Parker Chomerics CHO-BOND 1072 Conductive Silicone Splicing Compound

Category	Polymer , Adhesive , Thermoset
Manufacturer	Parker Chomerics
Trade Name	CHO-BOND
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Parker Chomerics CHO-BOND 1072 Conductive Silicone Splicing Compound.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Conductive splicing compounds are intended for making "custom" EMI/RFI gaskets from standard CHO-SEAL® and CHO-SIL® strips. Compounds consist of Chomerics silver-bearing powders dispersed in silicone binder.Information provided by Chomerics

Physical Properties	Metric	English	Comments
Density	2.00 g/cc	0.0723 lb/in³

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	160 °C	320 °F
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F

Processing Properties	Metric	English	Comments
Pot Life	30 min @Temperature 24.0 °C	30 min @Temperature 75.2 °F
	20160 min @Temperature -35.0 °C	20160 min @Temperature -31.0 °F
Shelf Life	6.00 Month	6.00 Month	For parts A & B

Descriptive Properties	Value	Comments
Part A/B/C %	23.3/2.3/74.4

Users viewing this material also viewed the following: