Polymer Property : Viscosity = 8000 cP Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Viscosity	8000 cP @Temperature 190 °C	8000 cP @Temperature 374 °F	melt viscosity; ASTM D 3236
REXtac Rextac® RT 2280 Amorphous Polyalphaolefin (APAO) Adhesive and Sealant Grade.Description: Ethylene copolymer and FDA compliantFeatures: Good heat resistance and flexibility, short open time, and high viscosityApplications: Component of hot melt adh..
Viscosity	8000 - 800000 cP @Temperature 230 - 270 °C	8000 - 800000 cP @Temperature 446 - 518 °F	Average value: 187000 cP Grade Count:2
Overview of materials for Polybutylene Terephthalate (PBT), Unreinforced, Molded This property data is a summary of similar materials in the MatWeb database for the category "Polybutylene Terephthalate (PBT), Unreinforced, Molded". Each property range of values reported is minim..
Viscosity	8000 cP	8000 cP	Part A
TSE Industries EcoSPRAY® 350c Flame-Retardant Polyurethane Resin TSE-EcoSPRAY® 350c is an “Environmentally-Preferred Product” or EPP. It is a Thixotropic flame retardant polyurethane resin free of Styrene, and is an “ultra-low” emitting resin during applica..
Viscosity	8000 cP @Shear Rate 230 1/s, Temperature 25.0 Â°C	8000 cP @Shear Rate 230 1/s, Temperature 77.0 Â°F	Haake Viscosity
Gwent Electronic Materials C2050503D1 Curable Carbon Ink This product is based on a unique curing process that results in the low temperature formation of a thermosetting conductive coating that combines good adhesion with excellent chemical, solvent and ..
Viscosity	8000 - 10000 cP @Shear Rate 50.0 1/s, Temperature 25.0 Â°C	8000 - 10000 cP @Shear Rate 50.0 1/s, Temperature 77.0 Â°F	Haake VT 550 PK1.1Â°
Gwent Electronic Materials C2070920D1 Depolymerisable Carbon Ink This product is designed as a screen printable ink. This product is based on a thermoplastic resin system designed to burn out completely during firing to leave a void of specific shape and dimensi..
Viscosity	8000 - 15000 cP @Temperature 40.0 Â°C	8000 - 15000 cP @Temperature 104 Â°F
Taiwan PU Corporation PPG CPU-2095 Polyurethane Casting Elastomer A urethane elastomer that can be cured by reacting with a polyamine or a polyolhardener. The molding process is composed of pre-heating, degassing, maxing with a hardener, pouring into the mold, cu..
Viscosity	8000 - 12000 cP	8000 - 12000 cP
Solvay SIPOMERÂ® PAM-300 Phosphate Esters of Ppg Monoacrylate Description: Sipomer PAM-200 incorporated into acrylic resin systems improves adhesion to metallic substrates and glass. Due to its versatile compatibility characteristics with various common solven..
Viscosity	8000 - 10000 cP @Temperature 23.0 °C	8000 - 10000 cP @Temperature 73.4 °F
Master Bond EP50-1.5 Fast Setting, Fast Curing Two Component Epoxy Adhesive Master Bond Polymer Adhesive EP50-1.5 is an exceptionally fast setting, fast curing two component epoxy. EP50-1.5, for general purpose bonding, is formulated to cure at room temperature with a one-t..
Viscosity	8000 - 10000 cP @Temperature 23.0 °C	8000 - 10000 cP @Temperature 73.4 °F
Master Bond EP62-1 High Glass Transition Temperature Epoxy System Master Bond EP62-1 is a two component epoxy system that has an exceptionally long working life at ambient temperatures and cures rapidly at moderately elevated temperatures. The cured epoxy resin ex..
Viscosity	8000 cP @Temperature 23.0 °C	8000 cP @Temperature 73.4 °F
Master Bond UV14-3 Flexible, UV Curable Adhesive System Master Bond UV14-3 is a one component, flexible, UV curable polymer system for bonding, sealing and coating with the convenient feature of being readily removable by most conventional solvents. It i..
Viscosity	8000 cP	8000 cP	Severs, 100 psig aged 2 hrs, See note 1; SPI-VD-T2
Formosa Plastics Formolon® 1071 PVC PVC Homopolymer Dispersion Resin F-1071 is a high molecular weight, fine particle size PVC homopolymer dispersion resin with low surfactant content. The high molecular weight results in product with..
