Polymer Property : Cure Time = 30.0 min Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Cure Time	30.0 min @Temperature 93.3 °C	0.500 hour @Temperature 200 °F	De-mold Time
Northstar Polymers MSS-A85C Ester Base Polyurethane This high performance polyester system is one of a family of polymer systems developed by Northstar Polymers for demanding work environments. Urethane elastomers molded with this system exhibit hig..
Cure Time	30.0 min @Temperature 93.3 °C	0.500 hour @Temperature 200 °F	De-mold Time
Northstar Polymers MSS-A90A High Performance Polyurethane Cast Elastomer System 90A This is a Ester/MDI base high-performance polyurethane casting system. This systems is recommended to applications in which the part requires high tensile strength, cut/tear resistance, dry-abrasio..
Cure Time	30.0 min @Temperature 23.0 °C	0.500 hour @Temperature 73.4 °F	Stainless steel, handling strength
Permabond HM162 Anaerobic Retainer Permabond® HM162 is a medium viscosity retaining compound that cures when confined between metal parts to form an extremely tough bond. It is best suited for cylindrical parts and where high temper..
Cure Time	30.0 min @Temperature 110 °C	0.500 hour @Temperature 230 °F
Resinlab® EP1320LV Heat Cure Epoxy Conformal Coating Resinlab™ EP1320 and EP1320LV are one part heat cure epoxy conformal coatings. They can also be used as a small mass potting compounds, structural adhesives, or insulating polymer systems where the..
Cure Time	30.0 min @Temperature 23.0 °C	0.500 hour @Temperature 73.4 °F	Brass, working strength
Permabond HH040 Pure NSF 61 Approved Anaerobic Retainer Permabond® HH040 PURE is a single component liquid that cures only when in contact with metal parts and oxygen is excluded. The liquid adhesive fills the “air space” between parts and upon cure u..
Cure Time	30.0 min @Temperature 65.0 °C	0.500 hour @Temperature 149 °F
Resin Technology Group TIGA 110-EXDP Low Viscosity, Optically Clear Glass Bonder Mix ratio 100/50 by volume.TIGA 110EX-DP is a transparent, low viscosity epoxy resin formulation recommended for industrial adhesive, small potting and laminating applications where sparkling clarit..
Cure Time	30.0 min @Temperature 60.0 Â°C	0.500 hour @Temperature 140 Â°F
Gwent Electronic Materials C2070508D4 Carbon Graphite Ink This Carbon Graphite Ink is designed to be used for screen printing working electrodes. These electrodes enable the detection of many analytes when used in conjunction with peroxidase and other oxi..
Cure Time	30.0 min @Temperature 150 °C	0.500 hour @Temperature 302 °F
Tra-Con Tra-Bond 221U01 Electrically Insulating Epoxy Encapsulant TRA-BOND 221U01 is an electrically insulating, non-sagging epoxy encapsulant formulated to provide a smooth crown over the device of wire bonds. This encapsulant provides protection from thermal and..
Cure Time	30.0 min @Temperature 150 °C	0.500 hour @Temperature 302 °F
Tra-Con Tra-Bond F211 General Purpose Fiber Optic Epoxy Adhesive TRA-BOND F211 is a general purpose fiber optic epoxy adhesive recommended for bonding and small volume potting applications where superior wetting and physical properties are needed at both high and..
Cure Time	30.0 min @Temperature 125 °C	0.500 hour @Temperature 257 °F
Tra-Con Tra-Bond Ablebond 868-7U Thixotropic Epoxy Adhesive Ablebond 868-7UNF is the unfilled version of 868-7, a nonsagging, flexible epoxy adhesive. Information provided by Tra-Con Inc.
Cure Time	30.0 min @Temperature 120 °C	0.500 hour @Temperature 248 °F
Trelleborg Emerson & Cuming Eccobond® 1962-31 Needle Bonding Epoxy Adhesive Emerson & Cuming 1962-31 Eccobond® Needle Bonding Epoxy AdhesiveOne component, medium viscosity, epoxy needle bonding adhesive. Designed to bond stainless steel cannulae into polypropylene hubs. Al..
Cure Time	30.0 min @Temperature 80.0 °C	0.500 hour @Temperature 176 °F	Minimum Bond Line
Epoxy Technology EPO-TEK® 353ND-T5 High Temperature Thixotropic Epoxy Product Description: EPO-TEK® 353ND-T5 is an intermediate viscosity version of EPO-TEK® 353ND and EPO-TEK® 353ND-T. It was designed for high temperature applications in fiber optics, electronics ..
