Physical Properties | Metric | English | Comments |
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Density | >= 3.50 g/cc | >= 0.126 lb/in³ | Before Sintering |
NBE nanoTach® Nano-Silver Paste, Lead-Free Solder Alternative NanoTach® is a thick paste of nano-sized silver powder in an organic binder that can be used as an alternative to solder or epoxy in semiconductor devices in the state-of-the-art individual package.. |
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Density | 3.50 g/cc | 0.126 lb/in³ | |
MMCC Al/Al2O3 Continuous Fiber Aluminum Matrix Composite Cast, reinforced aluminum matrix composite. May be fabricated by vacuum infiltration of the ceramic preform.Data provided by the manufacturer, Metal Matrix Cast Composites (MMCC). |
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Density | 3.50 g/cc | 0.126 lb/in³ | |
Schott S8806A Contrast Enhancement Filter Contrast Enhancement FilterInformation Provided by SCHOTT North America, Inc. |
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Density | 3.50 g/cc | 0.126 lb/in³ | ASTM D792 |
Techmer ES HiFill® ABS 0350 Availability: North AmericaFeatures: High DensityForms: PelletsProcessing Method: Extrusion MoldingInformation provided by TP Composites, Inc. |
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Density | 3.50 g/cc | 0.126 lb/in³ | ASTM D792 |
Techmer ES HiFill® ABS HI 350 High Impact Availability: North AmericaForms: PelletsFiller/Reinforcement: Unspecified Filler/ReinforFeatures: High Density and High Impact ResistanceProcessing Method: Injection MoldingInformation provided by .. |
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Density | 3.50 g/cc | 0.126 lb/in³ | |
Trelleborg Emerson & Cuming Eccobond® 56C Two-Component Silver Filled Electrically Conductive Epoxy Adhesive Emerson & Cuming 56C Eccobond® Two-Component Silver Filled Electrically Conductive Epoxy AdhesiveSilver filled, high electrical conductivity, epoxy adhesive. Excellent thermal conductivity. Require.. |
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Density | 3.50 g/cc | 0.126 lb/in³ | |
Trelleborg Emerson & Cuming Eccobond® 57C Two-Component Silver Filled Electrically Conductive Epoxy Adhesive Emerson & Cuming 57C Eccobond® Two-Component Silver Filled Electrically Conductive Epoxy AdhesiveSilver filled, electrically conductive, room temperature curing, epoxy adhesive. Good thermal conduc.. |
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Density | 3.50 g/cc | 0.126 lb/in³ | |
Epoxyset Epoxiohm EO-98HT Electrically Conductive Epoxy Adhesive EO-98HT is a one component, electrically and thermally conductive, snap cure, die attach epoxy. It was designed for IC plastic packaging of semiconductors, hybrid micro-electronics, and photonic dev.. |
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Density | 3.50 g/cc | 0.126 lb/in³ | |
Ceradyne Ceralloy® 6703 MgO-SiC Applications: absorbersbuttonsInformation provided by Ceradyne Company |
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Density | 3.50 g/cc | 0.126 lb/in³ | |
Anderman Ceramics EA99P Sintered Alumina, 99%, Porous Densely sintered alumina is characterized by: high strength and hardness, temperature stability, electrical insulation, and high wear resistance and corrosion resistance even at high temperatures. .. |