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Tra-Con Tra-Bond 216E02 Encapsulant for "Fill" Applications

Category Polymer , Adhesive , Thermoset , Epoxy
Manufacturer Tra-Con, Inc.
Trade Name Tra-Bond
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Tra-Con Tra-Bond 216E02 Encapsulant for "Fill" Applications.pdf
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Material Notes:
TRA-BOND 216E02 is a two-part epoxy adhesive developed specifically for underfill and encapsulating applications where the combination of excellent mechanical, thermal and electrical properties are required. TRA-BOND 216E02 works in concert with 216E01 to perform `dam` and `fill` functions. TRA-BOND 216E02 exhibits superior adhesion to glass, ceramics, metals, plastics and other electronic materials. Fully cured TRA-BOND 216E02 is an excellent electrical insulator and provides resistance to water, gases and vapors, acids, alkalis, salt solutions, petroleum products and other organic and inorganic compounds. Information provided by Tra-Con Inc.
Physical Properties Metric English Comments
Specific Gravity 1.80 g/cc
1.80 g/cc
Water Absorption 0.080 %
0.080 %
Viscosity 66000 cP

@Temperature 25.0 °C
66000 cP

@Temperature 77.0 °F
Mixed (rv #7, 10 rpm)
Mechanical Properties Metric English Comments
Hardness, Shore D 89
89
Adhesive Bond Strength 15.9 MPa
2300 psi
Lap shear, alum to alum, 4 hrs @ 65°C
Thermal Properties Metric English Comments
Glass Transition Temp, Tg 63.0 °C
145 °F
Ultimate Tg
Processing Properties Metric English Comments
Cure Time 240 min

@Temperature 65.0 °C
4.00 hour

@Temperature 149 °F
4320 min

@Temperature 25.0 °C
72.0 hour

@Temperature 77.0 °F
Pot Life 180 min
180 min
40 grams
Descriptive Properties Value Comments
Color Black
Mix Ratio, parts by weight 100/48.5
Resin/Hardener
Thixotropic Index 1.8
1 rpm/10 rpm
Working Life hours 8
40 grams
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