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- Polymer Property : Viscosity = 60000 cP
Polymer Property : Viscosity = 60000 cP Product List
Physical PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Viscosity | 60000 cP | 60000 cP | initial; ASTM D1084 |
| Multibase SILASTIC® MDX4-4210 Dow-Corning Biomedical Grade Elastomer Information provided by Multibase |
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| Viscosity | 60000 cP | 60000 cP | |
| Resin Technology Group 160-EX Oxy-Bond™ Two-Component Epoxy Adhesive Oxy-Bond and Millenium Adhesive SystemsEngineered for strength, durability, lightness, and formability, our Oxy-Bond and Millenium lines offer adhesives with physical and electrical properties to ma.. |
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| Viscosity | 60000 cP | 60000 cP | |
| Lord Adhesives Thermosetâ„¢ MD-130 Electrically Insulating Die-Attach Adhesive Lord MD-130 is a microelectronic grade, die-attach adhesive system for use in applications where electrical conductivity is not required. This system offers long, room temperature stability, fast cu.. |
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| Viscosity | 60000 cP @Shear Rate 1000 1/s, Temperature 400 °C |
60000 cP @Shear Rate 1000 1/s, Temperature 752 °F |
Melt Viscosity; ASTM D3835 |
| Solvay Specialty Polymers AvaSpire® AV-848 GF30 Polyaryletherketone (PAEK), 30% Glass Fiber AvaSpire® AV-848 GF30 is a 30% glass fiber-reinforced, high-temperature, polyaryletherketone (PAEK) that has been specifically formulated to provide several performance advantages over comparable.. |
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| Viscosity | 60000 cP | 60000 cP | |
| Shin-Etsu Silicones KE-1867 Silicone, RTV Adhesive/Sealant Information Provided by Shin-Etsu Silicones of America, Inc. |
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| Viscosity | 60000 cP | 60000 cP | A |
| Shin-Etsu Silicones LIMSâ„¢ KE1950-10A/B Elastomer KE-1950-10 is a liquid injection molding silicone. It is supplied as two components which are mixed in a 1:1 ratio to ensure easy and accurate blending. It's viscosity is low enough to allow easy .. |
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| Viscosity | 60000 cP | 60000 cP | B |
| Shin-Etsu Silicones LIMSâ„¢ KE1950-10A/B Elastomer KE-1950-10 is a liquid injection molding silicone. It is supplied as two components which are mixed in a 1:1 ratio to ensure easy and accurate blending. It's viscosity is low enough to allow easy .. |
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| Viscosity | 60000 - 110000 cP | 60000 - 110000 cP | Part A |
| Master Bond EP21ARHT Two component epoxy adhesive, sealant, coating and encapsulating system Product Description: Master Bond EP21ARHT is a two component epoxy resin system for high performance bonding, sealing, coating and encapsulating. It has a convenient 100 to 50 mix ratio by weight an.. |
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| Viscosity | 60000 - 110000 cP | 60000 - 110000 cP | Part A |
| Master Bond EP21TDCHT-LO Room Temperature Curing, Toughened Two Component Epoxy Master Bond Polymer Adhesive EP21TDCHT-LO is a two component epoxy adhesive formulated to cure at room temperature or more rapidly at elevated temperatures, with a very forgiving and convenient one .. |
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| Viscosity | 60000 - 110000 cP | 60000 - 110000 cP | Part A |
| Master Bond EP30ANHT Two Part, Electrically Isolating Epoxy Adhesive Description: Master Bond Polymer System EP30ANHT is a two part epoxy system with terrific thermal conductivity, while maintaining electrical insulation. One noteworthy property is its wide service t.. |
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| Viscosity | 60000 - 110000 cP | 60000 - 110000 cP | Part A |
| Master Bond EP41S-1HT Solvent Resistant Adhesive, Sealant and Coating Description: Master Bond EP41S-1HT is a two component epoxy resin system for high performance bonding, sealing, coating and encapsulating. It has a 100 to 30 mix ratio by weight and is formulated to.. |
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| Viscosity | 60000 - 110000 cP | 60000 - 110000 cP | Part A |
| Master Bond Ep46HT-2 Two Component, Heat Resistant Epoxy System Master Bond Polymer System EP46HT-2 is a two component epoxy system for bonding, sealing and casting applications where resistance to temperatures from -100°F to +500°F is required. It is 100% rea.. |
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| Viscosity | 60000 - 70000 cP @Temperature 23.0 °C |
60000 - 70000 cP @Temperature 73.4 °F |
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| Master Bond EP51HT Fast Curing High Temperature Resistant Epoxy Adhesive Master Bond Polymer Adhesive EP51HT represents a significant advance in epoxy adhesive technology featuring an excellent balance of performance properties, including convenient curing at ambient tem.. |
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| Viscosity | 60000 - 80000 cP | 60000 - 80000 cP | |
| Master Bond LED401LV One Component, Moderate Viscosity LED Curable System Master Bond LED401LV is a very special, one part LED type system that will cure when exposed to a light source emitting 405 nm wavelength and where the presence of any UV light is minimal or inciden.. |
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| Viscosity | 60000 cP | 60000 cP | Mixed (rv #7, 10 rpm) |
| Tra-Con Tra-Bond 2112 Rigid Epoxy Staking Compound TRA-BOND 2112 is a thixotropic epoxy system recommended for critical electronic, aerospace and industrial bonding, laminating and reinforcing applications requiring an adhesive with high-fill, non-s.. |
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| Viscosity | 60000 cP @Temperature 25.0 °C |
60000 cP @Temperature 77.0 °F |
After mixing |
| Tra-Con Tra-Bond 2122 Metal Repair Aluminum Epoxy Adhesive TRA-BOND 2122 is a versatile aluminum metal filled epoxy formulation developed for modern industrial casting, bonding and repair applications where a strong aluminum-like adhesive is required. This .. |
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| Viscosity | 60000 cP @Temperature 25.0 °C |
60000 cP @Temperature 77.0 °F |
After mixing |
| Tra-Con Tra-Bond 2147 Thixotropic Epoxy/Polyamide Adhesive TRA-BOND 2147 is a thixotropic (thick paste) polymer epoxy/polyamide system developed for industrial adhesive and sealing applications where the combination of high fill, easy handling, good wetting.. |
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| Viscosity | 60000 cP @Temperature 25.0 °C |
60000 cP @Temperature 77.0 °F |
After mixing |
| Tra-Con Tra-Bond 2110 High Impact Epoxy Staking Compound TRA-BOND 2110 is a thixotropic epoxy resin and hardener formulation developed for industrial adhesive, staking, laminating, repair and manufacturing applications where long pot-life, good wetting, n.. |
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| Viscosity | 60000 cP @Temperature 25.0 °C |
60000 cP @Temperature 77.0 °F |
Mixed (rv #7, 50 rpm) |
| Tra-Con Tra-Bond 2204 Information provided by Tra-Con Inc. |
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| Viscosity | 60000 cP | 60000 cP | Part B |
| Loctite® 3035™ Polyolefin Bonder Loctite® 3035™ Polyolefin Bonder is an easy-to-use, 1:1 mix product that can be stored at room temperature and works where traditional low surface energy bonders often fail. Loctite® 3035™ Polyo.. |
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| Viscosity | 60000 cP | 60000 cP | |
| ACC MM240T Addition Cure 2-Part Molding Rubber Part of the Amber Chemical Group. Data provided by manufacturer.Characteristics: cures at room temperature, low shrinkage, high tear and tensile strengths. Applications: rapid prototyping. |
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| Viscosity | 60000 cP | 60000 cP | |
| Atom Adhesives AA-BOND 2112 Epoxy Adhesive AA-BOND 2112 is a thixotropic epoxy system recommended for critical electronics, aerospace and industrial bonding, laminating and reinforcing applications requiring an adhesive with high-fill, non-s.. |
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| Viscosity | 60000 - 80000 cP | 60000 - 80000 cP | |
| Aremco Ceramacoat™ 512-N High Temperature Potting & Casting Material Silica Viscous, off-white paste for circuit breakers, power resistors and solenoids to 240°F (1316°C) |
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| Viscosity | 60000 cP | 60000 cP | |
| Aremco EZ-Cast™ 580N Silicon Molding Compound Silicone Rubber Aremco's EZ-Cast™ 580N is an ideal compound for producing high reliability master molds. This silicone rubber compound exhibits high tear strength, very low shrinkage and high flexibility, all requ.. |
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| Viscosity | 60000 - 130000 cP | 60000 - 130000 cP | Accelerator |
| 3M Scotch-Weld™ DP420 Black Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive are high performance, two-part epoxy adhesives offering outstanding shear and peel adhesion, and very high levels of durability.Information provided by 3M |
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