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- Polymer Property : Pot Life = 180 min
Polymer Property : Pot Life = 180 min Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Pot Life | 180 min | 180 min | |
| NextGen Adhesives EC907-34 Epoxy Adhesive Description: NGAC EC907-34 is a two part, electrically conductive silver filled epoxy adhesive which can be cured at room temperature. It was designed for applications requiring excellent mechanical.. |
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| Pot Life | 180 min | 180 min | |
| Resin Technology Group H420 Oxy-Bond™ Electrically Conductive Epoxy Adhesive Oxy-Bond and Millenium Adhesive SystemsEngineered for strength, durability, lightness, and formability, our Oxy-Bond and Millenium lines offer adhesives with physical and electrical properties to ma.. |
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| Pot Life | 180 min | 180 min | |
| Resin Technology Group H420 Oxy-Bond™ Electrically Conductive Epoxy Adhesive Oxy-Bond and Millenium Adhesive SystemsEngineered for strength, durability, lightness, and formability, our Oxy-Bond and Millenium lines offer adhesives with physical and electrical properties to ma.. |
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| Pot Life | 180 min @Temperature 100 °C |
180 min @Temperature 212 °F |
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| Huntsman HT 976 Aromatic Amine Approx. H+ equivalent weight 63. Mix Ratio with GY 6010 is 36.Comments/Applications: 4,4'-diaminodiphenyl sulfone (DDS). Solid amine with a melting point of 174 - 178°C. Excellent high temper.. |
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| Pot Life | 180 min | 180 min | |
| Hybrid Plastics POSS® EP 1000 Epoxy Adhesive EP1000 is a POSS® based epoxy adhesive with outstanding oxidative resistance to ozone, plasma, or atomic oxygen environments. The EP1000 POSS® Epoxy is also well-suited for peroxide and steam... |
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| Pot Life | 180 min | 180 min | |
| Hybrid Plastics POSS® EP 1050 Epoxy Adhesive EP1050 is a POSS® based, high-temperature epoxy adhesive with outstanding resistance to ozone, plasma, or atomic oxygen environments. Major applications include medical devices, optics, semicondu.. |
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| Pot Life | 180 min | 180 min | 100 gram batch |
| Master Bond EP30-D10 Abrasion Resistant, Flexible Adhesive Compound Description: Master Bond Polymer System EP30-D10 is a versatile two component, abrasion resistant elastomer featuring superior strength, toughness and chemical resistance for high performance bondin.. |
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| Pot Life | >= 180 min | >= 180 min | 400 gram batch |
| Master Bond EP45HT-1 Adhesive Resists Exposure to Sterilization Description: Master Bond Polymer System EP45HT-1 is a remarkably fast curing, medium viscosity, two component epoxy compound formulated for high performance casting and bonding. It is 100% reactive .. |
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| Pot Life | 180 min | 180 min | |
| Tra-Con Tra-Bond FDA22 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-22 is a high viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Admini.. |
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| Pot Life | 180 min | 180 min | |
| Tra-Con Tra-Bond FDA2YL02 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-2 YL02 is a medium viscosity epoxy resin system specifically developed for adhesive and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug.. |
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| Pot Life | 180 min | 180 min | |
| Tra-Con Tra-Bond FDA8T Food and Drug Application Thixotropic Flexible Epoxy Adhesive TRA-BOND FDA-8T EPOXY ADHESIVE is a thixotropic epoxy resin system specifically developed for bonding applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Admini.. |
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| Pot Life | 180 min | 180 min | |
| Tra-Con Tra-Cast 3012 Clear Epoxy Casting Compound TRA-CAST 3012 is a clear, low viscosity epoxy casting compound recommended for industrial embedding and casting applications where its combination of superior properties good clarity, long pot life,.. |
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| Pot Life | 180 min | 180 min | |
| Tra-Con Tra-Duct 2916 Room Temperature Conductive Silver Epoxy Adhesive TRA-DUCT 2916 is an electrically conductive, silver-filled epoxy formulation recommended for electronic bonding, coating, and sealing applications that require high flexibility coupled with good ele.. |
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| Pot Life | 180 min | 180 min | |
| Tra-Con Tra-Bond 2158 Heat Conductive Electrically Insulating Compound TRA-BOND 2158 is a flexible, thermal conductive epoxy system. It is used for staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards.. |
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| Pot Life | 180 min | 180 min | 40 grams |
| Tra-Con Tra-Bond 216E02 Encapsulant for "Fill" Applications TRA-BOND 216E02 is a two-part epoxy adhesive developed specifically for underfill and encapsulating applications where the combination of excellent mechanical, thermal and electrical properties are .. |
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| Pot Life | 180 min | 180 min | |
| Tra-Con Tra-Cast 3143 Fire Retardant Epoxy Casting Compound TRA-CAST 3143 has a low viscosity and long pot life. It is certified to the requirements of UL 94 V-O, and is recommended for rigid potting, laminating, transformer encapsulating, filament winding a.. |
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| Pot Life | 180 min | 180 min | |
| Epoxy Technology EPO-TEK® 353ND-T1 High Temperature Thixotropic Epoxy Material Description: A two component, thixotropic and high temperature epoxy designed for fiber optic, electronics and medical applications. It is a more viscous alternative to EPO-TEK® 353ND-T.I.. |
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| Pot Life | 180 min | 180 min | |
| Epoxy Technology EPO-TEK® 353ND-T5 High Temperature Thixotropic Epoxy Product Description: EPO-TEK® 353ND-T5 is an intermediate viscosity version of EPO-TEK® 353ND and EPO-TEK® 353ND-T. It was designed for high temperature applications in fiber optics, electronics .. |
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| Pot Life | 180 min | 180 min | |
| Epoxy Technology EPO-TEK® 430 Epoxy Product Description: A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for interconnecting, grounding .. |
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| Pot Life | 180 min | 180 min | |
| Epoxy Technology EPO-TEK® 431 Copper Filled Epoxy A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for interconnecting, grounding and EMI RF shielding... |
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| Pot Life | 180 min | 180 min | |
| Epoxy Technology EPO-TEK® H54 High Temperature Epoxy Product Description: EPO-TEK® H54 is a two component, high Tg, electrically and thermally insulating epoxy adhesive for general bonding and high temperature packaging in medical, hybrid, and optica.. |
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| Pot Life | 180 min | 180 min | |
| Epoxy Technology EPO-TEK® H55 Epoxy Material Description: A two component, thixotropic and high temperature epoxy designed to be used for hybrids and PCB applications.Information Provided by Epoxy Technology |
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| Pot Life | 180 min | 180 min | |
| Epoxy Technology EPO-TEK® MA-5 Optical Grade Epoxy Material Description: A single component, B-stageable, optical grade epoxy for fiber optic assembly. It may be used for B-stage sealing of fiber cables into ferrules, or fiber optic feed through in.. |
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| Pot Life | >= 180 min | >= 180 min | |
| Epoxyset Epoxibond EB-119SP Unfilled Epoxy Adhesive A two-component, unfilled, high temperature epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.Information provided by Epoxyset Inc... |
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| Pot Life | 180 min | 180 min | uncured |
| Atom Adhesives AA-DUCT 902LP Epoxy Adhesive AA-DUCT 902LP is an epoxy adhesive and coating formulation based on pure silver. This versatile silver formulation offers the maximum continuity of conductivity with an electrical resistivity value .. |
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