Polymer Property : Viscosity = 10000 cP Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Viscosity	10000 cP @Temperature 25.0 °C	10000 cP @Temperature 77.0 °F	Uncured
Resin Technology Group EN 139-2 UV Gellable, Low Temperature Cure, One-Component Epoxy Adhesive EN 139-2 is a UV gellable, one-component epoxy based adhesive system designed to provide cure at temperatures as low as 80°C. This one-part adhesive gels to a tack-free, low strength polymer upon e..
Viscosity	10000 - 26000 cP	10000 - 26000 cP
Lord Adhesives 202 Semi-Flexible, Fast Cure, Medium Viscosity Acrylic Adhesive Lord 200 SeriesLord 200 Series Acrylic Adhesives bond minimally prepared or unprepared surfaces. They offer excellent adhesion to unprepared metals, ceramic magnets and plastics. Viscosities range f..
Viscosity	10000 - 18000 cP	10000 - 18000 cP
Lord Adhesives 305 General Purpose, Medium Viscosity Epoxy Adhesive Lord Epoxy AdhesivesLordÂ® Epoxy Adhesives create superior bonds for rubber, SMC, plastics and metals. Our epoxy adhesives are widely used in the automotive industry, over 10 million cars and ligh..
Viscosity	10000 cP	10000 cP	Mixed Viscosity
ITW Devcon 5 minuteÂ® Epoxy, Light Amber Information provided by ITW Devcon
Viscosity	10000 - 20000 cP	10000 - 20000 cP	B
ITW Plexus Plexusâ„¢ MA422 Methacrylate Adhesive Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.All purpose adhesive, medium open time.Information provided by Illinois Tool Works.
Viscosity	>= 10000 cP	>= 10000 cP
Lucite International Colacryl Â® LS200 Specialty Acrylic Resin ColacrylÂ® LS200 is a medium-high molecular weight methyl methacrylate polymer. It is used mainly in coating applications where abrasion resistance and resistance to plasticiser migration are impo..
Viscosity	10000 cP	10000 cP	Mixed Viscosity
ITW Devcon Rubber Repair / Castable Urethane Cable Cast FR, Black Information provided by ITW Devcon
Viscosity	10000 - 30000 cP @Shear Rate 50.0 1/s, Temperature 25.0 Â°C	10000 - 30000 cP @Shear Rate 50.0 1/s, Temperature 77.0 Â°F	Bohlin CVO 100
Gwent Electronic Materials C2121119D9 Nanocopper based Paste This product is a nanocopper based paste that is designed for flat bed screens. The product is compatible with printing on PET substrates such as the DuPont Melinex ST-505. Produced using nano-par..
Viscosity	10000 - 30000 cP @Temperature 40.0 Â°C	10000 - 30000 cP @Temperature 104 Â°F
Taiwan PU Corporation PTMG CPU-100L Polyurethane Casting Elastomer A urethane elastomer that can be cured by reacting with a polyamine or a polyolhardener. The molding process is composed of pre-heating, degassing, maxing with a hardener, pouring into the mold, cu..
Viscosity	10000 - 25000 cP @Temperature 40.0 Â°C	10000 - 25000 cP @Temperature 104 Â°F
Taiwan PU Corporation PTMG CPU-325L Polyurethane Casting Elastomer A urethane elastomer that can be cured by reacting with a polyamine or a polyolhardener. The molding process is composed of pre-heating, degassing, maxing with a hardener, pouring into the mold, cu..
Viscosity	10000 - 15000 cP @Temperature 23.0 °C	10000 - 15000 cP @Temperature 73.4 °F
Master Bond EP21AR Acid Resistant Two Component Epoxy Master Bond EP21AR is a two component epoxy resin compound for durable, high performance, coating liner and adhesive/sealant with outstanding acid as well as excellent overall chemical resistance. E..
Viscosity	10000 - 14000 cP	10000 - 14000 cP	Part A
Master Bond EP21LV-LO Two Component, Lower Viscosity, Room Temperature Curing Epoxy System Product Description: Master Bond EP21LV-LO is a two component, lower viscosity, room temperature curing epoxy system for high performance bonding, sealing, coating and encapsulation. This user frien..
Viscosity	10000 - 20000 cP	10000 - 20000 cP	Part B
Master Bond EP37-3FLFAN Electrically Isolating, Flexible Epoxy Description: Master Bond Polymer System EP37-3FLFAN is a two component system for high performance potting, bonding, sealing and coating that is formulated to cure at room temperature or more rapidl..
Viscosity	10000 - 14000 cP	10000 - 14000 cP	Part A
Master Bond EP62-1Med USP Class VI Two Component Epoxy Resin System Master Bond EP62-1Med is a two component epoxy system that has an exceptionally long working life at ambient temperatures and cures rapidly at moderately elevated temperatures. It has a 100 to 10 mi..
Viscosity	10000 cP @Temperature 25.0 °C	10000 cP @Temperature 77.0 °F	Mixed (sp #4, 12 rpm)
Tra-Con Tra-Bond 2248 High Temperature Epoxy Staking Adhesive TRA-BOND 2248 is a thixotropic, high temperature cure, 100% solids epoxy resin system that provides strong, tough bonds between a wide range of materials (includes metals, glass, ceramics, and many ..
Viscosity	10000 cP	10000 cP	Mixed
Tra-Con Tra-Bond Ablebond 481-20 B-Stageable Epoxy Adhesive Ablebond 481-20 flexible epoxy adhesive is a modification of Ablebond 481-19 adhesive. This adhesive is designed to absorb stresses between adherends with mismatched coefficients of thermal expansio..
Viscosity	10000 cP @Temperature 25.0 °C	10000 cP @Temperature 77.0 °F
Cytec (Conap) FR-1272 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
Viscosity	10000 cP @Temperature 25.0 °C	10000 cP @Temperature 77.0 °F
Cytec (Conap) RN-1210 / EA-02 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
Viscosity	10000 - 14000 cP @Temperature 23.0 °C	10000 - 14000 cP @Temperature 73.4 °F	20 rpm
Epoxy Technology EPO-TEK® 730 Unfilled Black General and Structural Grade Epoxy Material Description: A two component, room temperature curing, general and structural grade epoxy. It can be used for adhesive, sealing, and encapsulating applications in medical, xray device, fil..
Viscosity	10000 - 15000 cP	10000 - 15000 cP
Epoxyset Epoxiohm EO-97M Electrically Conductive Epoxy Adhesive EPOXIOHM-97M is one part, pure silver filled, high electrical conductivity, epoxy adhesive. It is designed for microelectronics chip bonding application.Information provided by Epoxyset Inc.
Viscosity	10000 cP	10000 cP	T
Dymax 628 Structural Adhesive Structural Adhesives for Rugged Bonding, Sealing, Tacking and Potting in SecondsMulti-Cure® 600 Series products are rapid setting adhesives that cure by UV light, activator or heat. These products ..
Viscosity	10000 cP	10000 cP
3M Scotch-Weld™ 1838L B/A Two-Part Structural Adhesive Multi-purpose and Rigid bondsInformation provided by 3M
Viscosity	10000 - 25000 cP	10000 - 25000 cP
Aremco Ceramabond™ 632 High Temperature Ceramic Adhesive/Paste, Mica Filled Aremco's ceramic adhesives are easy to use, one- and two-component systems which air dry in 1-2 hrs and are ready for use following a 200 to 700 °F cure. These materials are mostly water-based and..
Viscosity	10000 cP	10000 cP
Aremco Ceramacast™ 645-N High Temperature Potting & Casting Material Silica Castable ceramic with low thermal conductivity.
Viscosity	10000 - 20000 cP	10000 - 20000 cP	B
ITW Plexus Plexus™ MA925 Methacrylate Adhesive Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.All purpose, low odor, long open time.Information provided by Illinois Tool Works.
Viscosity	10000 cP	10000 cP
Fibre Glast 88 / 87 General Purpose Epoxy Resin and Hardener (discontinued **) Description:#88 Epoxy Resin is a 100% reactive low viscosity liquid bisphenol-A based epoxy resin diluted with Alkyl glycidyl ether. This resin is specially designed for applications requiring low v..
Viscosity	10000 - 15000 cP	10000 - 15000 cP
Lucite International Colacryl ® TS1171 Acrylic Solution Resin Butyl methacrylate-Methyl methacrylate copolymerThis product is a fairly soft and flexible copolymer with reasonable abrasion resistance. It has good UV resistance and is therefore suitable for outd..