Polymer Property : Mold Temperature = 289 Â°F Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Mold Temperature	143 - 177 Â°C	289 - 351 Â°F	compression/transfer molding.
Sumitomo Bakelite North America 2004B Glass Reinforced Hardware Grade Epoxy Epoxy is the premier material for military firewall connectors.Information provided by Sumitomo Bak North America, Inc.
Mold Temperature	143 - 177 Â°C	289 - 351 Â°F	compression/transfer molding.
Sumitomo Bakelite North America 4064 Mineral Filled Electrical Encapsulation Grade Epoxy Rogers electrical encapsulation grade epoxy is recommended for capacitors, resistors, gold lead encapsulation, relays, coils and bobbins.Information provided by Sumitomo Bak North America, Inc.
Mold Temperature	143 - 177 Â°C	289 - 351 Â°F	compression/transfer molding.
Sumitomo Bakelite North America 1907-1 / 1907B-1 Glass Reinforced Hardware Grade Epoxy Epoxy is the premier material for military firewall connectors.Information provided by Sumitomo Bak North America, Inc.
Mold Temperature	143 - 177 Â°C	289 - 351 Â°F	compression/transfer molding.
Sumitomo Bakelite North America 2008A Glass Reinforced Hardware Grade Epoxy Epoxy is the premier material for military firewall connectors.Information provided by Sumitomo Bak North America, Inc.
Mold Temperature	143 - 177 °C	289 - 351 °F
Vyncolit INSUL-PLATE™ X-28057-2HT Hole-Fill Powder For Printed Circuit Boards Vyncolit INSUL-PLATE™ Hole-Fill material delivers true reliability and superior performance. This material, in powder form, is specifically suited for Hole-Fill use in glass epoxy, multi-layer and ..
Mold Temperature	143 - 190 °C	289 - 374 °F	Average value: 172 °C Grade Count:9
Overview of materials for Epoxy, Molded, Glass Fiber Filler This property data is a summary of similar materials in the MatWeb database for the category "Epoxy, Molded, Glass Fiber Filler". Each property range of values reported is minimum and maximum values..