Aremco Ceramabond™ 668 High Temperature Ceramic Adhesive/Paste, Alumino-Silica Filled

Category	Ceramic , Oxide , Aluminum Oxide , Silicon Oxide
Manufacturer	Aremco
Trade Name	Ceramabond™
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Aremco Ceramabond™ 668 High Temperature Ceramic Adhesive/Paste, Alumino-Silica Filled.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Aremco's ceramic adhesives are easy to use, one- and two-component systems which air dry in 1-2 hrs and are ready for use following a 200 to 700 °F cure. These materials are mostly water-based and do not outgas after curing. They are also environmentally safe, non-flammable materials which contain no volatile organic compounds.General Features: Sets @ RT, Good Filler Bonding: Ceramic to Ceramic, Ceramic to Metal Principal Use: Oxygen Sensors

Physical Properties	Metric	English
Density	2.20 - 2.40 g/cc	0.0795 - 0.0867 lb/in³
Volatile Organic Compounds (VOC) Content	0.000 g/l	0.000 g/l
Viscosity	40000 - 80000 cP	40000 - 80000 cP

Mechanical Properties	Metric	English	Comments
Impact Test	51.5 J	38.0 ft-lb	Torque Strength; curing at 1000°F

Thermal Properties	Metric	English	Comments
CTE, linear	7.20 µm/m-°C	4.00 µin/in-°F
Maximum Service Temperature, Air	1370 °C	2500 °F

Electrical Properties	Metric	English	Comments
Dielectric Strength	4.65 kV/mm	118 kV/in

Processing Properties	Metric	English	Comments
Processing Temperature	50.0 - 90.0 °C	122 - 194 °F	Application Temp
Cure Time	60.0 - 240 min @Temperature 93.3 °C	1.00 - 4.00 hour @Temperature 200 °F	preceeded by 1 hour air set
Shelf Life	6.00 Month @Temperature 4.44 - 32.2 °C	6.00 Month @Temperature 40.0 - 90.0 °F

Descriptive Properties	Value	Comments
Acid Resistance	Good	after curing at 700°F for 2 hours
Alkali Resistance	Excellent	after curing at 700°F for 2 hours
Color	White
Moisture Resistance	Excellent	after curing at 700°F for 2 hours
Solvent	Water
Thinner	668-T

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