Cure Time	30.0 min @Temperature 100 °C	0.500 hour @Temperature 212 °F	Minimum Bond Line
Epoxy Technology EPO-TEK® 730 General Purpose Epoxy Product Description: EPO-TEK® 730 is a two component, thixotropic, room temperature-curing epoxy adhesive. Advantages & Application Notes: Excellent all purpose adhesive. Many uses in job shop and ..
Cure Time	30.0 min @Temperature 150 °C	0.500 hour @Temperature 302 °F
Epoxyset Epoxibond EB-315 Low Expansion Epoxy Adhesive EB-315 is a highly filled, heat curing, high temperature resistant epoxy adhesive. Due to its low coefficient of thermal expansion and outgassing, it can be used for bonding and sealing in critical ..
Cure Time	30.0 - 180 min @Temperature 50.0 - 100 °C	0.500 - 3.00 hour @Temperature 122 - 212 °F	Optional
Abatron AboCoat 8709-5 A/B Carbon-Filled Electrically Conductive Epoxy Compound AboCoat 8709-5 A/B is a high-solid carbon-epoxy coating with various conductivity ranges widely used in silk-screening.
Cure Time	30.0 - 180 min @Temperature 50.0 - 100 °C	0.500 - 3.00 hour @Temperature 122 - 212 °F	Optional
Abatron AboWeld 8201-14/AboCure 8201-14 Carbon-Filled Electrically Conductive Epoxy Compound AboWeld 8201-14/AboCure 8201-14 is an easy-to-use and very conductive carbon-epoxy paste. As the size of the conductive particles is relatively coarse, this product is used primarily as a thick adhe..
Cure Time	30.0 min @Temperature 150 °C	0.500 hour @Temperature 302 °F
ACC QGel 300 QSI Quantum Silicones High Strength Gel QGel 300 is a clear, very soft, tough, moderately cross-linked, silicone polymer. Silicone gels are used to provide protection from vibration, thermal or mechanical shock. Silicone gels also provide..
Cure Time	30.0 min @Temperature 149 °C	0.500 hour @Temperature 300 °F
3M Scotchcast™ 260 Electrical Epoxy Powder Resin 3M Scotchcast Electrical Resin 260 is a widely used, well-known general purpose epoxy powder resin. A one-part, green pigmented, rapid heat-curing product, it is designed to provide a continuous, to..
Cure Time	30.0 min @Temperature 149 °C	0.500 hour @Temperature 300 °F
3M Scotchcast™ 263 Electrical Epoxy Powder Resin 3M Scotchcast Electrical Resin 263 is a widely used, well-known general purpose epoxy powder resin. A one part, green pigmented, rapid heat-curing product, it is designed to provide a continuous, to..
Cure Time	30.0 min @Temperature 75.0 °C	0.500 hour @Temperature 167 °F	Dry to handle, at 50% humidity and 75°C
Blue River Coatings Undercoat Primer BLUE RIVER COATINGS UNDERCOAT PRIMER is a high quality, single component primer, not requiring any catalyzing agent. Performance obtained is equal or superior to that of two-component, catalyzed epo..
Cure Time	30.0 min @Temperature 177 °C	0.500 hour @Temperature 350 °F	Recommended Cure Cycle
Arlon R34020W062 0.062" (1.57 mm) Uncured, Unsupported Silicone Rubber on a Kodacel Carrier Design/Construction:Side 1: Uncured, Unsupported Silicone Rubber on a Kodacel Carrier This data Represents typical values for the production material. The data should not be used to write, or in pla..
Cure Time	30.0 min @Temperature 60.0 °C	0.500 hour @Temperature 140 °F
Atom Adhesives AA-DUCT 906 Epoxy Adhesive AA-DUCT 906 represents the newest technology since the introduction of electrically conductive silver compounds. This unique formulation is based on a silver coated ceramic that results in lower mat..
Cure Time	30.0 min @Temperature 200 °C	0.500 hour @Temperature 392 °F	second step
Gwent Electronic Materials D2090124D2 Green Solder mask Dielectric This product has been designed as a solder mask dielectric for use at high temperatures. It has been tested at 250°C and was proved to be stable for 12 weeks. Screen Printing Equipment: semi-automa..