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Polymer Property : Cure Time = 30.0 min Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 30.0 min @Temperature 140 °C |
0.500 hour @Temperature 284 °F |
Tack Free Time |
| Parker Chomerics CHOFORM® 5513 Conductive Form-in-Place Gasket Description: A range of conductive particle technologies combined with thermoset and RTV silicone systems provide a material selection for most opportunities. Multiple filler grades balance material.. |
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| Cure Time | 30.0 min @Temperature 85.0 °C |
0.500 hour @Temperature 185 °F |
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| Parker Chomerics CHO-FORM® 5518 Robotically Dispensed Gasketing Description: CHO-FORM® 5518 Two-component, thermal cure silicone system with Ag/Cu particle filler. Minimum cure temperature is only 85°C (185°F). Formulated for painted, plated or metalized plas.. |
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| Cure Time | 30.0 min @Temperature 70.0 °C |
0.500 hour @Temperature 158 °F |
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| Parker Chomerics THERM-A-FORM T642 Cure-in-Place Potting and Underfill Material Description: THERM-A-FORM™ thermally conductive silicone elastomer products are dispensable form-in-place compounds designed for heat transfer without excessive compressive force in electronics co.. |
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| Cure Time | 30.0 min @Temperature 23.0 °C |
0.500 hour @Temperature 73.4 °F |
Brass, working strength |
| Permabond HL126 Anaerobic Threadlocker PERMABOND® HL126 Threadlocker is a water thin product for locking pre-assembled parts through wicking action. PERMABOND® HL126 Threadlocker prevents vibration loosening. Because of the low viscosi.. |
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| Cure Time | 30.0 min @Temperature 23.0 °C |
0.500 hour @Temperature 73.4 °F |
Stainless steel, handling strength |
| Permabond HM162 Anaerobic Retainer Permabond® HM162 is a medium viscosity retaining compound that cures when confined between metal parts to form an extremely tough bond. It is best suited for cylindrical parts and where high temper.. |
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| Cure Time | 30.0 min @Temperature 180 °C |
0.500 hour @Temperature 356 °F |
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| Gwent Electronic Materials C2030701D3 Solderable Silver Ink This product is based on a unique curing process that results in the low temperature formation of a thermosetting conductive adhesive that combines good adhesion and electrical conductivity with che.. |
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| Cure Time | 30.0 min @Temperature 80.0 °C |
0.500 hour @Temperature 176 °F |
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| Gwent Electronic Materials C2050804D9 Platinum Polymer Ink Platinum Ink is a screen printable ink designed for printing working electrodes in electrochemical sensor applications. The ink is designed for curing on polymer substrates. Screen Printing Equipme.. |
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| Cure Time | 30.0 min @Temperature 60.0 °C |
0.500 hour @Temperature 140 °F |
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| Gwent Electronic Materials C2070424P2 Carbon Graphite Ink This Carbon Graphite Ink is designed to be used for screen printing working electrodes. These electrodes when used in conjunction with specific oxidase type enzymes, enable the detection of many ana.. |
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| Cure Time | 30.0 min @Temperature 60.0 °C |
0.500 hour @Temperature 140 °F |
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| Gwent Electronic Materials C2000511D1 Platinized Carbon Ink Platinised Carbon Ink is designed to be used for screen printing working electrodes. It has been optimized to give superior electrochemical performance and designed to be used for printing working e.. |
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| Cure Time | 30.0 min @Temperature 120 °C |
0.500 hour @Temperature 248 °F |
|
| Tra-Con Supertherm 826M01 High Performance Diamond Epoxy Adhesive SUPERTHERM 826M01 is a one-part, smooth paste ULTRA HIGH THERMALLY CONDUCTIVE diamond filled epoxy adhesive recommended for semiconductor die-attach and other micro-electronic applications where the.. |
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| Cure Time | 30.0 min @Temperature 150 °C |
0.500 hour @Temperature 302 °F |
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| Tra-Con Tra-Bond 789-3T3N1 Moisture Resistant Adhesive TRA-BOND 789-3T3N1 adhesive is a thixotropic version of TRA-BOND 789-3. It is a one component, high strength, toughened adhesive designed for use in applications which require good moisture resistan.. |
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| Cure Time | 30.0 min @Temperature 150 °C |
0.500 hour @Temperature 302 °F |
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| Tra-Con Tra-Bond F211 General Purpose Fiber Optic Epoxy Adhesive TRA-BOND F211 is a general purpose fiber optic epoxy adhesive recommended for bonding and small volume potting applications where superior wetting and physical properties are needed at both high and.. |
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| Cure Time | 30.0 min @Temperature 125 °C |
0.500 hour @Temperature 257 °F |
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| Tra-Con Tra-Bond Ablebond 868-7U Thixotropic Epoxy Adhesive Ablebond 868-7UNF is the unfilled version of 868-7, a nonsagging, flexible epoxy adhesive. Information provided by Tra-Con Inc. |
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| Cure Time | 30.0 min @Temperature 120 °C |
0.500 hour @Temperature 248 °F |
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| Dow Corning SE 4448 CV KIT PARTS A&B Excellent thermal conductivity, low volatility (D4-D10 0.03% wt), heat cure, high viscosity.Information provided by Dow Corning |
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| Cure Time | 30.0 min @Temperature 100 °C |
0.500 hour @Temperature 212 °F |
minimum |
| Epoxy Technology EPO-TEK® 731 Epoxy Adhesive Material Description: A two component, thixotropic, room temperature-curing epoxy adhesive. It is an electrically and thermally insulating epoxy designed for general applications in semiconductor p.. |
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| Cure Time | 30.0 min @Temperature 150 °C |
0.500 hour @Temperature 302 °F |
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| Epoxyset Epoxibond EB-348 Low Expansion Epoxy Adhesive EB-348 is a highly filled, extremely low expansion, epoxy adhesive. This low out-gassing adhesive exhibits excellent wettability without preheating metal bonding surfaces and has a good dimensional .. |
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| Cure Time | 30.0 - 180 min @Temperature 50.0 - 100 °C |
0.500 - 3.00 hour @Temperature 122 - 212 °F |
Optional |
| Abatron AboWeld 8505-1 A/B Silver-Filled Electrically Conductive Epoxy Compound AboWeld 8505-1 A/B is a solventless silver-epoxy adhesive and resurfacer. It has high rigidity, chemical and heat resistance. It also has good adhesion to most rigid materials. |
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| Cure Time | 30.0 min @Temperature 177 °C |
0.500 hour @Temperature 350 °F |
Recommended Cure Cycle |
| Arlon 30400N085 0.085" Uncured, Unsupported Silicone Rubber on a Kodacel Carrier Design/Construction:Side 1: Uncured, Unsupported Silicone RubberSubstrate: Kodacel CarrierInterleave: 0.003" PolyethyleneThis data represents typical values for the production material and should.. |
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| Cure Time | 30.0 min @Temperature 177 °C |
0.500 hour @Temperature 350 °F |
Recommended Cure Cycle |
| Arlon 30400R040 0.04" Uncured, Unsupported Silicone Rubber on Release Carrier Design/Construction:Side 1: Uncured, Unsupported Silicone RubberSubstrate: Kodacel CarrierInterleave: 0.003" PolyethyleneThis data represents typical values for the production material and should.. |
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| Cure Time | 30.0 min @Temperature 204 °C |
0.500 hour @Temperature 400 °F |
Ramp to Temp; then hold for 4 hours, Recommended Postcure Cycle |
| Arlon 55531R060 0.061" (1.55 mm) Uncured Silicone Rubber with Fiberglass Substrate Design/Construction:Side 1: Uncured Silicone RubberSide 2: Uncured Silicone Rubber Appearance: Red silicone gum on fiberglass clothThis data Represents typical values for the production material. Th.. |
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| Cure Time | 30.0 min @Temperature 93.3 °C |
0.500 hour @Temperature 200 °F |
Step 1, preceeded by >30 min. air set |
| Aremco Aremco-Seal™ 617 High Temperature Glass Coating Glass-filled adhesive/sealer for use with porous ceramics and refractories to 1500 ºF (816 ºC). |
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| Cure Time | 30.0 - 180 min @Temperature 50.0 - 100 °C |
0.500 - 3.00 hour @Temperature 122 - 212 °F |
Optional |
| Abatron 8509-2A/8509-1B Carbon-Filled Electrically Conductive Epoxy Compound 8509-2A/8509-1B is a solventless carbon-epoxy system used as an adhesive and silk-screening material with anti-static and other lower-conductivity requirements. |
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| Cure Time | 30.0 min @Temperature 75.0 °C |
0.500 hour @Temperature 167 °F |
Dust Free, at 50% humidity |
| Blue River Coatings Hydro-Gloss 2-Part Polyurethane Top Coat BLUE RIVER COATINGS HYDRO-GLOSS 2-PART POLYURETHANE TOPCOAT is a water dispersible polyisocyanate coating. HYDRO-GLOSS provides outstanding coverage, excellent durability, and ease of application as.. |
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| Cure Time | 30.0 min @Temperature 177 °C |
0.500 hour @Temperature 350 °F |
Recommended Cure Cycle |
| Arlon 30850S085 0.085" Uncured, Unsupported Silicone Rubber on Release Carrier Design/Construction:Side 1: Uncured, Unsupported Silicone RubberSubstrate: Kodacel CarrierInterleave: 0.003" PolyethyleneThis data represents typical values for the production material and should.. |
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