Polymer Property : Viscosity = 110000 cP Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Viscosity	170 - 110000 cP @Temperature 40.0 - 175 °C	170 - 110000 cP @Temperature 104 - 347 °F	Average value: 13800 cP Grade Count:12
Overview of materials for Epoxy Encapsulant, Unreinforced This property data is a summary of similar materials in the MatWeb database for the category "Epoxy Encapsulant, Unreinforced". Each property range of values reported is minimum and maximum values o..
Viscosity	80000 - 110000 cP	80000 - 110000 cP	A
ITW Plexus Plexusâ„¢ MA822 Methacrylate Adhesive Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.Designed for structural bonding of metals without primers.Information provided by Illinois Tool Wo..
Viscosity	50000 - 110000 cP	50000 - 110000 cP	Part B
Master Bond EP21ANHT Two Component, Room Temperature Curing Epoxy Adhesive Product Description: Master Bond Polymer Adhesive EP21ANHT is a two component room temperature curing adhesive, sealant and coating that combines high thermal conductivity and electrical insulation ..
Viscosity	60000 - 110000 cP	60000 - 110000 cP	Part A
Master Bond EP21ARHT Two component epoxy adhesive, sealant, coating and encapsulating system Product Description: Master Bond EP21ARHT is a two component epoxy resin system for high performance bonding, sealing, coating and encapsulating. It has a convenient 100 to 50 mix ratio by weight an..
Viscosity	60000 - 110000 cP	60000 - 110000 cP	Part A
Master Bond EP21TDCHT-LO Room Temperature Curing, Toughened Two Component Epoxy Master Bond Polymer Adhesive EP21TDCHT-LO is a two component epoxy adhesive formulated to cure at room temperature or more rapidly at elevated temperatures, with a very forgiving and convenient one ..
Viscosity	60000 - 110000 cP	60000 - 110000 cP	Part A
Master Bond EP30ANHT Two Part, Electrically Isolating Epoxy Adhesive Description: Master Bond Polymer System EP30ANHT is a two part epoxy system with terrific thermal conductivity, while maintaining electrical insulation. One noteworthy property is its wide service t..
Viscosity	55000 - 110000 cP	55000 - 110000 cP	Part A
Master Bond EP30HT-LO NASA Low Outgassing, Optically Clear Coating Description: Master Bond EP30HT-LO is a moderate viscosity, two component epoxy adhesive formulated to cure at room temperature or more rapidly at elevated temperatures, with a four to one mix ratio..
Viscosity	60000 - 110000 cP	60000 - 110000 cP	Part A
Master Bond EP41S-1HT Solvent Resistant Adhesive, Sealant and Coating Description: Master Bond EP41S-1HT is a two component epoxy resin system for high performance bonding, sealing, coating and encapsulating. It has a 100 to 30 mix ratio by weight and is formulated to..
Viscosity	60000 - 110000 cP	60000 - 110000 cP	Part A
Master Bond Ep46HT-2 Two Component, Heat Resistant Epoxy System Master Bond Polymer System EP46HT-2 is a two component epoxy system for bonding, sealing and casting applications where resistance to temperatures from -100°F to +500°F is required. It is 100% rea..
Viscosity	55000 - 110000 cP	55000 - 110000 cP	Part A
Master Bond EP65HT Fast Setting Epoxy Resists High Temperatures Description: Master Bond EP65HT represents a highly innovative advance in epoxy technology in that it features the unusual combination of very fast cures and high temperature resistance. While typic..
Viscosity	55000 - 110000 cP	55000 - 110000 cP	Part A
Master Bond EP30M4 Chemically Resistant Two Component Epoxy System Master Bond Polymer System EP30M4 is a two component epoxy system for high performance bonding, sealing and encapsulation. This system features a forgiving 100 to 60 mix ratio by weight. EP30M4 resi..
Viscosity	90000 - 110000 cP @Temperature 23.0 °C	90000 - 110000 cP @Temperature 73.4 °F	2.5 rpm
Epoxy Technology EPO-TEK® H35-175MPT Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H35MPT is a single component, silver-filled, electrically conductive epoxy designed for military hybrid die and component attach. High viscosity version of EPO-TEK® H..
Viscosity	80000 - 110000 cP @Temperature 23.0 °C	80000 - 110000 cP @Temperature 73.4 °F	2.5 rpm
Epoxy Technology EPO-TEK® H37-MPT Epoxy Material Description: A single component, silver-filled and electrically conductive adhesive designed for semiconductor die attach and bonding SMDs for hybrid microelectronic packaging. It is certi..