Polymer Property : Viscosity = 300000 cP Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Viscosity	100000 - 300000 cP @Temperature 25.0 °C	100000 - 300000 cP @Temperature 77.0 °F	Uncured
Permabond ES558 Epoxy Resin PERMABOND ES558 is a single-part epoxy paste which flows like solder when heated during curing. The adhesive is toughened for maximum impact resistance, along with excellent peel and shear strength...
Viscosity	100000 - 300000 cP	100000 - 300000 cP
Lord Adhesives 204 Semi-Flexible, Medium Cure, High Viscosity Acrylic Adhesive Lord 200 SeriesLord 200 Series Acrylic Adhesives bond minimally prepared or unprepared surfaces. They offer excellent adhesion to unprepared metals, ceramic magnets and plastics. Viscosities range f..
Viscosity	100000 - 300000 cP	100000 - 300000 cP
Lord Adhesives 406 Flexible, High Impact and Peel Resistance, Medium Working Time Acrylic Adhesive Lord 400 SeriesLord 400 Series Acrylic Adhesives offer extremely high impact and peel strength. The bond minimally prepared metals and plastics, and achieve high shear strengths. They also provide e..
Viscosity	150000 - 300000 cP	150000 - 300000 cP
Lord Adhesives 513 Fast Cure, Non-Sagging Acrylic Adhesive Lord 500 SeriesLord 500 Series Acrylic Adhesives bond plastics and prepared metals; they offer excellent adhesion to both thermoplastics and thermoset plastics. They are available with varying handi..
Viscosity	180000 - 300000 cP	180000 - 300000 cP
Lord Adhesives 648 Low Odor, Low Flammability, Non Sag, Metal Use Acrylic Adhesive Lord Adhesives 648 Low Odor, Low Flammability, Non Sag, Metal Use Acrylic Adhesive
Viscosity	200000 - 300000 cP	200000 - 300000 cP	Part A
Master Bond Supreme 11AOHTLO Epoxy Passes NASA Low Outgassing Tests Description: Master Bond Supreme 11AOHTLO is a two component epoxy resin system for high performance bonding and sealing. Although, it is formulated to cure at room temperature, the best cure schedu..
Viscosity	250000 - 300000 cP @Temperature 23.0 °C	250000 - 300000 cP @Temperature 73.4 °F	0.5 rpm
Epoxy Technology EPO-TEK® H81A Epoxy Material Description: A two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging.Information Provided by Epoxy Technolo..