumitomo Bakelite North America 1907-1 / 1907B-1 Glass Reinforced Hardware Grade Epoxy

Category Polymer , Thermoset , Epoxy , Epoxy, Molded, Glass Fiber Filler , Filled/Reinforced Thermoset
Manufacturer Sumitomo Bakelite North America
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Sumitomo Bakelite North America 1907-1 / 1907B-1 Glass Reinforced Hardware Grade Epoxy.pdf
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Material Notes:
Epoxy is the premier material for military firewall connectors.Information provided by Sumitomo Bak North America, Inc.
Physical Properties Metric English Comments
Density 1.95 g/cc
0.0704 lb/in³
ASTM D792
Water Absorption 0.30 %
0.30 %
48 hours, 50°C. ASTM D570
Linear Mold Shrinkage 0.0020 - 0.0040 cm/cm
0.0020 - 0.0040 in/in
Compression Molding. ASTM D955
Mechanical Properties Metric English Comments
Hardness, Barcol 73
73
Tensile Strength, Ultimate 65.0 MPa
9430 psi
ASTM D638
Flexural Yield Strength 117 MPa
17000 psi
ASTM D790
Flexural Modulus 13.8 GPa
2000 ksi
ASTM D790
Compressive Yield Strength 214 MPa
31000 psi
ASTM D695
Izod Impact, Notched 0.320 J/cm
0.599 ft-lb/in
ASTM D256A
Thermal Properties Metric English Comments
CTE, linear, Parallel to Flow 47.0 µm/m-°C

@Temperature 20.0 °C
26.1 µin/in-°F

@Temperature 68.0 °F
ASTM D696
Thermal Conductivity 0.586 W/m-K
4.07 BTU-in/hr-ft²-°F
ASTM F433
Deflection Temperature at 1.8 MPa (264 psi) 260 °C
500 °F
ASTM D648A
Oxygen Index 38 %
38 %
ASTM D2863
Electrical Properties Metric English Comments
Dielectric Constant 4.0
4.0
Wet; ASTM D150
Dielectric Strength 11.0 kV/mm
279 kV/in
Wet, short term. ASTM D149
Dissipation Factor 0.020

@Frequency 1e+6 Hz
0.020

@Frequency 1e+6 Hz
Wet; ASTM D150
Arc Resistance 175 sec
175 sec
ASTM D495
Processing Properties Metric English Comments
Mold Temperature 143 - 177 °C
289 - 351 °F
compression/transfer molding.
174 - 182 °C
345 - 360 °F
injection molding.
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