Polymer Property : Pot Life = 180 min Product List

Processing Properties

Tips: 30 items are displayed at most. For the rest of the results, please contact customer service.

Processing Properties	Metric	English	Comments
Pot Life	180 min	180 min
Resin Technology Group H420 Oxy-Bond™ Electrically Conductive Epoxy Adhesive Oxy-Bond and Millenium Adhesive SystemsEngineered for strength, durability, lightness, and formability, our Oxy-Bond and Millenium lines offer adhesives with physical and electrical properties to ma..
Pot Life	180 min @Temperature 25.0 °C	180 min @Temperature 77.0 °F
Resin Technology Group TIGA 920H Flexible Silver Conductive 100 parts resin to 115 parts hardener.TIGA 920-H is a flexible, conductive silver filled epoxy adhesive. It is recommended for bonding, and sealing electronic applications that require high flexibil..
Pot Life	180 min @Temperature 100 Â°C	180 min @Temperature 212 Â°F
Huntsman HT 976 Aromatic Amine Approx. H+ equivalent weight 63. Mix Ratio with GY 6010 is 36.Comments/Applications: 4,4'-diaminodiphenyl sulfone (DDS). Solid amine with a melting point of 174 - 178Â°C. Excellent high temper..
Pot Life	180 min	180 min
Hybrid Plastics POSSÂ® EP 2000 Epoxy Adhesive EP2000 is a POSSÂ® based, ultra-high temperature epoxy adhesive. The POSSÂ® content in EP2000 offers unique properties such as high thermal stability, outstanding oxygen and chemical resistance...
Pot Life	180 min	180 min
Tra-Con Tra-Bond FDA23 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-23 is a high viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Admini..
Pot Life	180 min	180 min
Tra-Con Tra-Bond FDA2YL02 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-2 YL02 is a medium viscosity epoxy resin system specifically developed for adhesive and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug..
Pot Life	180 min	180 min
Tra-Con Tra-Bond FDA8T Food and Drug Application Thixotropic Flexible Epoxy Adhesive TRA-BOND FDA-8T EPOXY ADHESIVE is a thixotropic epoxy resin system specifically developed for bonding applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Admini..
Pot Life	180 min	180 min
Tra-Con Tra-Cast 3010 Flexible Clear Epoxy Casting Compound TRA-CAST 3010 is a clear, low viscosity epoxy casting compound recommended for industrial embedding and casting applications where its combination of superior properties, good clarity, long pot life..
Pot Life	180 min	180 min
Tra-Con Tra-Cast FS330 Fire Retardant Long Pot Life Epoxy Casting Compound TRA-CAST FS330 is a low viscosity, long pot life, thermally conductive casting compound which passes UL 94 V-O. It is recommended for rigid potting, laminating, transformer encapsulating, filament w..
Pot Life	180 min	180 min
Tra-Con Tra-Duct 2916T Room Temperature Conductive Silver Epoxy Adhesive TRA-DUCT 2916T is an electrically conductive, silver-filled epoxy formulation recommended for electronic bonding, coating, and sealing applications that require high flexibility coupled with good el..
Pot Life	180 min	180 min
Tra-Con Tra-Bond 2158 Heat Conductive Electrically Insulating Compound TRA-BOND 2158 is a flexible, thermal conductive epoxy system. It is used for staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards..
Pot Life	180 min	180 min
Tra-Con Tra-Bond RO7 Radio Opaque Epoxy Adhesive TRA-BOND RO-7 is a high viscosity epoxy resin system specifically developed for adhesive and coating applications where radio opacity is required. It can be used as an X-ray marker on in-vitro medic..
Pot Life	180 min	180 min
Tra-Con Tra-Cast 3143 Fire Retardant Epoxy Casting Compound TRA-CAST 3143 has a low viscosity and long pot life. It is certified to the requirements of UL 94 V-O, and is recommended for rigid potting, laminating, transformer encapsulating, filament winding a..
Pot Life	180 - 240 min	180 - 240 min
