| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Viscosity |
8000
cP @Temperature 190 °C |
8000
cP @Temperature 374 °F |
melt viscosity; ASTM D 3236 |
|
REXtac Rextac® RT 2280 Amorphous Polyalphaolefin (APAO)
Adhesive and Sealant Grade.Description: Ethylene copolymer and FDA compliantFeatures: Good heat resistance and flexibility, short open time, and high viscosityApplications: Component of hot melt adh..
|
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| Viscosity |
8000
cP @Temperature 190 °C |
8000
cP @Temperature 374 °F |
melt viscosity; ASTM D 3236 |
|
REXtac Rextac® RT 3280 Amorphous Polyalphaolefin (APAO)
Modified Bitumen Roofing Grade.Description: Ethylene copolymer and FDA compliantFeatures: Temperature resistance, high melt viscosity, and hardnessApplications: Component of modified bitumen roofing..
|
|||
| Viscosity |
8000
-
15000
cP @Temperature 25.0 °C |
8000
-
15000
cP @Temperature 77.0 °F |
|
|
Northstar Polymers MPA-026 Isocyanate Prepolymer
Information provided by Northstar Polymers.
|
|||
| Viscosity |
8000
cP @Temperature 190 °C |
8000
cP @Temperature 374 °F |
melt viscosity; ASTM D 3236 |
|
REXtac Rextac® RT 2180 Amorphous Polyalphaolefin (APAO)
Adhesive and Sealant Grade.Description: Propylene homopolymer and FDA compliantFeatures: High softening point, short open time, good cohesive strength, and high viscosityApplications: Component of h..
|
|||
| Viscosity |
8000
-
16000
cP @Temperature 175 °C |
8000
-
16000
cP @Temperature 347 °F |
Automatic orifice Viscosity |
|
Cookson Group Plaskon® 3400 Epoxy Molding Compound
(discontinued **)
Test specimens were transfer molded and post cured 4 hours at 175°C.A reduced-stress epoxy molding compound for the encapsulation of a variety of semiconductor devices ranging from small lead count..
|
|||
| Viscosity | 8000 - 20000 cP | 8000 - 20000 cP | |
|
Huntsman Araldite XU 3903 Water-Based Adhesive/Coating
Base Resin is GT 7013 (Type 3). Mean Particle Size
|
|||
| Viscosity |
8000
-
10000
cP @Shear Rate 50.0 1/s, Temperature 25.0 °C |
8000
-
10000
cP @Shear Rate 50.0 1/s, Temperature 77.0 °F |
Haake VT 550 PK1.1° |
|
Gwent Electronic Materials C2070920D1 Depolymerisable Carbon Ink
This product is designed as a screen printable ink. This product is based on a thermoplastic resin system designed to burn out completely during firing to leave a void of specific shape and dimensi..
|
|||
| Viscosity |
8000
cP @Shear Rate 10994 1/s, Temperature 210 °C |
8000
cP @Shear Rate 10994 1/s, Temperature 410 °F |
ASTM D3835 |
|
STAR Thermoplastic Alloys & Rubbers StarFlex® P 7370-1000 TPE
Product Description: StarFlex P 7370-1000 is an easy processing TPE designed for injection molding Features:Soft TouchRubbery FeelExcellent ColorabilityGood WeatherabilityFDA and medical grades avai..
|
|||
| Viscosity |
8000
cP @Shear Rate 10994 1/s, Temperature 210 °C |
8000
cP @Shear Rate 10994 1/s, Temperature 410 °F |
ASTM D3835 |
|
STAR Thermoplastic Alloys & Rubbers StarFlex® P 7370-9000 TPE
Product Description: StarFlex P 7370-9000 is an easy processing TPE designed for injection molding Features:Soft TouchRubbery FeelGood WeatherabilityFDA and medical grades availableProcessing Method..
|
|||
| Viscosity | 8000 - 12000 cP | 8000 - 12000 cP | |
|
Solvay SIPOMER® PAM-300 Phosphate Esters of Ppg Monoacrylate
Description: Sipomer PAM-200 incorporated into acrylic resin systems improves adhesion to metallic substrates and glass. Due to its versatile compatibility characteristics with various common solven..
|
|||
| Viscosity | 8000 - 10000 cP | 8000 - 10000 cP | Part B |
|
Master Bond EP65HT Fast Setting Epoxy Resists High Temperatures
Description: Master Bond EP65HT represents a highly innovative advance in epoxy technology in that it features the unusual combination of very fast cures and high temperature resistance. While typic..
|
|||
| Viscosity | 8000 cP | 8000 cP | Severs, 100 psig aged 2 hrs, See note 1; SPI-VD-T2 |
|
Formosa Plastics Formolon® NVW PVC
PVC Homopolymer Dispersion Resin F-NVW is a high molecular weight PVC homopolymer dispersion resin with low residual surfactant content. Plastisols containing F-NVW exhibit low paste viscosities and..
|
|||
| Viscosity | 8000 cP | 8000 cP | Mixed |
|
Tra-Con Tra-Bond 342-14T Low Viscosity Room Temperature Cure Epoxy Adhesive
TRA-BOND 342-14T single component, low viscosity alumina-filled epoxy adhesive exhibits high bond strength and excellent thermal shock characteristics. This adhesive may be cured at room temperature..
