Polymer Property : Deflection Temperature at 8.0 MPa = 356 °F Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Deflection Temperature at 8.0 MPa	160 - 180 °C	320 - 356 °F	ISO 75-C
Raschig Group DECAL® 1760 Phenolic Glass-fiber reinforced phenolic molding compound. Very good electrical properties, good chemical resistance and mechanical properties. This product meets the allowed upper limits for heavy metals an..
Deflection Temperature at 8.0 MPa	160 - 180 °C	320 - 356 °F	ISO 75-C
Raschig Group DECAL® 572R Phenolic Glass-fiber reinforced phenolic molding compound. Exceptional heat resistance with regard to maintaining surface finish and mechanical properties, outstanding mechanical properties, excellent rotati..
Deflection Temperature at 8.0 MPa	160 - 180 °C	320 - 356 °F	ISO 75-C
Raschig Group EPOXIDUR® 3581 S ZC EP Epoxy Molding Compound Inorganically filled epoxy molding compound. Good mechanical strength, very good electrical isolation properties and dimensional stability even at high temperatures. Very good sealing connection on ..
Deflection Temperature at 8.0 MPa	160 - 180 °C	320 - 356 °F	ISO 75-C
Raschig Group EPOXIDUR® 3581 T-1 EP Epoxy, Molded, Glass Fiber Filler Glass-fiber reinforced and inorganically filled epoxy molding compound. Good mechanical strength, very good electrical isolation properties and dimensional stability even at high temperatures. Very ..
Deflection Temperature at 8.0 MPa	160 - 180 °C	320 - 356 °F	ISO 75-C
Raschig Group RESINOL® 87120 EPF Phenolic Glass-fiber reinforced phenolic molding compound. Excellent heat resistance, low mould shrinkage and post-shrinkage, good chemical resistance and very good mechanical properties. This product meets ..
Deflection Temperature at 8.0 MPa	160 - 180 °C	320 - 356 °F	ISO 75-C
Raschig Group RESINOL® 400 EPF Phenolic Glass-fiber reinforced phenolic molding compound. Excellent heat resistance, low mould shrinkage and post-shrinkage, good chemical resistance and very good mechanical properties. This product meets ..
Deflection Temperature at 8.0 MPa	115 - 180 °C	239 - 356 °F	Average value: 144 °C Grade Count:5
Overview of materials for Epoxy Molding Compound This property data is a summary of similar materials in the MatWeb database for the category "Epoxy Molding Compound". Each property range of values reported is minimum and maximum values of appropr..