- HOME
- POLYMER SEARCH
- Polymer Property : Glass Transition Temp, Tg = 329 °F
Polymer Property : Glass Transition Temp, Tg = 329 °F Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Glass Transition Temp, Tg | 165 °C | 329 °F | ASTM D3418 |
| Polystrand ThermoPro™ IE6010 Unitape Unidirectional Polypropylene-Glass Composite Fiber Orientation is 0°.Polystrand ThermoPro™ combines continuous E-Glass (ThermoPro-E™) structural reinforcing fibers in either a polyethylene or polypropylene proprietary thermoplastic polymer .. |
|||
| Glass Transition Temp, Tg | 165 °C | 329 °F | Dry, by DMA |
| Park Electrochemical Nelcote® E-718 Epoxy Prepreg, 7781 E-Glass Reinforced Nelcote® E-718 is a modified epoxy resin system. E-718 is designed to provide excellent mechanical properties at low cure pressures.Key Features and Benefits:Good low pressure consolidationExcellen.. |
|||
| Glass Transition Temp, Tg | 165 °C | 329 °F | Dry, by DMA |
| Park Electrochemical Nelcote® E-718 Epoxy Prepreg, G30-700 Uni-Tape Reinforced Nelcote® E-718 is a modified epoxy resin system. E-718 is designed to provide excellent mechanical properties at low cure pressures.Key Features and Benefits:Good low pressure consolidationExcellen.. |
|||
| Glass Transition Temp, Tg | 165 °C | 329 °F | Dry, by DMA |
| Park Electrochemical Nelcote® E-718 Epoxy Prepreg, T-700 24K Uni-Tape Reinforced Nelcote® E-718 is a modified epoxy resin system. E-718 is designed to provide excellent mechanical properties at low cure pressures.Key Features and Benefits:Good low pressure consolidationExcellen.. |
|||
| Glass Transition Temp, Tg | 165 °C | 329 °F | Dry; DMA |
| Park Electrochemical Nelcote® E-765 Epoxy Prepreg, 120 E-Glass Reinforced Nelcote® E-765 is a tough 250°F cure prepreg system designed to replace 350°F cure systems in aircraft structural applications. FAA-approved Design Allowable Databases are available upon request... |
|||
| Glass Transition Temp, Tg | 165 °C | 329 °F | Dry; DMA |
| Park Electrochemical Nelcote® E-765 Epoxy Prepreg, 34-700 12K 2x2 Twill Reinforced Nelcote® E-765 is a tough 250°F cure prepreg system designed to replace 350°F cure systems in aircraft structural applications. FAA-approved Design Allowable Databases are available upon request... |
|||
| Glass Transition Temp, Tg | 165 °C | 329 °F | Dry; DMA |
| Park Electrochemical Nelcote® E-765 Epoxy Prepreg, 7781 E-Glass Reinforced Nelcote® E-765 is a tough 250°F cure prepreg system designed to replace 350°F cure systems in aircraft structural applications. FAA-approved Design Allowable Databases are available upon request... |
|||
| Glass Transition Temp, Tg | 165 °C | 329 °F | Dry; DMA |
| Park Electrochemical Nelcote® E-765 Epoxy Prepreg, T300 3K PW Reinforced Nelcote® E-765 is a tough 250°F cure prepreg system designed to replace 350°F cure systems in aircraft structural applications. FAA-approved Design Allowable Databases are available upon request... |
|||
| Glass Transition Temp, Tg | 165 °C | 329 °F | Dry; DMA |
| Park Electrochemical Nelcote® E-765 Epoxy Prepreg, T300 6K 5HS Reinforced Nelcote® E-765 is a tough 250°F cure prepreg system designed to replace 350°F cure systems in aircraft structural applications. FAA-approved Design Allowable Databases are available upon request... |
|||
| Glass Transition Temp, Tg | 165 °C | 329 °F | Dry; DMA |
| Park Electrochemical Nelcote® E-765 Epoxy Prepreg, T700 12K 2x2 Twill Reinforced Nelcote® E-765 is a tough 250°F cure prepreg system designed to replace 350°F cure systems in aircraft structural applications. FAA-approved Design Allowable Databases are available upon request... |
|||
| Glass Transition Temp, Tg | 165 °C | 329 °F | Dry; DMA |
| Park Electrochemical Nelcote® E-765 Epoxy Prepreg, T700 12K BW Reinforced Nelcote® E-765 is a tough 250°F cure prepreg system designed to replace 350°F cure systems in aircraft structural applications. FAA-approved Design Allowable Databases are available upon request... |
|||
| Glass Transition Temp, Tg | 165 °C | 329 °F | Dry; DMA |
| Park Electrochemical Nelcote® E-765 Epoxy Prepreg, T700 Uni Tape Reinforced Nelcote® E-765 is a tough 250°F cure prepreg system designed to replace 350°F cure systems in aircraft structural applications. FAA-approved Design Allowable Databases are available upon request... |
|||
| Glass Transition Temp, Tg | 165 °C | 329 °F | DSC; IPC-TM-650.2.4.25c |
| Park Electrochemical Nelco® N4000-7 EF® Halogen-Free Epoxy The Nelco® N4000-7 EF® series of laminates and prepregs is a total environmental solution. This advanced halogen-free resin system provides superior CAF resistance for high temperature, lead-free .. |
|||
| Glass Transition Temp, Tg | 165 °C | 329 °F | |
| Cookson Group Plaskon® 435 Mineral Filled Epoxy Molding Compound
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.Combines exceptional reliability with wide molding process latitude. This material is designed to encapsulate a variety of semic.. |
|||
| Glass Transition Temp, Tg | 165 °C | 329 °F | |
| Cookson Group Plaskon® 440 Mineral Filled Novolac Epoxy Molding Compound
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.Combines exceptional reliability with wide molding process latitude. This material is designed to encapsulate semiconductor devi.. |
|||
| Glass Transition Temp, Tg | 165 °C | 329 °F | |
| Cookson Group Plaskon® S-7S Epoxy Encapsulant
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A low stress, low viscosity epoxy encapsulant designed for packaging stress-sensitive semiconductor devices. It is specifically .. |
|||
| Glass Transition Temp, Tg | 165 °C | 329 °F | Tg |
| Industrial Laminates/Norplex NP511 Glass Fabric Description: Woven glass fabric with high temperature epoxy resin. Excellent mechanical strength and electrical properties at elevated temperatures. Continuous operating temperature is 165°C. Mat.. |
|||
| Glass Transition Temp, Tg | 165 °C | 329 °F | ISO 11357-2 |
| Menzolit Menzolit® BMC 2310 Unsaturated Polyester UP BMC 2310 is a chemically resistant grade reinforced with special fibres. Being completely glass-free (no glass fibre reinforcement) it is specifically recommended for the manufacture of high voltage.. |
|||
| Glass Transition Temp, Tg | 165 °C | 329 °F | ISO 11357-2 |
| Menzolit Menzolit® BMC 2400 Unsaturated Polyester UP BMC 2400 is a general purpose BMC for applications in the field of low smoke density and non toxic smoke.. The flammability meets the demands of EN45545 and is classified according to British standa.. |
|||
| Glass Transition Temp, Tg | 165 °C | 329 °F | |
| Cosmic Plastics E4920 Mineral Filled Epoxy Molding Compound, Encapsulated Grade Data provided by the manufacturer. |
|||
| Glass Transition Temp, Tg | 165 °C | 329 °F | |
| Cosmic Plastics E4930 Mineral & Glass Filled Epoxy Molding Compound, Encapsulated Grade Data provided by the manufacturer. |
|||
| Glass Transition Temp, Tg | 165 °C | 329 °F | Cured property; Perkin Elmer TMS-2 |
| Aptek 6108-PMF Epoxy Coating/Encapsulant High temperature, rigid, electrical/electronic coating or encapsulant. Provides excellent environmental protection for continuous exposure to 220°C.Information provided by Aptek Laboratories, Inc. |
|||
| Glass Transition Temp, Tg | 165 °C | 329 °F | Cured property; Perkin Elmer TMS-2 |
| Aptek 6108-PMF Epoxy Encapsulant and/or Potting Compound High temperature, rigid, electrical/electronic coating or encapsulant. Provides excellent environmental protection for continuous exposure to 220°C. Also can be used as a high temperature wire varn.. |
|||
| Glass Transition Temp, Tg | >= 165 °C | >= 329 °F | |
| Bulk Molding Compounds BMC 945 Conductive Grade Bulk Molding Compound BMC 945 is an ESD level Conductive grade of Bulk Molding Compound and is suitable for compression, transfer and stuffer injection molding. It is characterized by excellent flow and controlled reacti.. |
|||
| Glass Transition Temp, Tg | 165 °C | 329 °F | |
| Vyncolit Neopreg Kinel® SK60 L8F Glass Fiber Reinforced Molding Compound Medium flow, epoxy based molding compound long glass fiber reinforced with excellent long term property retention over a wide temperature range and climate conditions. It is particularly suited f.. |
|||
| Glass Transition Temp, Tg | 165 °C | 329 °F | |
| Vyncolit Neopreg Kinel® SK60 L8G Glass Fiber Reinforced Molding Compound High flow, epoxy based molding compound long glass fiber reinforced with excellent long term property retention over a wide temperature range and climate conditions. It is particularly suited fo.. |
|||
| Glass Transition Temp, Tg | 165 °C | 329 °F | ASTM D3418 |
| Polystrand ThermoPro™ IE7010 Unitape Unidirectional Polypropylene-Glass Composite Fiber Orientation is 0°.Polystrand ThermoPro™ combines continuous E-Glass (ThermoPro-E™) structural reinforcing fibers in either a polyethylene or polypropylene proprietary thermoplastic polymer .. |
|||
Copyright © lookpolymers.com All Rights Reserved