Bulk Molding Compounds BMC 940 Vinyl Ester Bipolar Plate Material

Category	Polymer , Thermoset , Vinyl Ester
Manufacturer	BMC - Bulk Molding Compounds Inc.
Trade Name	BMC
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Bulk Molding Compounds BMC 940 Vinyl Ester Bipolar Plate Material.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Product Introduction: Bulk Molding Compounds, Inc. is the largest manufacturer of thermoset bulk molding compounds in North America, serving the automotive, appliance, and electrical markets. BMC thermosets are the most cost-effective plastic products on the market today. The process of manufacturing BMC thermosets is geared toward high-volume, automated systems to ensure the highest quality at the lowest possible cost. BMC thermosets can be designed to conduct electricity for use in applications such as bipolar plates that are used in fuel cells. A fuel cell is an electro-chemical device capable of generating electricity from oxygen and hydrogen. BMC has developed a cost-effective product for use in bipolar plates within direct methanol fuel cell stacks (DMFC). This material utilizes a special vinyl ester resin that is resists up to 100% methanol immersion at 65°C.Information provided by Bulk Molding Compounds

Physical Properties	Metric	English	Comments
Specific Gravity	1.89 g/cc	1.89 g/cc	ASTM D792
Water Absorption	<= 0.060 % @Temperature 23.0 °C, Time 86400 sec	<= 0.060 % @Temperature 73.4 °F, Time 24.0 hour	ASTM D570
Linear Mold Shrinkage	0.00080 cm/cm	0.00080 in/in	ASTM D955

Mechanical Properties	Metric	English	Comments
Tensile Strength at Break	28.0 MPa	4060 psi	ASM D638
Tensile Modulus	9.50 GPa	1380 ksi	ASTM D638
Flexural Yield Strength	38.0 MPa	5510 psi	ASTM D790
Flexural Modulus	10.5 GPa	1520 ksi	ASTM D790

Thermal Properties	Metric	English	Comments
Specific Heat Capacity	0.846 J/g-°C	0.202 BTU/lb-°F	E1461-92
Thermal Conductivity	13.4 W/m-K	93.0 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg	189 °C	372 °F
Flammability, UL94	V-0 @Thickness 3.56 mm	V-0 @Thickness 0.140 in

Electrical Properties	Metric	English	Comments
Volume Resistivity	0.0143 ohm-cm	0.0143 ohm-cm	In Plane (X,Y direction)
	0.03125 ohm-cm	0.03125 ohm-cm	Through Plane (Z direction)

Processing Properties	Metric	English	Comments
Mold Temperature	149 - 160 °C	300 - 320 °F
Cure Time	0.500 - 1.00 min	0.00833 - 0.0167 hour

Descriptive Properties	Value	Comments
Diffusivity	0.0889 cm²/s
DMA-Modulus	13.8	@ 25°C, ASTM D4065
	3.1	@ 200°C, ASTM D4065
	5.4	@ 175°C, ASTM D4065
	6.8	@ 150°C, ASTM D4065
	9.6	@ 100°C, ASTM D4065
Flowability	270 cm²
Post bake, 350°F	15 mins	after reaching 350°f
Press Close Speed	<2 sec	after material begins flowing
Recommended tonnage	>40 Mpa	on projected part area

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