| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time |
30.0
min @Temperature 23.0 °C |
0.500
hour @Temperature 73.4 °F |
Brass, working strength |
|
Permabond HM118 Anaerobic Threadlocker
Permabond® HM118 Threadlocker is an excellent general-purpose threadlocker and sealant. It is used for locking bolts, nuts and screws that require permanent assembly. Cure is fast and reliable on s..
|
|||
| Cure Time |
30.0
min @Temperature 23.0 °C |
0.500
hour @Temperature 73.4 °F |
Brass, working strength |
|
Permabond HM165 Anaerobic Retainer
Permabond® HM165 is a high viscosity anaerobic retaining compound that cures when confined between metal parts to form a tough bond. It is best suited for cylindrical parts and where high temperatu..
|
|||
| Cure Time |
30.0
min @Temperature 150 °C |
0.500
hour @Temperature 302 °F |
|
|
Gwent Electronic Materials C2020425D1 Curable Silver Range
This product is based on a unique curing process that results in the low temperature formation of a thermosetting conductive adhesive that combines good adhesion with excellent electrical properties..
|
|||
| Cure Time |
30.0
min @Temperature 200 °C |
0.500
hour @Temperature 392 °F |
second step |
|
Gwent Electronic Materials D2090126D2 Black Solder mask Dielectric
This product has been designed as a solder mask dielectric for use at high temperatures. It has been tested at 250°C and was proved to be stable for 4 weeks. Screen Printing Equipment: semi-autom..
|
|||
| Cure Time |
30.0
min @Temperature 150 °C |
0.500
hour @Temperature 302 °F |
|
|
Tra-Con Tra-Bond 221U01 Electrically Insulating Epoxy Encapsulant
TRA-BOND 221U01 is an electrically insulating, non-sagging epoxy encapsulant formulated to provide a smooth crown over the device of wire bonds. This encapsulant provides protection from thermal and..
|
|||
| Cure Time |
30.0
min @Temperature 80.0 °C |
0.500
hour @Temperature 176 °F |
|
|
Tra-Con Tra-Bond 77-2LTC Low Temperature Cure SMD Adhesive
TRA-BOND 77-2LTC one component, solvent-free, insulative epoxy adhesive is designed to cure at temperatures as low as 80°C. This adhesive is specifically designed for attaching surface mounted devi..
|
|||
| Cure Time |
30.0
min @Temperature 120 °C |
0.500
hour @Temperature 248 °F |
|
|
Tra-Con Tra-Duct 921M01 Low Viscosity Long Pot Life Silver-Filled Epoxy
TRA-DUCT 921M01 is a two component, silver-filled electrically conductive epoxy adhesive designed for applications which require electrical conductivity and a long pot life at a relatively low heat ..
|
|||
| Cure Time |
30.0
min @Temperature 150 °C |
0.500
hour @Temperature 302 °F |
|
|
Tra-Con Tra-Duct 921U02 Long Pot Life Silver-Filled Epoxy
TRA-DUCT 921U02 long room temperature pot life, silver-filled epoxy. Information provided by Tra-Con Inc.
|
|||
| Cure Time |
30.0
min @Temperature 150 °C |
0.500
hour @Temperature 302 °F |
|
|
Hexcel® Redux® 840 One-part Foaming Epoxy Paste Adhesive
Redux® 840 is a black one-part, foaming, epoxy paste adhesive that is thixotropic.Features: Provides a shear-carrying connection across any discontinuities in bonded sandwich panels; Maximum servic..
|
|||
| Cure Time |
30.0
min @Temperature 80.0 °C |
0.500
hour @Temperature 176 °F |
Minimum Bond Line |
|
Epoxy Technology EPO-TEK® 353ND-T High Temperature Thixotropic Epoxy
Product Description: EPO TEK® 353ND-T is a two component, highly thixotropic epoxy with non-flowing properties and high temperature resistance. Advantages & Application Notes: Suitable for fiber op..
|
|||
| Cure Time |
30.0
min @Temperature 170 °C |
0.500
hour @Temperature 338 °F |
|
|
Dow BETAMATE™ 1496 V Epoxy
BETAMATE™ 1496 V is a one component, epoxy based adhesive especially developed for the body shop. The product has the following properties: Good rheology performance (Wash-out resistant, excelle..
|
|||
| Cure Time |
30.0
min @Temperature 43.0 °C |
0.500
hour @Temperature 109 °F |
Full Load |
|
Chesterton ARC MX5 Rapid Curing Fine Particle Wear Compound
Description: An advanced ceramic reinforced composite for the emergency repair and protection of all metal surfaces subjected to severe erosion, corrosion, and chemical attack. It is applied at a th..
|
|||
| Cure Time |
30.0
-
180
min @Temperature 50.0 - 100 °C |
0.500
-
3.00
hour @Temperature 122 - 212 °F |
Optional |
|
Abatron AboCoat 8709-12/AboCure 50-12 Silver-Filled Electrically Conductive Epoxy Compound
AboCoat 8709-12/AboCure 50-12 is a versatile silver-epoxy high-solids coating with good conductive and adhesive properties. It is successful as a conductive compound for most electronic uses.
|
|||
| Cure Time |
30.0
-
180
min @Temperature 50.0 - 100 °C |
0.500
-
3.00
hour @Temperature 122 - 212 °F |
Optional |
|
Abatron AboCoat 8709-3 A/B Carbon-Filled Electrically Conductive Epoxy Compound
AboCoat 8709-3 A/B is a high-solid carbon-epoxy coating with various conductivity ranges widely used in silk-screening.
|
|||
| Cure Time |
30.0
min @Temperature 177 °C |
0.500
hour @Temperature 350 °F |
Recommended Cure Cycle |
|
Arlon 30400R040 0.04" Uncured, Unsupported Silicone Rubber on Release Carrier
Design/Construction:Side 1: Uncured, Unsupported Silicone RubberSubstrate: Kodacel CarrierInterleave: 0.003" PolyethyleneThis data represents typical values for the production material and should..
|
|||
| Cure Time |
30.0
min @Temperature 177 °C |
0.500
hour @Temperature 350 °F |
Recommended Cure Cycle |
|
Arlon 55191R030 0.030" (0.762 mm) Uncured Silicone Rubber with Fiberglass Substrate
Design/Construction:Side 1: Uncured Silicone RubberSide 2: Uncured Silicone Rubber Appearance: Red silicone gum on fiberglass clothThis data Represents typical values for the production material. Th..
|
|||
| Cure Time |
30.0
min @Temperature 177 °C |
0.500
hour @Temperature 350 °F |
Recommended Cure Cycle |
|
Arlon 75400R045 0.045" (1.14 mm) Uncured Silicone Rubber with Fiberglass Substrate
Design/Construction:Side 1: Uncured Silicone RubberThis data Represents typical values for the production material. The data should not be used to write, or in place of, material specifications.Info..
|
|||
| Cure Time |
30.0
min @Temperature 177 °C |
0.500
hour @Temperature 350 °F |
Recommended Cure Cycle |
|
Arlon R31551R030 0.030" (0.762 mm) Uncured Silicone Rubber with Fiberglass Substrate
Design/Construction:Side 1: Uncured Silicone Rubber Side 2: Uncured Silicone Rubber This data Represents typical values for the production material. The data should not be used to write, or in place..
|
|||
| Cure Time |
30.0
min @Temperature 23.0 °C |
0.500
hour @Temperature 73.4 °F |
M10 steel, working strength |
|
Permabond A1042 Anaerobic Threadlocker
Permabond® A1042 is a rapid curing adhesive designed to lock and seal metal parts that subsequently may need to be dismantled for maintenance. The high vibration resistance makes Permabond A1042 pa..
|
|||
| Cure Time |
30.0
min @Temperature 23.0 °C |
0.500
hour @Temperature 73.4 °F |
Stainless steel, handling strength |
|
Permabond MH052 Anaerobic Threadsealant
Permabond® MH052 is ideal for the sealing of threaded joints. It is approved for use with natural gas and LPG for working pressure up to 20 bar (290 psi) and also for gaseous oxygen up to 10 bar (1..
|
|||
| Cure Time |
30.0
min @Temperature 23.0 °C |
0.500
hour @Temperature 73.4 °F |
Brass, working strength |
|
Permabond MH052 Anaerobic Threadsealant
Permabond® MH052 is ideal for the sealing of threaded joints. It is approved for use with natural gas and LPG for working pressure up to 20 bar (290 psi) and also for gaseous oxygen up to 10 bar (1..
|
|||