Thermal Properties | Metric | English | Comments |
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CTE, linear | 27.0 µm/m-°C @Temperature 20.0 °C |
15.0 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
Ravago Manufacturing Americas Hylon® N1013HL Nylon 6/6 (DAM) Information provided by Ravago. |
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CTE, linear | 27.0 µm/m-°C @Temperature -40.0 - 149 °C |
15.0 µin/in-°F @Temperature -40.0 - 300 °F |
ASTM E831 |
Quadrant EPP Semitron® 420 ESd V (ASTM Product Data Sheet) |
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CTE, linear | 27.0 µm/m-°C @Temperature 20.0 °C |
15.0 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
PolyOne Edgetek® AS-30CF/000 UV Acrylonitrile Butadiene Styrene (ABS), Carbon Fiber Reinforced
(discontinued Description/Features:Carbon Fiber ReinforcedUV StabilizedUL 94 HB (HEM TEST)PolyOne First ChoiceInformation provided by PolyOne Corporation. |
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CTE, linear | 27.0 - 31.0 µm/m-°C | 15.0 - 17.2 µin/in-°F | Average value: 28.5 µm/m-°C Grade Count:4 |
Overview of materials for PVC, 20% Glass Fiber Reinforced This property data is a summary of similar materials in the MatWeb database for the category "PVC, 20% Glass Fiber Reinforced". Specific grades with glass content between 15% and 24% are included. E.. |
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CTE, linear | 27.0 µm/m-°C @Temperature 20.0 °C |
15.0 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
Ravago Manufacturing Americas Hylon® N1013L Nylon 6/6 (DAM)
(discontinued **) Information provided by Ravago. |
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CTE, linear | 27.0 µm/m-°C @Temperature 20.0 °C |
15.0 µin/in-°F @Temperature 68.0 °F |
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Indium Corp. Indalloy 155 Tin-Lead Solder Alloy Information Provided by Indium Corporation |
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CTE, linear | 27.0 µm/m-°C @Temperature 20.0 °C |
15.0 µin/in-°F @Temperature 68.0 °F |
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Indium Corp. Indalloy® 205 In-Pb Solder Alloy Indalloy's #7, #10, #150, #204, #205 and #206 comprise a group of lead-indium solders designed to cover the temperature range of 165°C-275°C. All have the minimum gold-leaching characteristics.. |
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CTE, linear | 27.0 µm/m-°C @Temperature 20.0 °C |
15.0 µin/in-°F @Temperature 68.0 °F |
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Indium Corp. Indalloy® 7 In-Pb Solder Alloy Indalloy's #7, #10, #150, #204, #205 and #206 comprise a group of lead-indium solders designed to cover the temperature range of 165°C-275°C. All have the minimum gold-leaching characteristics.. |
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CTE, linear | 27.0 µm/m-°C | 15.0 µin/in-°F | Through Thickness |
GrafTech eGRAF® HITHERM™ HT-2510 Graphite with Polymer Additive Made from natural graphite, eGRAF® HITHERM™ thermal interface materials are designed for use in applications requiring low contact resistance and high thermal conductivity. HITHERM™ mat.. |
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CTE, linear | 27.0 - 45.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
15.0 - 25.0 µin/in-°F @Temperature -22.0 - 86.0 °F |
TMA |
SABIC Innovative Plastics NORYL S100G20 PPE+PS (Asia Pacific) |
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CTE, linear | 27.0 µm/m-°C @Temperature 20.0 °C |
15.0 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
Techmer ES Electrafil® J-50/CF/20/TF/15 Polycarbonate, 20% Carbon Fiber Reinforced, 15% PTFE |
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CTE, linear | 27.0 µm/m-°C @Temperature -30.0 - 100 °C |
15.0 µin/in-°F @Temperature -22.0 - 212 °F |
ASTM D696 |
A. Schulman POLYTROPE™ TPP 615 Olefinic Elastomer DescriptionPolytrope TPP 615 is an olefinic elastomer developed to exhibit very low thermal expansion, high DOI on painted parts with good low temperature impact properties. ApplicationTPP 615 is de.. |
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CTE, linear | 27.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
15.0 µin/in-°F @Temperature -22.0 - 86.0 °F |
3.45 mm/mm; ASTM D696 |
A. Schulman POLYPUR™ FPU 1377 Thermoplastic Polyurethane Compound Information provided by A. Schulman. |
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CTE, linear | 27.0 µm/m-°C @Temperature -30.0 - 100 °C |
15.0 µin/in-°F @Temperature -22.0 - 212 °F |
ASTM D696 |
A. Schulman POLYTROPE™ TPP 615 Olefinic Elastomer DescriptionPolytrope TPP 615 is an olefinic elastomer developed to exhibit very low thermal expansion, high DOI on painted parts with good low temperature impact properties. ApplicationTPP 615 is de.. |
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CTE, linear | 27.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
15.0 µin/in-°F @Temperature -22.0 - 86.0 °F |
2.7 mm/mm; ASTM D696 |
A. Schulman POLYPUR™ FPU 1376 Thermoplastic Polyurethane Compound Information provided by A. Schulman. |
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CTE, linear | 27.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
15.0 µin/in-°F @Temperature -22.0 - 86.0 °F |
2.7 mm/mm; ASTM D696 |
