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Polymer Property : Glass Transition Temp, Tg = 125 °C Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Glass Transition Temp, Tg | 125 °C | 257 °F | DMA |
| Quantum Composites QC-8700 63% Glass Fiber Reinforced Vinyl Ester SMC QC-8700 is a vinyl ester engineered structural composite molding compound for compression molding of components requiring high structural strength. It exhibits unusual toughness, and is suggested f.. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | |
| Permabond ES558 Epoxy Resin PERMABOND ES558 is a single-part epoxy paste which flows like solder when heated during curing. The adhesive is toughened for maximum impact resistance, along with excellent peel and shear strength... |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | ISO 11357-2 |
| Menzolit Menzolit® BMC 0800 Unsaturated Polyester UP BMC 0800 is a special SMC for applications within household and kitchenware. The glass level has been selected to combine good mould ability with good strength and stiffness properties. The product .. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | |
| GrafTech GRAFCELL® FFP-100 SERIES Flow Field Plate Graphite Manufactured from expanded natural graphite, GRAFCELL® Flow Field Plate (FFP) components retain a continuous graphitic phase. This phase continuity, combined with a low contact resistance, provid.. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | |
| GrafTech GRAFCELL® FFP-300 SERIES Flow Field Plate Graphite Manufactured from expanded natural graphite, GRAFCELL® Flow Field Plate (FFP) components retain a continuous graphitic phase. This phase continuity, combined with a low contact resistance, provid.. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | TMA |
| Lord Adhesives Circalokâ„¢ EP-729 Epoxy Board Level Encapsulant LORD Thermosetâ„¢ EP-729 encapsulant is a black, one-component epoxy specifically designed to meet the needs of coating semiconductor devices on printed circuit boards.All information provided by.. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | |
| Kuraray Genestarâ„¢ G1300H Nylon, 30% Glass Filled Standard HB grade. Halogen free, following the standards that Br is less than 900ppm, Cl is less than 900ppm, and total of halogen amount (Br and Cl) is less than 1500ppm. It is suitable for use in .. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | 10°C/min; ISO 11357-1/-2 |
| Kuraray Genestarâ„¢ G1301A-M61 Nylon, 30% Glass Filled 30% Glass reinforced and impact modified injection grade.Main Features:Higher elongation and impact strengthHeat resistanceChemical resistanceExample of applications:Quick connector |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | |
| Kuraray Genestarâ„¢ G1302 Nylon, 30% Glass Filled Abrasion Resistance HB grade. Halogen free, following the standards that Br is less than 900ppm, Cl is less than 900ppm, and total of halogen amount (Br and Cl) is less than 1500ppm. It delivers low.. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | 10°C/min; ISO 11357-1/-2 |
| Kuraray Genestarâ„¢ G1350A-M42 Nylon, 35% Glass Filled 35% Glass reinforced injection grade. This grade was developed specifically for improved performance in a 50/50 ethylene glycol and water environment.Main Features:Hydrolysis resistanceHeat resista.. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | 10°C/min; ISO 11357-1/-2 |
| Kuraray Genestarâ„¢ G1352A-M41 Nylon, 35% Glass Filled Low friction reinforced injection grade.Main Features:Low friction coefficientAbrasion resistanceExamples of applications:Friction and wear applicationGear and wheel |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | 10°C/min; ISO 11357-1/-2 |
| Kuraray Genestarâ„¢ G1500A-M61 Nylon, 50% Glass Filled 50% Glass reinforced injection grade. Main Features:High strengthHeat resistanceExamples of applications:Structural partsSteel alternating parts |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | 10°C/min; ISO 11357-1/-2 |
| Kuraray Genestarâ„¢ GC1201A-M41 Nylon, Glass Filled and Carbon Filled Reinforced injection grade for conductive applications.Main Features:ConductivityHeat resistanceChemical resistanceExample of applications:Quick connector |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | |
| Kuraray Genestarâ„¢ GT2330 Nylon, 33% Glass Filled Toughness V-0 Grade. It is well suited for components requiring a high strength in pin fitting process, due to high ductility properties. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | |
| Kuraray Genestarâ„¢ GW1458HF Nylon, 45% Glass Filled Low Warpage, High Flow HB grade. Halogen free, following the standards that Br is less than 900ppm, Cl is less than 900ppm, and total of halogen amount (Br and Cl) is less than 1500ppm. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | 10°C/min; ISO 11357-1/-2 |
| Kuraray Genestarâ„¢ N1001D-U03 Nylon Standard unreinforced extrusion grade. Main Features:Outstanding fuel barrierHeat resistanceExample of applications:Multi-layered fuel tube |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | 10°C/min; ISO 11357-1/-2 |
| Kuraray Genestarâ„¢ N1002A-M41 Nylon Low friction unreinforced injection grade. Main Features:Low friction coefficientLow wearExamples of applications are:Friction and wear applicationGear and wheel |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | 10°C/min; ISO 11357-1/-2 |
| Kuraray Genestarâ„¢ N1006A-M41 Nylon Impact modified unreinforced injection grade. Main Features:High elongationHigh impact strengthExamples of applications are:Retainers for quick connectorFlexible band |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | |
| Mitsui Arlen™ A315 15% Glass Fiber-Reinforced Modified Nylon 6T (DAM) ARLEN™ is a heat resistant, modified polyamide 6T developed by Mitsui Chemicals, Inc. With a high melting point (320°C) and a rigidity level comparable to super engineering plastics, it poss.. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | |
| Mitsui Arlen™ A335 35% Glass Fiber-Reinforced Modified Nylon 6T (DAM) ARLEN™ is a heat resistant, modified polyamide 6T developed by Mitsui Chemicals, Inc. With a high melting point (320°C) and a rigidity level comparable to super engineering plastics, it poss.. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | |
| Mitsui Arlen™ AE4200N Modified Nylon 6T, for Tribolic Applications, Flame Retardant (COND) ARLEN™ is a heat resistant, modified polyamide 6T developed by Mitsui Chemicals, Inc. With a high melting point (320°C) and a rigidity level comparable to super engineering plastics, it poss.. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | |
| Mitsui Arlen™ AE4200N Modified Nylon 6T, for Tribolic Applications, Flame Retardant (DAM) ARLEN™ is a heat resistant, modified polyamide 6T developed by Mitsui Chemicals, Inc. With a high melting point (320°C) and a rigidity level comparable to super engineering plastics, it poss.. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | MCI Method |
| Mitsui APELâ„¢ APL6013T Cyclo Olefin Copolymer (COC) This material possesses many characteristics inherent in polyolefins such as excellent electrical insulating properties and outstanding moisture resistance. In addition, it features good melt proces.. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | TMA |
| Lord Adhesives Circalokâ„¢ EP-939 Epoxy Board Level Encapsulant LORD Thermosetâ„¢ EP-939 encapsulant is a black, one-component epoxy specifically designed to meet the needs of coating semiconductor devices on printed circuit boards.All information provided by.. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | Ultimate Tg |
| Tra-Con Tra-Bond FDA25 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-25 is a medium viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Admi.. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | |
| Loctite® 3564 Fast flow epoxy, moderate CTE and Tg Fast Flow Underfill COB/DCA Encapsulants are essential to the reliability of flip chip assemblies because they minimize the thermal mismatch between the flip chip and substrate.Loctite® Underfills and Encapsulants imp.. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | ASTM D3418 |
| DuPont Selar® PA 2072 Nylon Barrier Resin Selar® PA 2072 is an amorphous nylon (polyamide) resin which is specially designed for blending with ethylene vinyl alcohol (EVOH) copolymers. Selar® PA 2072 can be tumble-blended with most grades.. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | DAM (SSYS) |
| Proto3000 PC-ABS Fused Deposition Modeling Polymer Description: PC-ABS (polycarbonate-ABS) is one of the most widely used industrial thermoplastics. PC-ABS offers the most desirable properties of both materials - the superior strength and heat resis.. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | |
| Mitsui Arlen™ AE4200 Modified Nylon 6T, for Tribolic Applications (DAM) ARLEN™ is a heat resistant, modified polyamide 6T developed by Mitsui Chemicals, Inc. With a high melting point (320°C) and a rigidity level comparable to super engineering plastics, it possesses .. |
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| Glass Transition Temp, Tg | 125 °C | 257 °F | 10°C/min; ISO 11357-1/-2 |
| Kuraray Genestar™ G1300A-M41 Nylon, 30% Glass Filled Glass reinforced injection grade. Main Features:Chemical resistanceHeat resistanceExamples of applications:Gears and bearing retainersIntercooler tank and turbo duct pipe |
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