Parker Chomerics CHO-FORM 5531 EMI Shielding Material

Category	Polymer , Thermoset , Rubber or Thermoset Elastomer (TSE) , Silicone
Manufacturer	Parker Chomerics
Trade Name	CHO-FORM
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Parker Chomerics CHO-FORM 5531 EMI Shielding Material.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

One component, moisture cure, form-in-place EMI gasketing material. This electrically conductive formulation contains silver-plated copper particles dispersed in a silicone elastomer. It is designed to be robotically dispensed using high pressure dispense equipment.Information provided by Chomerics

Physical Properties	Metric	English	Comments
Specific Gravity	3.20 g/cc	3.20 g/cc	ASTM D792
Deformation	10 %	10 %	4 N/cm
	20 %	20 %	8 N/cm
	30 %	30 %	15 N/cm
	40 %	40 %	28 N/cm
	50 %	50 %	52 N/cm

Mechanical Properties	Metric	English	Comments
Hardness, Shore A	35	35	ASTM D2240
Tensile Strength at Break	>= 0.517 MPa	>= 75.0 psi	ASTM D412
Compression Set	40 %	40 %	ASTM D395 Method B 22 hrs 85°C
	40 % @Temperature 85.0 °C, Time 79200 sec	40 % @Temperature 185 °F, Time 22.0 hour	ASTM D395 Method B

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	85.0 °C	185 °F

Electrical Properties	Metric	English	Comments
Volume Resistivity	0.0030 ohm-cm	0.0030 ohm-cm	Initial; Chomerics MAT-1002
	0.0040 ohm-cm	0.0040 ohm-cm	Aged; Chomerics MAT-1002
Shielding Effectiveness	52 dB @Frequency 1.00e+10 Hz	52 dB @Frequency 1.00e+10 Hz	CHO-TP08
	55 dB @Frequency 2.00e+9 Hz	55 dB @Frequency 2.00e+9 Hz	CHO-TP08
	65 dB @Frequency 6.00e+9 Hz	65 dB @Frequency 6.00e+9 Hz	CHO-TP08
	67 dB @Frequency 1.00e+9 Hz	67 dB @Frequency 1.00e+9 Hz	CHO-TP08
	71 dB @Frequency 2.00e+8 Hz	71 dB @Frequency 2.00e+8 Hz	CHO-TP08

Processing Properties	Metric	English	Comments
Extrusion Rate	5.50 g/min	5.50 g/min
Cure Time	18.0 min @Temperature 22.0 °C	0.300 hour @Temperature 71.6 °F	50% RH; Tack Free Time
	240 min @Temperature 22.0 °C	4.00 hour @Temperature 71.6 °F	50% RH; Handling Time
	2880 min @Temperature 22.0 °C	48.0 hour @Temperature 71.6 °F	50% RH; Full Cure

Descriptive Properties	Value	Comments
Cure Mechanism	Moisture
Filler	Ag/Cu
Resin	One Part Silicone
Time for QC Measurements	8 hrs	Electrical Resistance and Adhesion @ 22°C 50% RH

Users viewing this material also viewed the following: