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Polymer Property : Particle Size = 50 µm Product List

Physical Properties

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Physical Properties Metric English Comments
Particle Size <= 50 µm
<= 50 µm
90% smaller than
Nyco M15 WOLLASTOCOAT® Wollastonite
Wollastonite is a naturally occurring white mineral with an acicular (needle-shaped) particle structure. This distinctive particle morphology makes wollastonite an ideal performance mineral for a br..
Particle Size 50 µm
50 µm
mean value
Potters Industries Q-Cel® 6048
Performance Benefits: A low-density, performance-enhancing additive.Fewer defects: excellent mold flow, uniform dispersionReduced compound density and viscosityIncreased acoustic and thermal insulat..
Particle Size 50 - 200 µm
50 - 200 µm
spherical sizes available
PPT FP110 Fully Sintered Ferrite Powder
Fully sintered NiZn ferrite, MnZn ferrite, and MgZn ferrite powders are available. Spherical or irregular particle shapes in custom particle sizes are available, ranging from sub-micron to a few hu..
Particle Size 50 - 200 µm
50 - 200 µm
spherical sizes available
PPT FP160 Fully Sintered Ferrite Powder
Fully sintered NiZn ferrite, MnZn ferrite, and MgZn ferrite powders are available. Spherical or irregular particle shapes in custom particle sizes are available, ranging from sub-micron to a few hu..
Particle Size 50 - 200 µm
50 - 200 µm
spherical sizes available
PPT FP215 Fully Sintered Ferrite Powder
Fully sintered NiZn ferrite, MnZn ferrite, and MgZn ferrite powders are available. Spherical or irregular particle shapes in custom particle sizes are available, ranging from sub-micron to a few hu..
Particle Size 50 - 200 µm
50 - 200 µm
spherical sizes available
PPT FP350 Fully Sintered Ferrite Powder
Fully sintered NiZn ferrite, MnZn ferrite, and MgZn ferrite powders are available. Spherical or irregular particle shapes in custom particle sizes are available, ranging from sub-micron to a few hu..
Particle Size 50 - 200 µm
50 - 200 µm
spherical sizes available
PPT FP95 Fully Sintered Ferrite Powder
Fully sintered NiZn ferrite, MnZn ferrite, and MgZn ferrite powders are available. Spherical or irregular particle shapes in custom particle sizes are available, ranging from sub-micron to a few hu..
Particle Size 50 - 60 µm
50 - 60 µm
90%
H.C. Starck Amperit® 105.074 Agglomerated Sintered Molybdenum (Mo)
Particle Size 50 - 60 µm
50 - 60 µm
90%
H.C. Starck Amperit® 559.074 Agglomerated, Sintered Tungsten Carbide-Cobalt-Chromium 86-6-8 (WC-Co-Cr)
Particle Size 50 - 70 µm
50 - 70 µm
Lucite International Colacryl ® PD2 Acrylic Dental Resin
A range of Methyl Methacrylate polymers designed for use as standard heat-curing denture base resins.Features: Fine free-flowing bead polymers containing residual peroxide initiator; Curing cycles f..
Particle Size 50 - 95 µm
50 - 95 µm
Lucite International Lucite® 4F Glass Separation Resin
Improper storage and transport of glass products (e.g. flat glass or fabricated items) can lead to costly damage caused by glass-to-glass abrasion and/or corrosion rendering it unsuitable for end-us..
Particle Size <= 50 µm
<= 50 µm
Ferro CF 7574 Glaze and Sealant Glass
Glass Type: Zn-B-Si Typical Powder Form: VSD Typical Application: Pyrex Silicon Ferro's electronic and specialty glass group has produced over 3,000 formulations. Many are used as protective and ..
Particle Size 50 - 60 µm
50 - 60 µm
90%
H.C. Starck Amperit® 146.3 Chromium (Cr)
HS Number: 81122031
Particle Size 50 µm
50 µm
TEC QSD
Trelleborg AEM Eccospheres® SI-310 Sodium Borosilicate Glass Microspheres
Eccospheres® glass microspheres are hollow thin-walled glass microspheres composed of sodium borosilicate glass. To the naked eye they resemble a fine, white, free-flowing powder. However, magnific..
Particle Size 50 µm
50 µm
TEC QSD
Trelleborg AEM Eccospheres® SID-350Z Sodium Borosilicate Glass Microspheres
Eccospheres® glass microspheres are hollow thin-walled glass microspheres composed of sodium borosilicate glass. To the naked eye they resemble a fine, white, free-flowing powder. However, magnific..
Particle Size <= 50 µm
<= 50 µm
Epoxy Technology EPO-TEK® 430 Epoxy
Product Description: A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for interconnecting, grounding ..
Particle Size <= 50 µm
<= 50 µm
Epoxy Technology EPO-TEK® 431 Copper Filled Epoxy
A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for interconnecting, grounding and EMI RF shielding...
Particle Size <= 50 µm
<= 50 µm
Epoxy Technology EPO-TEK® H44 Gold-Filled, Electrically Conductive Epoxy
Product Description: EPO-TEK® H44 is a single component, gold-filled, electrically conductive epoxy adhesive designed for hybrid microelectronic packaging.Advantages & Application Notes: High visco..
Particle Size <= 50 µm
<= 50 µm
Epoxy Technology EPO-TEK® T7139 Glob Top Epoxy
Product Description: EPO-TEK® T7139 is a two component, electrically insulating, encapsulating epoxy designed for semiconductor glob top applications and package assembly.Advantages & Application N..
Particle Size 50 µm
50 µm
Average D50; Laser Diffraction
ALM PA 850-Nat Nylon 11 SLS Prototyping Polymer
Unfilled PA 11 formulated for easy processing. Can be run as a drop-in replacement for other commercially available PA 11 laser sintering powders. Parts produced from PA 850 exhibit outstanding mech..
Particle Size <= 50 µm
<= 50 µm
uncured
Atom Adhesives AA-BOND G298 Epoxy Adhesive
AA-BOND G298 is a two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging.Appearance: Resin: Brown, Hardener: Dark Bro..
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