Polymer Property : Decomposition Temperature = 407 °C Product List

Thermal Properties

Tips: 30 items are displayed at most. For the rest of the results, please contact customer service.

Thermal Properties	Metric	English	Comments
Decomposition Temperature	407 °C	765 °F	Degradation Temperature
Epoxy Technology EPO-TEK® H20E-PFC Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-PFC is a two component, semiconductor grade epoxy, designed for flip chip interconnects using a solder-free joining method.Advantages & Application Notes: Stencil..
Decomposition Temperature	407 °C	765 °F	5 percent; IPC TM-650 2.3.41
Arlon 35N Fast Cure Polyimide Laminate and Prepreg High reliability and high temperature material35N is a pure polyimide laminate and prepreg system for applications requiring high temperature performance. High Tg results in low Z-direction expansi..
Decomposition Temperature	407 °C	765 °F	5 percent; IPC TM-650 2.3.41
Arlon 84N Polyimide Laminate and Prepreg 84N is a high performance ceramic-filled polyimide prepreg based on Arlon's 85N pure polyimide system, designed for use in filling etched areas in polyimide multilayers that contain thick copper lay..
Decomposition Temperature	407 °C	765 °F	5 percent; IPC TM-650 2.3.41
Arlon 85N Polyimide Laminate and Prepreg 85N is a polyimide and laminate prepreg system for PWBs requiring resistance to high temperature, both in process and in end-use application. Bromine-free chemistry provides thermal stability for a..