Viscosity	8000 cP	8000 cP	Severs, 100 psig aged 2 hrs, See note 1; SPI-VD-T2
Formosa Plastics Formolon® KVF PVC PVC Homopolymer Dispersion Resin F-KVF is a medium molecular weight, fine particle PVC homopolymer dispersion which imparts pesudoplastic flow to plastisol in which it is used. Plastisol prepared ut..
Viscosity	8000 cP	8000 cP	Severs, 100 psig aged 2 hrs, See note 1; SPI-VD-T2
Formosa Plastics Formolon® NVW PVC PVC Homopolymer Dispersion Resin F-NVW is a high molecular weight PVC homopolymer dispersion resin with low residual surfactant content. Plastisols containing F-NVW exhibit low paste viscosities and..
Viscosity	8000 - 10000 cP	8000 - 10000 cP	mixed compound
Master Bond EP41SMed Two Component, Low Viscosity, USP Class VI Epoxy System Master Bond Polymer Adhesive EP41S Medical is a two component low viscosity epoxy resin system for high performance bonding, sealing, coating, as well as small encapsulations, pottings and castings...
Viscosity	8000 - 10000 cP @Temperature 23.0 °C	8000 - 10000 cP @Temperature 73.4 °F
Master Bond UV15TK High Temperature Resistant One Component UV Curable System Master Bond UV15TK is a moderate viscosity, epoxy based UV curable system for bonding, sealing and coating. It is 100% reactive and does not contain any solvents or other volatiles. It is also compl..
Viscosity	8000 cP	8000 cP	Severs, 100 psig aged 2 hrs, See note 1; SPI-VD-T2
Formosa Plastics Formolon® 10 PVC PVC Homopolymer Dispersion Resin F-10 is a medium molecular weight PVC homopolymer dispersion resin with low residual surfactant content. Plastisol prepared using F-10 exhibit low paste viscosity as..
Viscosity	8000 cP @Temperature 25.0 °C	8000 cP @Temperature 77.0 °F
Abatron AboCast/AboCure 50-24/8501-4 High Temperature Resistant Epoxy Clear amber, low viscosity, structural/dielectric epoxy with high temperature resistance.Suggested Uses: Casting, bonding, potting, encapsulation of electric, structural and industrial components to..
Viscosity	8000 cP	8000 cP	A Component; ASTM D1824
Aptek 2100-A/B Urethane Encapsulant and/or Potting Compound General purpose encapsulant and potting compound. Outstanding hydrolytic stability. Excellent adhesion to components/circuit boards. Low modulus, low stress. Field proven for military and space appl..
Viscosity	8000 - 14000 cP	8000 - 14000 cP	Accelerator
3M Scotch-Weld™ DP420 Off-White Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive are high performance, two-part epoxy adhesives offering outstanding shear and peel adhesion, and very high levels of durability.Information provided by 3M
Viscosity	8000 - 14000 cP	8000 - 14000 cP	Accelerator
3M Scotch-Weld™ DP460 NS Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive DP460 Off-White and DP460 NS are high performance, two-part epoxy adhesives offering outstanding shear and peel adhesion and very high levels of durability.Informat..
Viscosity	8000 - 14000 cP	8000 - 14000 cP	Accelerator
3M Scotch-Weld™ DP460 Off-White Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive DP460 Off-White and DP460 NS are high performance, two-part epoxy adhesives offering outstanding shear and peel adhesion and very high levels of durability.Informat..
Viscosity	8000 - 14000 cP	8000 - 14000 cP
Beijing Ranger Chem 164 Liquid Epoxy Resin Information provided by Beijing Ranger Chemical Co.
Viscosity	8000 - 14000 cP	8000 - 14000 cP	Accelerator
3M Scotch-Weld™ DP420 LH Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive are high performance, two-part epoxy adhesives offering outstanding shear and peel adhesion, and very high levels of durability.Information provided by 3M
Viscosity	8000 cP	8000 cP	Part A, RVT, #5, 20 rpm; TM R050-12
Resinlab® EP1195 Flame Retardant Epoxy Casting Resin Resinlab™ EP1195 is a low viscosity, fast gelling, flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Laboratories Inc., (File # E1..
Viscosity	8000 cP @Temperature 190 °C	8000 cP @Temperature 374 °F	melt viscosity; ASTM D 3236
REXtac Rextac® RT 2780 Amorphous Polyalphaolefin (APAO) Adhesive and Sealant Grade.Description: Butene-1 copolymer and FDA compliantFeatures: Very low softening point, medium viscosity, good tack, and very long open timeApplications: Component of hot mel..