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- Polymer Property : Glass Transition Temp, Tg = 257 °F
Polymer Property : Glass Transition Temp, Tg = 257 °F Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Glass Transition Temp, Tg | 125 - 127 °C | 257 - 261 °F | Average value: 126 °C Grade Count:3 |
| Overview of materials for Nylon, Barrier Film Copolymer This property data is a summary of similar materials in the MatWeb database for the category "Nylon, Barrier Film Copolymer". Each property range of values reported is minimum and maximum values of .. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | ISO 11357-2 |
| Menzolit Menzolit® BMC 0800 Unsaturated Polyester UP BMC 0800 is a special SMC for applications within household and kitchenware. The glass level has been selected to combine good mould ability with good strength and stiffness properties. The product .. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | ISO 11357-2 |
| Menzolit Menzolit® BMC 1000 Unsaturated Polyester UP BMC 1000 is a special BMC for hydrolysis resistant applications. The glass content is set to a level that provides sufficient mouldability with high strength and stiffness properties. Typical applic.. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | ISO 11357-2 |
| Menzolit Menzolit® SMC 0800 Unsaturated Polyester UP SMC 0800 is a special SMC for applications within househould and kitchenware. The glass level has been selected to combine good mouldability with good strength and stiffness properties. The product .. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | |
| GrafTech GRAFCELL® FFP-100 SERIES Flow Field Plate Graphite Manufactured from expanded natural graphite, GRAFCELL® Flow Field Plate (FFP) components retain a continuous graphitic phase. This phase continuity, combined with a low contact resistance, provid.. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | |
| GrafTech GRAFCELL® FFP-300 SERIES Flow Field Plate Graphite Manufactured from expanded natural graphite, GRAFCELL® Flow Field Plate (FFP) components retain a continuous graphitic phase. This phase continuity, combined with a low contact resistance, provid.. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | TMA |
| Lord Adhesives Circalokâ„¢ EP-937 Epoxy Board Level Encapsulant LORD Thermosetâ„¢ EP-937 encapsulant is a black, one-component epoxy specifically designed to meet the needs of coating semiconductor devices on printed circuit boards.All information provided by.. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | 10°C/min; ISO 11357-1/-2 |
| Kuraray Genestarâ„¢ G1352A-M41 Nylon, 35% Glass Filled Low friction reinforced injection grade.Main Features:Low friction coefficientAbrasion resistanceExamples of applications:Friction and wear applicationGear and wheel |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | 10°C/min; ISO 11357-1/-2 |
| Kuraray Genestarâ„¢ G1500A-M61 Nylon, 50% Glass Filled 50% Glass reinforced injection grade. Main Features:High strengthHeat resistanceExamples of applications:Structural partsSteel alternating parts |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | |
| Kuraray Genestarâ„¢ GA2330 Nylon, 33% Glass Filled Abrasion Resistance V-0 Grade. Can be used for applications requiring high abrasion and heat resistance, as well as flame retardancy, such as internal gear of copying machine. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | |
| Kuraray Genestarâ„¢ GN2330 Nylon, 33% Glass Filled Standard V-0 Grade. Features a balance of mechanical strength, mold-ability, and dimensional stability. Well suited for a wide range of electrical and electronic components. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | |
| Kuraray Genestarâ„¢ GP2450NH-2 Nylon, 45% Glass Filled Standard V-0 Grade. Halogen free, following the standards that Br is less than 900ppm, Cl is less than 900ppm, and total of halogen amount (Br and Cl) is less than 1500ppm.This grade meets UL94, V-0.. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | |
| Kuraray Genestarâ„¢ GW2458HF Nylon, 45% Glass Filled Low Warpage, High Flow V-0 Grade. It is suited for low warpage and high flow applications, making it well suited for card connectors. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | 10°C/min; ISO 11357-1/-2 |
| Kuraray Genestarâ„¢ N1001D-U83/02 Nylon Standard unreinforced extrusion grade. Main Features:Outstanding fuel barrierHeat resistanceExample of applications:Multi-layered fuel tube |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | 10°C/min; ISO 11357-1/-2 |
| Kuraray Genestarâ„¢ N1006A-M41 Nylon Impact modified unreinforced injection grade. Main Features:High elongationHigh impact strengthExamples of applications are:Retainers for quick connectorFlexible band |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | 10°C/min; ISO 11357-1/-2 |
| Kuraray Genestarâ„¢ N1006D-H31 Nylon Standard unreinforced extrusion grade. Main Features:Chemical resistanceLong term heat resistanceExample of applications:Tube applications |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | |
| Mitsui Arlen™ A315 15% Glass Fiber-Reinforced Modified Nylon 6T (DAM) ARLEN™ is a heat resistant, modified polyamide 6T developed by Mitsui Chemicals, Inc. With a high melting point (320°C) and a rigidity level comparable to super engineering plastics, it poss.. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | |
| Mitsui Arlen™ A335 35% Glass Fiber-Reinforced Modified Nylon 6T (COND) ARLEN™ is a heat resistant, modified polyamide 6T developed by Mitsui Chemicals, Inc. With a high melting point (320°C) and a rigidity level comparable to super engineering plastics, it poss.. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | |
| Mitsui Arlen™ A350 50% Glass Fiber-Reinforced Modified Nylon 6T (DAM) ARLEN™ is a heat resistant, modified polyamide 6T developed by Mitsui Chemicals, Inc. With a high melting point (320°C) and a rigidity level comparable to super engineering plastics, it poss.. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | |
| Mitsui Arlen™ AE4200 Modified Nylon 6T, for Tribolic Applications (COND) ARLEN™ is a heat resistant, modified polyamide 6T developed by Mitsui Chemicals, Inc. With a high melting point (320°C) and a rigidity level comparable to super engineering plastics, it poss.. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | MCI Method |
| Mitsui APELâ„¢ APL6013T Cyclo Olefin Copolymer (COC) This material possesses many characteristics inherent in polyolefins such as excellent electrical insulating properties and outstanding moisture resistance. In addition, it features good melt proces.. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | TMA |
| Lord Adhesives Circalokâ„¢ EP-939 Epoxy Board Level Encapsulant LORD Thermosetâ„¢ EP-939 encapsulant is a black, one-component epoxy specifically designed to meet the needs of coating semiconductor devices on printed circuit boards.All information provided by.. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | ASTM E1356 |
| Solvay Specialty Polymers Hyflon® AD 60 Perfluoropolymer Hyflon® AD 60 is an amorphous perfluoro-polymer available in powder form.Hyflon® AD polymers resemble semicrystalline perfluoropolymers in their performance properties as they exhibit high tem.. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | Ultimate Tg, 10°C/min; DSC |
| Tra-Con Tra-Bond F202HV Spectrally Transparent Thixotropic Epoxy Adhesive TRA-BOND F202 is a clear, thixotropic epoxy adhesive recommended for photonic applications requiring exposure to high temperatures or chemical and environmental resistance. This 100% solids system e.. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | Ultimate Tg |
| Tra-Con Tra-Bond FDA25 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-25 is a medium viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Admi.. |
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| Glass Transition Temp, Tg | >= 125 °C | >= 257 °F | with post cure |
| Master Bond UV15DC80 One Component, UV and Heat Curable Epoxy System Master Bond UV15DC80 is a special dual cure epoxy based system which offers a primary cure utilizing UV light along with a secondary heat curing mechanism. This system addresses the problem of curin.. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | ASTM D3418 |
| DuPont Selar® PA 2072 Nylon Barrier Resin Selar® PA 2072 is an amorphous nylon (polyamide) resin which is specially designed for blending with ethylene vinyl alcohol (EVOH) copolymers. Selar® PA 2072 can be tumble-blended with most grades.. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | DAM (SSYS) |
| Proto3000 PC-ABS Fused Deposition Modeling Polymer Description: PC-ABS (polycarbonate-ABS) is one of the most widely used industrial thermoplastics. PC-ABS offers the most desirable properties of both materials - the superior strength and heat resis.. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | |
| Kuraray Genestar™ GN2450 Nylon, 45% Glass Filled High Strength V-0 Grade. Features a high strength and modulus. It is well suited for FPC sliders and IC sockets, as well as other components that require modulus and dimensional precision. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | |
| Kuraray Genestar™ GR2300 Nylon, 30% Glass Filled Standard V-0 Grade. Delivers increased fluidity and weld strength. Well suited for a wide range of electrical and electronic components. |
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