Polymer Property : Viscosity = 8000 cP Product List

Physical Properties

Tips: 30 items are displayed at most.

Physical Properties	Metric	English	Comments
Viscosity	8000 cP @Temperature 190 °C	8000 cP @Temperature 374 °F	melt viscosity; ASTM D 3236
REXtac Rextac® RT 2280 Amorphous Polyalphaolefin (APAO) Adhesive and Sealant Grade.Description: Ethylene copolymer and FDA compliantFeatures: Good heat resistance and flexibility, short open time, and high viscosityApplications: Component of hot melt adh..
Viscosity	8000 - 16000 cP @Temperature 175 °C	8000 - 16000 cP @Temperature 347 °F	Automatic orifice Viscosity
Cookson Group Plaskon® 3400 Epoxy Molding Compound  (discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A reduced-stress epoxy molding compound for the encapsulation of a variety of semiconductor devices ranging from small lead count..
Viscosity	8000 - 12000 cP	8000 - 12000 cP
Huntsman HY 825 US Polyamide Approx. H+ equivalent weight 100. Mix Ratio with GY 6010 is 81.Comments/Applications: Solvent free, moderate molecular weight and amine content. Good adhesion, tough. Adhesives, casting, caulkin..
Viscosity	8000 cP	8000 cP	Mixed Viscosity
ITW Devcon 2 TonÂ® Epoxy Clear Epoxy, Clear, White Information provided by ITW Devcon
Viscosity	8000 cP @Shear Rate 230 1/s, Temperature 25.0 Â°C	8000 cP @Shear Rate 230 1/s, Temperature 77.0 Â°F	Haake Viscosity
Gwent Electronic Materials C2050503D1 Curable Carbon Ink This product is based on a unique curing process that results in the low temperature formation of a thermosetting conductive coating that combines good adhesion with excellent chemical, solvent and ..
Viscosity	8000 - 10000 cP @Shear Rate 50.0 1/s, Temperature 25.0 Â°C	8000 - 10000 cP @Shear Rate 50.0 1/s, Temperature 77.0 Â°F	Haake VT 550 PK1.1Â°
Gwent Electronic Materials C2070920D1 Depolymerisable Carbon Ink This product is designed as a screen printable ink. This product is based on a thermoplastic resin system designed to burn out completely during firing to leave a void of specific shape and dimensi..
Viscosity	8000 - 10500 cP @Shear Rate 230 1/s, Temperature 25.0 Â°C	8000 - 10500 cP @Shear Rate 230 1/s, Temperature 77.0 Â°F	Haake VT 550 PK1.1Â°
Gwent Electronic Materials C2090819P2 Silver Ink This product is part of a range of Heat Curable Inks designed specifically for use in Photovoltaic panels. These products are based on a unique curing process that results in the low temperature fo..
Viscosity	8000 - 12000 cP	8000 - 12000 cP
Solvay SIPOMERÂ® PAM-300 Phosphate Esters of Ppg Monoacrylate Description: Sipomer PAM-200 incorporated into acrylic resin systems improves adhesion to metallic substrates and glass. Due to its versatile compatibility characteristics with various common solven..
Viscosity	8000 - 10000 cP @Temperature 23.0 °C	8000 - 10000 cP @Temperature 73.4 °F
Master Bond EP62-1 High Glass Transition Temperature Epoxy System Master Bond EP62-1 is a two component epoxy system that has an exceptionally long working life at ambient temperatures and cures rapidly at moderately elevated temperatures. The cured epoxy resin ex..
Viscosity	8000 cP @Temperature 23.0 °C	8000 cP @Temperature 73.4 °F
Master Bond UV14-3 Flexible, UV Curable Adhesive System Master Bond UV14-3 is a one component, flexible, UV curable polymer system for bonding, sealing and coating with the convenient feature of being readily removable by most conventional solvents. It i..
Viscosity	8000 cP	8000 cP	Severs, 100 psig aged 2 hrs, See note 1; SPI-VD-T2
Formosa Plastics Formolon® 1071 PVC PVC Homopolymer Dispersion Resin F-1071 is a high molecular weight, fine particle size PVC homopolymer dispersion resin with low surfactant content. The high molecular weight results in product with..
Viscosity	8000 cP	8000 cP	Severs, 100 psig aged 2 hrs, See note 1; SPI-VD-T2
Formosa Plastics Formolon® NVW PVC PVC Homopolymer Dispersion Resin F-NVW is a high molecular weight PVC homopolymer dispersion resin with low residual surfactant content. Plastisols containing F-NVW exhibit low paste viscosities and..
Viscosity	8000 - 90000 cP	8000 - 90000 cP
Master Bond EP41S Fast Curing Epoxy Features Chemical Resistance Description: Master Bond EP41S is a two component epoxy resin compound for durable, high performance, tough, high strength coatings, liners and sealants with outstanding resistance to organic solven..
Viscosity	8000 - 10000 cP	8000 - 10000 cP	mixed compound
Master Bond EP41SMed Two Component, Low Viscosity, USP Class VI Epoxy System Master Bond Polymer Adhesive EP41S Medical is a two component low viscosity epoxy resin system for high performance bonding, sealing, coating, as well as small encapsulations, pottings and castings...
Viscosity	8000 - 12000 cP @Temperature 23.0 °C	8000 - 12000 cP @Temperature 73.4 °F	20 rpm
Epoxy Technology EPO-TEK® P1011 Electrically Conductive Modified Polyimide Product Description: EPO-TEK® P-1011 is a single component, modified polyimide, silver-filled adhesive designed for chip bonding in microelectronic and optoelectronic applications.Advantages & Appl..
Viscosity	8000 cP @Temperature 25.0 °C	8000 cP @Temperature 77.0 °F
Abatron AboCast/AboCure 50-24/8501-4 High Temperature Resistant Epoxy Clear amber, low viscosity, structural/dielectric epoxy with high temperature resistance.Suggested Uses: Casting, bonding, potting, encapsulation of electric, structural and industrial components to..
Viscosity	8000 - 12000 cP	8000 - 12000 cP
Beijing Ranger Chem SM-827 Liquid Epoxy Resin Information provided by Beijing Ranger Chemical Co.
Viscosity	8000 - 15000 cP	8000 - 15000 cP
Beijing Ranger Chem SM-601RX75 Solvent Based Epoxy Resin Information provided by Beijing Ranger Chemical Co.
Viscosity	8000 - 14000 cP	8000 - 14000 cP	Accelerator
3M Scotch-Weld™ DP405 Black Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive DP405 LH is a two-part, 2:1 mix ratio, toughened epoxy structural adhesive which has a 5 minute work life and accelerated cure. It exhibits excellent shear and peel..
Viscosity	8000 cP	8000 cP	Part A, RVT, #6, 20 rpm; TM R050-12
Resinlab® EP1200LV Casting Resin Resinlab™ EP1200LV a low viscosity version of EP1200, a highly filled, medium viscosity black casting resin designed for applications requiring a high degree of thermal conductivity, flexibility an..
Viscosity	8000 cP	8000 cP	Mixed; TM R050-12
Resinlab® EP965SC-7 Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965SC-7 Black is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wett..
Viscosity	8000 - 11000 cP	8000 - 11000 cP
Beijing Ranger Chem HY-127 Liquid Epoxy Resin Information provided by Beijing Ranger Chemical Co.
Viscosity	8000 cP	8000 cP	Mixed; TM R050-12
Resinlab® EP1240RC Flame Retardant Epoxy Casting Resin Resinlab™ EP1240RC is a medium viscosity, flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Laboratories Inc., (File# E186034, Pro..
Viscosity	8000 cP @Temperature 190 °C	8000 cP @Temperature 374 °F	melt viscosity; ASTM D 3236
REXtac Rextac® RT 2780 Amorphous Polyalphaolefin (APAO) Adhesive and Sealant Grade.Description: Butene-1 copolymer and FDA compliantFeatures: Very low softening point, medium viscosity, good tack, and very long open timeApplications: Component of hot mel..