Epoxy Technology EPO-TEK® 353ND Black High Temperature Epoxy Product Description: EPO TEK® 353ND Black is a a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applicationsAdvantages & Application Notes: EPO T..
Pot Life	180 min	180 min
Epoxy Technology EPO-TEK® 353ND-T High Temperature Thixotropic Epoxy Product Description: EPO TEK® 353ND-T is a two component, highly thixotropic epoxy with non-flowing properties and high temperature resistance. Advantages & Application Notes: Suitable for fiber op..
Pot Life	180 min	180 min
Epoxy Technology EPO-TEK® 353ND-T1 High Temperature Thixotropic Epoxy Material Description: A two component, thixotropic and high temperature epoxy designed for fiber optic, electronics and medical applications. It is a more viscous alternative to EPO-TEK® 353ND-T.I..
Pot Life	180 min	180 min
Epoxy Technology EPO-TEK® 353ND-T4 Thixotropic Epoxy Product Description: EPO-TEK® 353ND-T4 is a two component, highly thixotropic epoxy with non-flowing properties and high temperature resistance. This is a higher viscosity version of EPO-TEK® 353..
Pot Life	180 min	180 min
Epoxy Technology EPO-TEK® 360ST High Temperature Epoxy Material Description: A two component, high-temperature grade, electrically and thermally insulating epoxy for semiconductor, electronics, fiber optics and medical applications. It is a slightly th..
Pot Life	180 min	180 min
Epoxy Technology EPO-TEK® 430 Epoxy Product Description: A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for interconnecting, grounding ..
Pot Life	180 min	180 min
Epoxy Technology EPO-TEK® 431 Copper Filled Epoxy A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for interconnecting, grounding and EMI RF shielding...
Pot Life	180 min	180 min
Epoxy Technology EPO-TEK® OE100-T High Temperature Epoxy Material Description: A two component, high Tg, high temperature grade epoxy designed for semiconductor, underfill, hard-disk drive and hybrid micro-electronics packaging applications. The epoxy ca..
Pot Life	180 - 240 min	180 - 240 min
Abatron AboSeal 8104-11 Polysulfide, Thixotropic Sealant and Caulk AboSeal 8104-11 is a 2-part, 100% solids, thixotropic polysulfide. It only comes in black. It is a standard for ships and aircraft. It is also excellent for architectural and industrial uses and hea..
Pot Life	180 min @Temperature 25.0 °C	180 min @Temperature 77.0 °F	200 g
Abatron AboCast 8110-1/AboCure 8110-2 Flexible Epoxy This epoxy system can achieve flexibility and plasticity without sacrificing adhesive, electrical, structural, and other properties. This compound is a clear (unfilled) basic formulation. Its applic..
Pot Life	180 min @Temperature 25.0 °C	180 min @Temperature 77.0 °F	200 g
Abatron AboCast 8110-9/AboCure 50-1 Flexible Epoxy This epoxy system can achieve flexibility and plasticity without sacrificing adhesive, electrical, structural, and other properties. This compound is a clear (unfilled) basic formulation. Its applic..
Pot Life	180 min @Temperature 24.0 °C	180 min @Temperature 75.2 °F	1 lb. mass
BCC Products BC 7136-2 Epoxy Casting BC7136-2 is an aluminum filled thick section casting system with heat resistance to 300ºF. May be cast to a thickness of 2 inches in non-conductive molds, 3 inches in conductive molds and thicker s..
Pot Life	180 min	180 min
Abatron AboCast 50-3/AboCure 50-3 Clear Epoxy Adhesive and Casting Compound AboCast 50-3 is a medium viscosity, clear Epoxy Resin. AboCure 50-3 is clear-amber in color, room-temperature-cure, and slow. It has variable ratios and low viscosity. AboCast 50-3/AboCure 50-3 is u..
Pot Life	180 min	180 min
Henkel Hysol EA 9380 Paste Adhesive System Cures at low temperature. Offers strength, toughness and high temperature resistance of heat-curing film adhesives, with greater flexibility and ease of use. Can be applied to large parts with contr..