Lord Adhesives Thermosetâ„¢ LS 213-9 Unfilled Epoxy Encapsulant

Category	Polymer , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced
Manufacturer	Lord Adhesives
Trade Name	Thermoset™
Port	Ningbo port,China
Trade Terms	EXW, FOB, CFR, CIF
Payment Terms	L/C, T/T, PayPal
Download PDF	Lord Adhesives Thermosetâ„¢ LS 213-9 Unfilled Epoxy Encapsulant.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Lord LS 213-9 is a one component epoxy coating and impregnating compound featuring low viscosity, good moisture resistance and excellent dielectric properties. Typical applications include transformer potting and electrical lamination.All information provided by Lord.

Physical Properties	Metric	English
Specific Gravity	1.13 g/cc	1.13 g/cc
Solids Content	100 %	100 %
Viscosity	2800 cP <br>@Temperature 25.0 Â°C	2800 cP <br>@Temperature 77.0 Â°F

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	85	85

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	155 Â°C	311 Â°F
Glass Transition Temp, Tg	75.0 Â°C	167 Â°F

Electrical Properties	Metric	English
Volume Resistivity	2.00e+15 ohm-cm	2.00e+15 ohm-cm
Dielectric Constant	3.4 <br>@Frequency 1000 Hz	3.4 <br>@Frequency 1000 Hz
Dielectric Strength	18.9 kV/mm	480 kV/in
Dissipation Factor	0.022 <br>@Frequency 1000 Hz	0.022 <br>@Frequency 1000 Hz

Processing Properties	Metric	English
Cure Time	120 min <br>@Temperature 121 Â°C	2.00 hour <br>@Temperature 250 Â°F
	300 min <br>@Temperature 104 Â°C	5.00 hour <br>@Temperature 220 Â°F
	480 min <br>@Temperature 93.3 Â°C	8.00 hour <br>@Temperature 200 Â°F

Descriptive Properties	Value	Comments
Appearance	Amber
Consistency	Liquid

Users viewing this material also viewed the following: