Aremco Aremco-Bond™ 855 Epoxy Adhesive (discontinued **)

Category	Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer
Trade Name
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Aremco Aremco-Bond™ 855 Epoxy Adhesive (discontinued **).pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

High performance epoxy for specialty bonding and potting applications to 350ºF (175°C). Can be applied to a myriad of substrates, offering exceptional chemical, electrical, and mechanical properties. General purpose, low viscosity, electrical potting compound. Low shrinkage and excellent dimensional stability.

Physical Properties	Metric	English	Comments
Density	1.56 g/cc	0.0564 lb/in³
Viscosity	6000 cP	6000 cP	mix viscosity

Mechanical Properties	Metric	English	Comments
Adhesive Bond Strength	7.00 MPa	1020 psi	Per ASTM D1002-94; shear strength of single lap-joint metal coupons in tension loading.

Thermal Properties	Metric	English
CTE, linear	39.6 µm/m-°C @Temperature 20.0 °C	22.0 µin/in-°F @Temperature 68.0 °F
Thermal Conductivity	0.650 W/m-K	4.51 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air	180 °C	356 °F

Electrical Properties	Metric	English
Electrical Resistivity	4.00e+14 ohm-cm	4.00e+14 ohm-cm
Dielectric Constant	4.52 @Frequency 1e+6 Hz	4.52 @Frequency 1e+6 Hz
Dielectric Strength	18.0 kV/mm	457 kV/in
Dissipation Factor	0.010 @Frequency 1e+6 Hz	0.010 @Frequency 1e+6 Hz

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