E-Polymers SEPAZ® C130GP 30% Glass Fiber Reinforced LCP Resin

Category	Polymer , Thermoplastic , Liquid Crystal Polymer (LCP) , Liquid Crystal Polymer (LCP), 30% Glass Fiber Filled
Manufacturer	E-Polymers Co. Ltd.
Trade Name	SEPAZ®
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	E-Polymers SEPAZ® C130GP 30% Glass Fiber Reinforced LCP Resin.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Liquid Crystal Polymer Resin: SEPAZ LCP resin has a unique structure and performance unthought of in a traditional plastics. Beside SEPAZ LCP takes the excels in all-around performance and molding productivity. SEPAZ LCP has a unique attribute in that the thinner the product becomes, the greater the mechanical strength. SEPAZ LCP finds uses in connectors, sensors and other electronic components and CD pick-up parts, and in copying machine and fax components in office and audio-visual equipment.Information Provided by E-Polymers Co., Ltd.

Physical Properties	Metric	English	Comments
Specific Gravity	1.62 g/cc	1.62 g/cc	ASTM D792

Mechanical Properties	Metric	English	Comments
Tensile Strength	132.4 MPa	19210 psi	ASTM D638
Elongation at Break	1.8 %	1.8 %	ASTM D638
Flexural Strength	171.68 MPa	24900 psi	ASTM D790
Flexural Modulus	12.753 GPa	1849.7 ksi	ASTM D790
Izod Impact, Notched	1.18 J/cm	2.20 ft-lb/in	ASTM D256

Thermal Properties	Metric	English	Comments
Melting Point	335 °C	635 °F	ASTM D789
Deflection Temperature at 1.8 MPa (264 psi)	265 °C	509 °F	ASTM D648
Flammability, UL94	V-0	V-0

Electrical Properties	Metric	English	Comments
Volume Resistivity	>= 1.00e+14 ohm-cm	>= 1.00e+14 ohm-cm	ASTM D257
Surface Resistance	>= 1.00e+15 ohm	>= 1.00e+15 ohm	ASTM D257
Dielectric Constant	3.9 @Frequency 1.00e+6 Hz	3.9 @Frequency 1.00e+6 Hz	ASTM D150
Dielectric Strength	29.0 kV/mm @Thickness 1.60 mm	737 kV/in @Thickness 0.0630 in	ASTM D149
Dissipation Factor	0.027 @Frequency 1.00e+6 Hz	0.027 @Frequency 1.00e+6 Hz	ASTM D150

Processing Properties	Metric	English	Comments
Melt Temperature	350 - 360 °C	662 - 680 °F
Mold Temperature	30.0 - 160 °C	86.0 - 320 °F

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