A. Schulman POLYPUR™ FPU 1376 Thermoplastic Polyurethane Compound Information provided by A. Schulman. |
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CTE, linear | 27.0 µm/m-°C @Temperature 20.0 °C |
15.0 µin/in-°F @Temperature 68.0 °F |
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Williams Advanced Alloys WS179 Solder All Williams alloys are available in a variety of shapes and forms, including ribbon, preforms, rod, ring, wire, and custom shapes.Information provided by Williams Advanced Alloys |
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CTE, linear | 27.0 µm/m-°C @Temperature 20.0 °C |
15.0 µin/in-°F @Temperature 68.0 °F |
Longitudinal |
Goodfellow Polyaramid/Polyphenylene Sulfide Composite Sheet or Rod 25% Polyaramid fiber - PPS Matrix. Information provided by Goodfellow. |
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CTE, linear | 27.0 µm/m-°C @Temperature -30.0 - 100 °C |
15.0 µin/in-°F @Temperature -22.0 - 212 °F |
ASTM D696 |
A. Schulman POLYTROPE™ TPP 615 Olefinic Elastomer DescriptionPolytrope TPP 615 is an olefinic elastomer developed to exhibit very low thermal expansion, high DOI on painted parts with good low temperature impact properties. ApplicationTPP 615 is de.. |
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CTE, linear | 27.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
15.0 µin/in-°F @Temperature -22.0 - 86.0 °F |
3.45 mm/mm; ASTM D696 |
A. Schulman POLYPUR™ FPU 1377 Thermoplastic Polyurethane Compound Information provided by A. Schulman. |
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CTE, linear | 27.0 µm/m-°C | 15.0 µin/in-°F | Below Tg |
Epoxy Technology EPO-TEK® N20E Electrically Conductive Paste Product Description: EPO-TEK® N20E is a two component, electrically and thermally conductive, epoxy adhesive designed for semiconductor and electronics assembly. Its applications and field conditi.. |
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CTE, linear | 27.0 µm/m-°C @Temperature 20.0 °C |
15.0 µin/in-°F @Temperature 68.0 °F |
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Aremco Aremco-Bond™ 2210 High Performance Epoxide Aluminum and Ceramic-Filled, Vibration and Impact Resistant, for Repairing Aluminum Mold and Wear Surfaces. |
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CTE, linear | 27.0 µm/m-°C @Temperature 20.0 °C |
15.0 µin/in-°F @Temperature 68.0 °F |
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AIM 62Sn/Pb36/Ag2 Solder for Photonic Packaging Uses include:Fiber to Ferrule SolderingLaser Die AttachHermetic Packaging & SealingWetting & Sealing Laser OpticsThermal ManagementInformation provided by AIM Specialty Materials. |
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CTE, linear | 27.0 µm/m-°C | 15.0 µin/in-°F | ASTM D696 |
Quantum Polycarbonate 20% Glass Fiber Filled Information provided by Quantum Advanced Engineering Plastics |
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CTE, linear | 27.0 µm/m-°C @Temperature -30.0 - 100 °C |
15.0 µin/in-°F @Temperature -22.0 - 212 °F |
ASTM D696 |
A. Schulman POLYTROPE™ TPP 615 Olefinic Elastomer DescriptionPolytrope TPP 615 is an olefinic elastomer developed to exhibit very low thermal expansion, high DOI on painted parts with good low temperature impact properties. ApplicationTPP 615 is de.. |
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CTE, linear | 27.0 µm/m-°C | 15.0 µin/in-°F | DIN 53752 |
Lehmann & Voss LUVOCOM® 1-7233-1 Polyamide 66, with glass fiber, PTFE, lubricant modified, silicone-free Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.Improved friction and wear behaviour. Emergency running property.Strong, stiff parts.Bearings, .. |
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CTE, linear | 27.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
15.0 µin/in-°F @Temperature -22.0 - 86.0 °F |
3.45 mm/mm; ASTM D696 |
A. Schulman POLYPUR™ FPU 1377 Thermoplastic Polyurethane Compound Information provided by A. Schulman. |
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CTE, linear | 27.0 µm/m-°C @Temperature 20.0 °C |
15.0 µin/in-°F @Temperature 68.0 °F |
Z-direction; ASTM D696 |
Premix Premi-Glas® 1285VE 1285 VE Glass Reinforced Vinyl Ester SMC
(discontinued **) Description: Premi-Glas® 1285 VE is a glass reinforced vinyl ester sheet molding compound designed for automotive under the hood applications. Key features and benefits: Designed for compression mo.. |
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CTE, linear | 27.0 - 68.0 µm/m-°C @Temperature 125 - 175 °C |
15.0 - 37.8 µin/in-°F @Temperature 257 - 347 °F |
Average value: 37.4 µm/m-°C Grade Count:5 |
Overview of materials for Polyimide, Thermoset Film This property data is a summary of similar materials in the MatWeb database for the category "Polyimide, Thermoset Film". Each property range of values reported is minimum and maximum values of appr.. |
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CTE, linear | 27.0 - 68.0 µm/m-°C @Thickness 1.00 - 1.00 mm |
15.0 - 37.8 µin/in-°F @Thickness 0.0394 - 0.0394 in |
Average value: 37.4 µm/m-°C Grade Count:5 |
Overview of materials for Polyimide, Thermoset Film This property data is a summary of similar materials in the MatWeb database for the category "Polyimide, Thermoset Film". Each property range of values reported is minimum and maximum values of appr.. |