Polymer Property : Spiral Flow = 34.6 in Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Spiral Flow	64.0 - 88.0 cm	25.2 - 34.6 in	177°C/1000 psi
Cookson Group Plaskon® 435 Mineral Filled Epoxy Molding Compound (discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.Combines exceptional reliability with wide molding process latitude. This material is designed to encapsulate a variety of semic..
Spiral Flow	64.0 - 88.0 cm	25.2 - 34.6 in	177°C/1000 psi
Cookson Group Plaskon® 440S Mineral Filled Novolac Epoxy Molding Compound (discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.Combines exceptional reliability with wide process latitude. This material is designed to encapsulate a wide range of semiconduc..
Spiral Flow	64.0 - 88.0 cm	25.2 - 34.6 in	177°C/1000 psi
Cookson Group Plaskon® 3100LS Mineral Filled Conventional Encapsulant (discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A semiconductor grade encapsulant suitable for a wide range of applications ranging from small SOICs to moderate lead count DIPs...
Spiral Flow	64.0 - 88.0 cm	25.2 - 34.6 in	177°C/1000 psi
Cookson Group Plaskon® 3200LS Mineral Filled Novolac Epoxy Molding Compound (discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.Exhibits exceptional reliability under very stringent testing. This material is designed to minimize stress on the encapsulated ..