Polymer Property : Flexural Modulus = 1170 ksi Product List

Mechanical Properties

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Mechanical Properties	Metric	English	Comments
Flexural Modulus	8.07 GPa	1170 ksi	ASTM D790
Owens Corning Glass Fiber Reinforced Polyester (PBT), 30 wt.% glass Thermoplastic Polyesters are resistant to most organic solvents, weak acids and alkalis. They are not recommended with strong acids and alkalis or for prolonged use in hot water. Data provided by t..
Flexural Modulus	8.10 GPa	1170 ksi	ISO 178
Nilit FRIANYL B63 W-GV35 Nylon 6 for injection molding, 35% glass fiber reinforced Nylon 6 for injection molding, heat stabilized.Information provided by Frisetta Polymer, which merged into Nilit Plastics
Flexural Modulus	8.10 GPa	1170 ksi	ISO 178
Radici Radilon® ARV300 (dry) Nylon 66 30% Glass-fiber reinforcedInformation provided by Radici group.
Flexural Modulus	8.07 GPa <br>@Temperature 100 °C	1170 ksi <br>@Temperature 212 °F	ISO 178
Solvay Specialty Polymers Amodel® AFA-6133 V0 Z Polyphthalamide (PPA)  (Unverified Data**) Amodel AFA-6133 V0 Z is a 33% glass-fiber reinforced, flame retardant grade of polyphthalamide (PPA) resin specifically formulated for connector applications requiring compatibility with both infrar..
Flexural Modulus	8.07 GPa	1170 ksi	ASTM D790
Solvay Specialty Polymers Veradel® AG-230 Polyethersulfone  (discontinued **) For superior long-term performance at high temperatures in severe service environments. It offers especially good toughness, hydrolytic stability, chemical resistance, plus FDA and USDA compliance.N..
Flexural Modulus	8.10 GPa <br>@Temperature 90.0 °C	1170 ksi <br>@Temperature 194 °F	ISO 178, ASTM D790
Nilit Nilamid B3 H G10 50% Glass Fiber Reinforced PA6 Description: Nilamid B3 H G10 is a product that combines outstanding strength and stiffness with good moldability and good impact strength. It is widely used for structural applications.Key characte..
Flexural Modulus	8.04 GPa <br>@Temperature 150 °C	1170 ksi <br>@Temperature 302 °F	ASTM D790
Mitsui AURUM® JGN3030 Thermoplastic Polyimide Resin, Amorphous  (discontinued **) AURUM® is an easy melt, processable and recyclable thermoplastic polyimide resin that provides continuous service temperatures to 465° F in its amorphous state and up to 550° F when annealed to i..
Flexural Modulus	8.07 - 11.7 GPa	1170 - 1700 ksi	Average value: 10.2 GPa Grade Count:3
Overview of materials for Phenolic, Graphite Cloth Composite This property data is a summary of similar materials in the MatWeb database for the category "Phenolic, Graphite Cloth Composite". Each property range of values reported is minimum and maximum value..
Flexural Modulus	8.10 GPa	1170 ksi	ASTM D790
Plenco Valite 1246-18X Novolac Phenolic, Granular, Injection Molded  (discontinued **) This Valite product has been replaced by Plenco 4246. Data provided by Plenco.VALITE 1246-18X is a black two-stage, medium heat resistant phenolic molding compound. It has excellent electrical, mol..
Flexural Modulus	8.10 GPa	1170 ksi	2 mm/min; ISO 178
SABIC Innovative Plastics LNP Lubricomp JX91055 PES (Europe-Africa-Middle East) LNP* LUBRICOMP* JX91055 is a compound based on Polyethersulfone resin containing Carbon Fiber and Proprietary Lubricant . Added features include Internally Lubricated and Electrically Conductive.Thi..
Flexural Modulus	8.09 GPa	1170 ksi	ASTM D 790
SABIC Innovative Plastics ValoxÂ® 553M PBT+PC (Asia Pacific) This data was supplied by SABIC-IP for the Asia Pacific region.
Flexural Modulus	8.04 GPa	1170 ksi	ASTM D 790
SABIC Innovative Plastics ValoxÂ® PDR4911 PBT (Asia Pacific) This data was supplied by SABIC-IP for the Asia Pacific region.
Flexural Modulus	8.10 GPa	1170 ksi	2 mm/min; ISO 178
SABIC Innovative Plastics LNP Stat-kon ZEL34XXC PPE+PS (Europe-Africa-Middle East) LNP* Stat-kon* ZEL34XXC is a compound based on PPE+PS Blend resin containing Carbon Fiber, PTFE. Added features include : Electrically Conductive , Internally Lubricated.This data was supplied by S..
Flexural Modulus	8.08 GPa	1170 ksi	ASTM D790
SABIC Innovative Plastics LNP THERMOCOMP IX04513C PA 6/12 (Asia Pacific) LNP THERMOCOMP* IX04513C is a compound based on Nylon 6/12 resin containing Glass Fiber. Added features of this material include: Clean Compounding System.
Flexural Modulus	8.04 GPa	1170 ksi	2.8 mm/min; ASTM D790
Samsung Cheil Industries InfinoÂ® GP-5300G PBT, Glass Filled Information provided by Samsung Cheil Industries.
Flexural Modulus	8.09 GPa	1170 ksi	1.3 mm/min, 50 mm span; ASTM D790
SABIC Innovative Plastics LNP THERMOCOMP LF004E PEEK LNP* THERMOCOMP* LF004E is a compound based on Polyetheretherketone resin containing 20% Glass Fiber. Added features of this material include: Easy Molding.
Flexural Modulus	8.04 GPa	1170 ksi	ASTM D790
Samyang TribitÂ® 1500GN30 Polybutylene Terephthalate, 30% Glass Reinforced, Flame Retardant Characteristics:G/F reinforcedFlame retardantHeat and Impact resistantApplications:AutomotiveConnectorGearOutdoor handleIgnition systemElectronicConnectorGas valveCoil bobbinSwitch caseRelay caseO/A..
Flexural Modulus	8.10 GPa	1170 ksi	1.3 mm/min, 50 mm span; ASTM D790
SABIC Innovative Plastics LNP THERMOCOMP RF007H PA 66 LNP* Thermocomp* RF007H is a compound based on Nylon 66 containing glass fiber. Added feature includes: Healthcare.
Flexural Modulus	8.10 GPa	1170 ksi	1.3 mm/min, 50 mm span; ASTM D790
SABIC Innovative Plastics LNP THERMOCOMP RF007SXP PA 66 LNP* THERMOCOMP* RF007SXP is a compound based on Nylon 66 containing 35% Glass Fiber. Added feature of this material includes: Heat Stabilized.
Flexural Modulus	8.04 GPa	1170 ksi	1.3 mm/min, 50 mm span; ASTM D 790
SABIC Innovative Plastics LNP Thermocomp WF006SXC PBT LNP* Thermocomp* WF006SXC is a compound based on PBT containing Glass FIber. Characteristic of this grade is: Heat Stabilized.This data was supplied by SABIC-IP for the Americas region.
Flexural Modulus	8.04 GPa	1170 ksi	ISO 178
SABIC Innovative Plastics LNP STAT-KON DE003ER PC (Asia Pacific) LNP STAT-KON* DE003ER is a compound based on Polycarbonate resin containing Carbon Fiber. Added features of this material include: Easy Molding.
Flexural Modulus	8.10 GPa	1170 ksi	ASTM D790
Plenco 00732 Melamine-Phenolic, Granular, Transfer Molded PLENCO 00732 is a melamine-phenolic copolymer molding compound, exhibiting excellent electrical and flame resistant properties. Type ASTM 5948 CMG, and UL recognized under component file E40654. 007..
Flexural Modulus	8.10 GPa	1170 ksi	ISO 178
Polyram PlusTek RA303G33 Nylon 66 for Injection Molding, 33% Glass Fiber Reinforced, Heat Stabilized, Hydrolysis Resistant 33% Glass fiber reinforced, heat stabilized and hydrolysis resistant Nylon 66 for injection molding applications.Information provided by Polyram.
Flexural Modulus	8.10 GPa	1170 ksi	2 mm/min; ISO 178
Eurostar Starflam RFK517E PA66, Glass/Mineral Fiber Reinforced, Flame Retardant, Injection Molding Starflam RFK517E is a Halogen Free and Red Phosphorous Free, Flame Retardant, Mineral Filled, Glass Fiber Reinforced Polyamide 66 Injection Molding ResinInformation provided by Eurostar.
Flexural Modulus	8.10 GPa	1170 ksi	ASTM D790
A. Schulman ComAlloy Comtuf® 461 Glass Reinforced, Impact Modified, PBT Alloy Data provided by the manufacturer, ComAlloy International Company.30% Glass Reinforced. Superior toughness and impact resistance characterize Comtuf® materialsThe ComAlloy product line has been int..
Flexural Modulus	8.10 GPa	1170 ksi	ASTM D790
A. Schulman ComAlloy Hiloy® 413 Polyester - PBT, Glass Reinforced Data provided by the manufacturer, ComAlloy International Company.33% Glass Reinforced.The ComAlloy product line has been integrated into the A Schulman product line.
Flexural Modulus	8.04 GPa	1170 ksi	ASTM D790
Gromax CCP PBT 3030-200HR 30% Glass Fiber Filled Product Description: A glass fiber 30% reinforced injection molding grade. Characteristics:Excellent electrical property Excellent temperature resistance, high heat distortion temperature Excellent ..
Flexural Modulus	8.07 GPa	1170 ksi	ASTM D790
PolyOne Stat-Tech™ NJ-20CF/000 Black Polyamide 12 (Nylon 12) Stat-Tech™ Electrically Conductive Compounds are specifically engineered to provide anti-static, ESD and RFI/EMI shielding performance for critical electronic equipment applications. These compound..