|
|||
| Viscosity |
8000
-
10000
cP @Temperature 23.0 °C |
8000
-
10000
cP @Temperature 73.4 °F |
|
|
Master Bond UV15TK High Temperature Resistant One Component UV Curable System
Master Bond UV15TK is a moderate viscosity, epoxy based UV curable system for bonding, sealing and coating. It is 100% reactive and does not contain any solvents or other volatiles. It is also compl..
|
|||
| Viscosity | 8000 cP | 8000 cP | Severs, 100 psig aged 2 hrs, See note 1; SPI-VD-T2 |
|
Formosa Plastics Formolon® 10 PVC
PVC Homopolymer Dispersion Resin F-10 is a medium molecular weight PVC homopolymer dispersion resin with low residual surfactant content. Plastisol prepared using F-10 exhibit low paste viscosity as..
|
|||
| Viscosity | 8000 cP | 8000 cP | |
|
Trelleborg Emerson & Cuming Stycast® 2651-40FR/9 Two-Component Epoxy Flame Retardant Encapsulant
Features and Typical ApplicationsProvide flame resistance down to 1/8 of an inch. These products also offer various other features such as thermal shock protection, low viscosity, and thermal conduc..
|
|||
| Viscosity | 8000 - 14000 cP | 8000 - 14000 cP | Accelerator |
|
3M Scotch-Weld™ DP420 Off-White Epoxy Adhesive
3M™ Scotch-Weld™ Epoxy Adhesive are high performance, two-part epoxy adhesives offering outstanding shear and peel adhesion, and very high levels of durability.Information provided by 3M
|
|||
| Viscosity | 8000 - 14000 cP | 8000 - 14000 cP | Accelerator |
|
3M Scotch-Weld™ DP460 Off-White Epoxy Adhesive
3M™ Scotch-Weld™ Epoxy Adhesive DP460 Off-White and DP460 NS are high performance, two-part epoxy adhesives offering outstanding shear and peel adhesion and very high levels of durability.Informat..
|
|||
| Viscosity | 8000 - 14000 cP | 8000 - 14000 cP | |
|
Beijing Ranger Chem 164 Liquid Epoxy Resin
Information provided by Beijing Ranger Chemical Co.
|
|||
| Viscosity | 8000 - 12000 cP | 8000 - 12000 cP | |
|
Beijing Ranger Chem SM-827 Liquid Epoxy Resin
Information provided by Beijing Ranger Chemical Co.
|
|||
| Viscosity | 8000 - 12000 cP | 8000 - 12000 cP | |
|
Beijing Ranger Chem SM-827H Liquid Epoxy Resin
Information provided by Beijing Ranger Chemical Co.
|
|||
| Viscosity | 8000 - 14000 cP | 8000 - 14000 cP | Accelerator |
|
3M Scotch-Weld™ DP420 LH Epoxy Adhesive
3M™ Scotch-Weld™ Epoxy Adhesive are high performance, two-part epoxy adhesives offering outstanding shear and peel adhesion, and very high levels of durability.Information provided by 3M
|
|||
| Viscosity | 8000 - 14000 cP | 8000 - 14000 cP | Accelerator |
|
3M Scotch-Weld™ DP420 NS Black Epoxy Adhesive
3M™ Scotch-Weld™ Epoxy Adhesive are high performance, two-part epoxy adhesives offering outstanding shear and peel adhesion, and very high levels of durability.Information provided by 3M
|
|||
| Viscosity | 8000 cP | 8000 cP | Part A, RVT, #5, 20 rpm; TM R050-12 |
|
Resinlab® EP1195 Flame Retardant Epoxy Casting Resin
Resinlab™ EP1195 is a low viscosity, fast gelling, flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Laboratories Inc., (File # E1..
|
|||
| Viscosity | 8000 cP | 8000 cP | Part A, RVT, #6, 20 rpm; TM R050-12 |
|
Resinlab® EP1200LV Casting Resin
Resinlab™ EP1200LV a low viscosity version of EP1200, a highly filled, medium viscosity black casting resin designed for applications requiring a high degree of thermal conductivity, flexibility an..
|
|||
| Viscosity | 8000 cP | 8000 cP | Mixed; TM R050-12 |
|
Resinlab® EP965SC-7 Black Unfilled Electronic Grade Epoxy Encapsulant
Resinlab™ EP965SC-7 Black is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wett..
|
|||
| Viscosity | 8000 cP | 8000 cP | Mixed; TM R050-12 |
|
Resinlab® EP965SC-7 Clear Unfilled Electronic Grade Epoxy Encapsulant
Resinlab™ EP965SC-7 Clear is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wett..
|
|||
| Viscosity | 8000 cP | 8000 cP | Severs, 100 psig aged 2 hrs, See note 1; SPI-VD-T2 |
|
Formosa Plastics Formolon® NVA PVC
PVC Homopolymer Dispersion Resin F-NVA is a high molecular weight PVC homopolymer dispersion resin with low residual surfactant content. Plastisols containing F-NVA exhibit low paste viscosities and..
|
|||