Cookson Group Plaskon® ULS-12LA Molding Compound (discontinued **)

Category	Polymer , Thermoset , Epoxy , Epoxy Molding Compound
Manufacturer
Trade Name
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Cookson Group Plaskon® ULS-12LA Molding Compound (discontinued **).pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Test specimens were transfer molded and post cured 4 hours at 175°C.An ultra low stress, low alpha emission molding compound designed for packaging stress-sensitive memory devices such as TSOPs and large QFPs. It offers an alpha particle count of

Physical Properties	Metric	English	Comments
Density	1.88 g/cc	0.0679 lb/in³
Water Absorption	0.0034 %	0.0034 %
Viscosity	5500 cP @Temperature 175 °C	5500 cP @Temperature 347 °F	Automatic orifice Viscosity
Linear Mold Shrinkage	0.0025 cm/cm	0.0025 in/in
Spiral Flow	81.0 cm	31.9 in

Mechanical Properties	Metric	English
Hardness, Shore D	80	80
Flexural Strength	107 MPa	15500 psi
Flexural Modulus	14.0 GPa	2030 ksi

Thermal Properties	Metric	English
CTE, linear	12.5 µm/m-°C @Temperature 20.0 °C	6.94 µin/in-°F @Temperature 68.0 °F
CTE, linear, Transverse to Flow	65.0 µm/m-°C @Temperature 20.0 °C	36.1 µin/in-°F @Temperature 68.0 °F
Thermal Conductivity	0.700 W/m-K	4.86 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg	155 °C	311 °F
Flammability, UL94	V-0 @Thickness 3.20 mm	V-0 @Thickness 0.126 in
	V-0 @Thickness 3.20 mm	V-0 @Thickness 0.126 in

Electrical Properties	Metric	English
Dielectric Constant	3.8 @Frequency 1000 Hz	3.8 @Frequency 1000 Hz
Dielectric Strength	16.0 kV/mm	406 kV/in
Dissipation Factor	0.0020 @Frequency 1000 Hz	0.0020 @Frequency 1000 Hz
Arc Resistance	180 sec	180 sec

Processing Properties	Metric	English	Comments
Processing Temperature	170 - 185 °C	338 - 365 °F	Molding temperature

Users viewing this material also viewed the following: