Physical Properties | Metric | English | Comments |
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Viscosity | 16000 cP @Shear Rate 11200 1/s, Temperature 200 °C |
16000 cP @Shear Rate 11200 1/s, Temperature 392 °F |
ASTM D3835 |
PolyOne Versaflex™ CL40 Thermoplastic Elastomer (TPE) Versaflex™ CL40 is an easy processing compound designed for use in injection molding applications where water-clarity and excellent colorability are required. - Excellent Clarity - Excellent Colora.. |
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Viscosity | 16000 cP @Shear Rate 11200 1/s, Temperature 200 °C |
16000 cP @Shear Rate 11200 1/s, Temperature 392 °F |
ASTM D3835 |
PolyOne Versaflex™ OM 9-802CL Thermoplastic Elastomer (TPE) Versaflex™ OM 9-802CL is a clear, soft touch TPE designed to bond to the following thermoplastics: PC, ABS, PC/ABS and copolyester. New Product. Commercial specifications have not been established... |
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Viscosity | 16000 - 18000 cP @Temperature 25.0 °C |
16000 - 18000 cP @Temperature 77.0 °F |
Uncured |
Permabond TA436 Toughened Acrylic Adhesive PERMABOND TA436 is a structural acrylic adhesive designed primarily for bonding metals, ferrites, ceramics and some thermoplastics. Permabond TA436 is a no-mix system which obtains handling strength.. |
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Viscosity | 16000 cP | 16000 cP | Part A |
Resinlab® EP691 Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP 691 Black is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wetting.. |
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Viscosity | 16000 cP | 16000 cP | Part A, RVT, #6, 2.5 rpm; TM R050-12 |
Resinlab® EP750 Clear Unfilled Epoxy Structural Adhesive Resinlab™ EP750 Clear is a two part unfilled epoxy structural adhesive which ingredients are listed in the Code of Federal Regulations Title 21 175.105 (Adhesives) and 175.300 (Resinous and polymer.. |
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Viscosity | 16000 cP | 16000 cP | Part A, RVT, #6, 20 rpm; TM R050-12 |
Resinlab® EP965 Clear Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965 Clear is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wetting .. |
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Viscosity | 16000 - 20000 cP | 16000 - 20000 cP | |
Huntsman Araldite GY 6020 Bisphenol A Epoxy Liquid Resin Weight per Epoxide (EEW, g/eq) 185 to 200. Max color is 1.Comments/Applications: Higher viscosity GY 6010, unmodified. General purpose higher viscosity resin.Data provided by Ciba Specialty Chemic.. |
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Viscosity | 16000 cP | 16000 cP | |
Momentive Performance Materials RTV511 Silicone Rubber Compound for Low Temperature Potting, Encapsulating and Sealing, White RTV511, RTV560 and RTV577 silicone rubber compounds are low temperature two-part silicone elastomers. They are supplied ready to use with a base compound and DEBT (deputy tin deflagrate) as the stan.. |
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Viscosity | 16000 cP @Temperature 25.0 °C |
16000 cP @Temperature 77.0 °F |
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Momentive Performance Materials RTV511 White Extreme Low Temperature Potting/Encapsulating Compound Two-part condensation cure. Two-part condensation cure silicones RTVs are designed to cute at room temperature, and can be applied at temperature up to one inch (2.5 cm). These are very tough mate.. |
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Viscosity | 16000 cP @Shear Rate 10994 1/s, Temperature 210 °C |
16000 cP @Shear Rate 10994 1/s, Temperature 410 °F |
ASTM D3835 |
STAR Thermoplastic Alloys & Rubbers StarMediflex P 7090-1000 TPE Product Description: StarMediflex P 7090-1000 is an easy processing TPE designed for injection molding. This particular class of TPE material for medical products and tubing applications. Features:S.. |
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Viscosity | 16000 cP | 16000 cP | Mixed (lv #4, 12 rpm) |
Tra-Con Tra-Bond 216C03 Flexible Plastic Bonder TRA-BOND 216C03 is a flexible thixotropic bonding adhesive designed for bonding all types of plastics including nylon, PVC, polyethylene, acrylic, lexan, polypropylene, kapton or almost any thermopl.. |
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Viscosity | 16000 cP | 16000 cP | Mixed (cp #52, 5 rpm) |
Tra-Con Tra-Duct 8205 One-Part Electrically Conductive Silver-Filled Epoxy TRA-DUCT 8205 is an electrically conducting silver-filled epoxy compound recommended for electronic bonding and sealing applications that require a combination of excellent mechanical and electrical.. |
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Viscosity | 16000 cP | 16000 cP | dynamic, mixing |
Dow Corning HS III BASE & 10:1 CLEAR CATALYST High strength lower durometer silicone mold making rubber, suited for the detailed reproduction of fiines, art objects and similar items. HS III Base with HS III 10:1 Clear Catalyst is recommended f.. |
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Viscosity | 16000 cP | 16000 cP | dynamic, part B |
Dow Corning HV 1540/20P BASE AND CLEAR CURING AGENT 32 Shore, very low viscosity, castable hydrophobic silicone rubber with high tear strength and low temperature cure.Information provided by Dow Corning |
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Viscosity | 16000 cP | 16000 cP | |
3M Jet-Weld™ TE-030 Adhesive A warm applied, moisture-curing polyurethane adhesive for wood working, laminating and plastic component assembly. Extrudable grade with fast set time ideal for bonding wood. Can bond selected plas.. |
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Viscosity | 16000 cP | 16000 cP | Mixed |
Aremco Ceramacast™ 673 Castable Ceramic Chemical setting. Two-part ceramic exhibiting high thermal conductivity. Used to pot small temperature sensors, gas igniters, and high intensity lights. Applied in areas up to 1" diameter by 1" de.. |
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Viscosity | 16000 cP @Temperature 25.0 °C |
16000 cP @Temperature 77.0 °F |
at 100/35 (50-3/50-1) pbw |
Abatron AboCast 50-3/AboCure 50-1 Epoxy Data provided by the manufacturer, Abatron, Inc. Honey viscosity, light amber color. Best combination of high strength and versatility for Abatron "VR" Epoxies. Shelf life is 12+ months.Processin.. |
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Viscosity | 16000 cP | 16000 cP | |
3M Jet-Weld™ TE-115 HGS Adhesive A warm applied, moisture-curing polyurethane adhesive for wood working, laminating and plastic component assembly. Sprayable/extrudable/roll coatable grade with fast set time, ideal for bonding a va.. |
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Viscosity | 16000 cP | 16000 cP | mixed viscosity |
Aremco Aremco-Bond™ 2318 High Performance Epoxide |
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Viscosity | 16000 cP | 16000 cP | Mixed. Ratio 100-to-19-22 powder-liquid |
Aremco Ceramacast™ 575 Alumina Fine Grain Potting Compound Hydraulic setting. Fine grain castable for potting and producing small tools. Used in the production of temperature probes, electrical feed-throughs, large heat treating fixtures, induction coils .. |
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Viscosity | 16000 cP | 16000 cP | Part A, RVT, #6, 2.5 rpm; TM R050-12 |
Resinlab® EP1026 Clear Epoxy Adhesive Resinlab™ EP1026 Clear is a two part unfilled epoxy adhesive designed for high speed bonding of metals, ceramics, and most plastics. It cures to a tough semi-rigid material, and is free flowing in .. |
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Viscosity | 16000 cP | 16000 cP | Part B, RVT, #6, 20 rpm; TM R050-12 |
Resinlab® EP1200LV Casting Resin Resinlab™ EP1200LV a low viscosity version of EP1200, a highly filled, medium viscosity black casting resin designed for applications requiring a high degree of thermal conductivity, flexibility an.. |
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Viscosity | 16000 cP | 16000 cP | Part A, RVT, #6, 2.5 rpm; TM R050-12 |
Resinlab® EP1300 Clear Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP1300 Clear (Formerly Lab Product W092602) is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It has a pot life of about one hour and .. |
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Viscosity | 16000 cP | 16000 cP | Part A, RVT, #6, 20 rpm; TM R050-12 |
Resinlab® EP691 Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP691 is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wetting and ad.. |
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Viscosity | 16000 cP | 16000 cP | Part A, RVT, #6, 20 rpm; TM R050-12 |
Resinlab® EP965 Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965 Black is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wetting .. |
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Viscosity | 16000 cP | 16000 cP | Part A, RVT, #6, 20 rpm; TM R050-12 |
Resinlab® EP965SC-7 Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965SC-7 Black is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wett.. |
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Viscosity | 16000 cP | 16000 cP | Part A, RVT, #6, 20 rpm; TM R050-12 |
Resinlab® EP965SC-7 Clear Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965SC-7 Clear is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wett.. |
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Viscosity | 16000 cP | 16000 cP | Part A, RVT, #6, 2.5 rpm; TM R050-12 |
Resinlab® EP1115 Clear Unfilled Epoxy Adhesive Resinlab™ EP1115 Clear is a two part unfilled epoxy adhesive designed for bonding of metals, ceramics and most plastics. This product gives good resistance to water, salt spray, inorganic acids and.. |