Electrical Properties | Metric | English | Comments |
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Dielectric Strength | 15.0 kV/mm | 380 kV/in | |
Resinlab® EP1285HD-12 Highly Filled, Medium Viscosity Casting Resin Resinlab™ EP1285 (Formerly Lab Product W021901 series) is a highly filled, medium viscosity black casting resin designed for applications requiring a high degree of thermal conductivity and a low C.. |
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Dielectric Strength | 15.0 - 34.0 kV/mm | 380 - 864 kV/in | Average value: 29.6 kV/mm Grade Count:27 |
Overview of materials for Polycarbonate, Extruded This property data is a summary of similar materials in the MatWeb database for the category "Polycarbonate, Extruded". Each property range of values reported is minimum and maximum values of approp.. |
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Dielectric Strength | 15.0 kV/mm | 380 kV/in | Method A (Short-Time); ASTM D149 |
Techmer ES Elastoblend® PC IM X Availability: North AmericaForms: PelletsAdditive: Impact Modifier and Mold ReleaseFeatures: Impact Modified and Good Mold ReleaseProcessing Method: Injection MoldingInformation provided by TP Compo.. |
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Dielectric Strength | 15.0 kV/mm @Thickness 3.00 mm |
380 kV/in @Thickness 0.118 in |
ASTM D149 |
Teknor Apex Beetle® 140 BH Nylon 66, Glass Bead Reinforced Processing Method: Injection Molding Forms: PelletsInformation Provided by Teknor Apex |
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Dielectric Strength | 15.0 kV/mm | 380 kV/in | Method A (Short-Time); ASTM D149 |
Techmer ES Elastoblend® PC IM Availability: North AmericaForms: PelletsAdditive: Impact Modifier Features: Impact Modified Processing Method: Injection MoldingInformation provided by TP Composites, Inc. |
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Dielectric Strength | 15.0 kV/mm | 380 kV/in | Short Time; ASTM D149 |
Sumitomo Bakelite Sumikon® PM-9610 Glass-Filled Phenolic, Compression Grade Sumikon PM-9610 is a two stage glass fiber and mineral filled black phenolic special purpose molding compound. It is especially designed for applications requiring high strength and higher dimens.. |
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Dielectric Strength | 15.0 kV/mm @Thickness 3.00 mm |
380 kV/in @Thickness 0.118 in |
ASTM D149 |
Teknor Apex Chemlon® 133 GVH Nylon 66, 30% Glass Fiber Reinforced Notes: Excellent for connectors and electrical parts; Flammability: Passes, FMVSS 302 Processing Method: Injection Molding Forms: PelletsInformation Provided by Teknor Apex |
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Dielectric Strength | 15.0 kV/mm | 380 kV/in | |
Tra-Con Tra-Bond F230 Color Keyed High Temperature Epoxy Adhesive TRA-BOND F230 is a clear, low viscosity, high temperature, two-part epoxy adhesive that changes colors during the curing process to indicate cure status. The unmixed components are light yellow; the.. |
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Dielectric Strength | 15.0 kV/mm | 380 kV/in | |
Cytec (Conap) FR-1200 / EA-117 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an.. |
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Dielectric Strength | 15.0 kV/mm @Thickness 3.17 mm |
380 kV/in @Thickness 0.125 in |
In air; ASTM D149 |
Entec Hylex® P1010L2 HB Polycarbonate Available in North America Additive: Mold Release Features: Good Mold Release and Medium Flow RoHS Compliant Form: Pellets Appearance: Blue Information provided by Entec |
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Dielectric Strength | 15.0 kV/mm @Thickness 3.17 mm |
380 kV/in @Thickness 0.125 in |
In air; ASTM D149 |
Entec Hylex® P1017L1 HB Polycarbonate Available in North America Additive: Mold Release Features: Good Mold Release and High Flow RoHS Compliant Form: Pellets Appearance: Clear/Transparent Information provided by Entec |
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Dielectric Strength | 15.0 kV/mm @Thickness 3.17 mm |
380 kV/in @Thickness 0.125 in |
In air; ASTM D149 |
Entec Hylex® P1017L2 HB Polycarbonate Available in North America Additive: Mold Release Features: Good Mold Release and High Flow RoHS Compliant Form: Pellets Appearance: Blue Information provided by Entec |
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Dielectric Strength | 15.0 kV/mm | 380 kV/in | ASTM D149 |
Entec Hylex® P1310L1 HB Polycarbonate Polycarbonate, UV Stabilized, Intermediate Flow, Mold Release, Water ClearInformation provided by Entec. |
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Dielectric Strength | 15.0 kV/mm | 380 kV/in | ASTM D149 |
Entec Hylex® P1317L1 HB Polycarbonate UV Stabilized, Higher Flow, Mold Release, Water ClearInformation provided by Entec. |
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Dielectric Strength | 15.0 kV/mm | 380 kV/in | |
Aremco Aremco-Bond™ 2300 High Performance Epoxide Milky Clear, 10:1, Low Viscosity, Exceptional Bond Strength. |
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Dielectric Strength | 15.0 kV/mm | 380 kV/in | |
Aremco Aremco-Bond™ 807 High Performance Epoxide 10 Minute Set, Non-Sagging, 1:1, Excellent Electrical & Mechanical Properties |
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Dielectric Strength | 15.0 - 15.7 kV/mm | 380 - 400 kV/in | Short Time |
Bulk Molding Compounds BMC 680 Mineral Filled, Glass Fiber Reinforced Polyester Compound BMC 680 molding compound is a mineral filled, glass fiber-reinforced polyester compound suitable for compression and stuffer injection molding It is characterized by good moldability, very high impa.. |
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Dielectric Strength | 15.0 kV/mm @Thickness 3.00 mm |
380 kV/in @Thickness 0.118 in |
ASTM D149 |
Teknor Apex Chemlon® 140 MH Nylon 66, 40% Mineral Reinforced Notes: 40% Mineral; High rigidity with exceptional control of warpage and surface sink marks; Excellent for large parts; Fast cycling Features: Fast Molding Cycle; High Rigidity; Heat Stabilized; Lo.. |
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Dielectric Strength | 15.0 - 175 kV/mm | 380 - 4450 kV/in | Average value: 26.4 kV/mm Grade Count:26 |
Overview of materials for Polyetheretherketone, Glass Fiber Filled This property data is a summary of similar materials in the MatWeb database for the category "Polyetheretherketone, Glass Fiber Filled". Each property range of values reported is minimum and maximum.. |
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Dielectric Strength | 15.0 kV/mm | 380 kV/in | |
Resinlab® EP1285HD-14 Highly Filled, Medium Viscosity Casting Resin Resinlab™ EP1285 (Formerly Lab Product W021901 series) is a highly filled, medium viscosity black casting resin designed for applications requiring a high degree of thermal conductivity and a low C.. |
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Dielectric Strength | 15.0 kV/mm | 380 kV/in | |
Resinlab® UR3001 Clear Two Part Urethane Encapsulant Resinlab™ UR 3001 is a clear, two component, room temperature curing urethane encapsulating system. It is designed to cure completely at room temperature. UR 3001 provides excellent environmental p.. |
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Dielectric Strength | 15.0 kV/mm | 380 kV/in | |
Resinlab® UR3001HP Clear Urethane Encapsulant Resinlab™ UR3001HP Clear is a clear, two component, room temperature curing urethane encapsulating system. It is designed to cure completely at room temperature. UR3001HP Clear provides excellent e.. |
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Dielectric Strength | 15.0 - 21.7 kV/mm | 380 - 550 kV/in | Average value: 16.1 kV/mm Grade Count:6 |
Overview of materials for Polyethersulfone (PES), 10% Glass Fiber Filled This property data is a summary of similar materials in the MatWeb database for the category "Polyethersulfone (PES), 10% Glass Fiber Filled". Specific grades with glass content between 5% and 14% a.. |
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Dielectric Strength | 15.0 kV/mm | 380 kV/in | ASTM D149 |
Premix Premi-Glas® 1282-32 VE Glass Reinforced Vinyl Ester SMC
(discontinued **) Description: Premi-Glas® 1282-32 VE SMC is an enhanced high strength glass reinforced vinyl ester molding compound formulated for under-the-hood automotive applications.
Key features and benefi.. |
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Dielectric Strength | 15.0 kV/mm | 380 kV/in | ASTM D149 |
Owens Corning Glass Fiber Reinforced Polyphenylene Sulfide, 40 wt.% glass Polyphenylene Sulfide provides excellent resistance to organic solvents (below 375°F). It is unaffected by strong alkalis or aqueous organic salt solutions. Data provided by the manufacturer, Owen.. |