Songhan Plastic Technology Co.,Ltd.

Arlon 84N Polyimide Laminate and Prepreg

Category Polymer , Thermoset , Polyimide, TS
Manufacturer Arlon
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Arlon 84N Polyimide Laminate and Prepreg.pdf
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Material Notes:
84N is a high performance ceramic-filled polyimide prepreg based on Arlon's 85N pure polyimide system, designed for use in filling etched areas in polyimide multilayers that contain thick copper layers and for filling clearance holes in metal cores. The ceramic filler in the resin serves to reduce shrinkage and inhibit crack formation during through-hole drilling in filled clearance areas.High Tg polyimide (>250°C) with Thermal Decomposition temperature (Td) >400°C and T300>60 minutesLow z-expansion of 1% between 50-250°C offers superior PTH reliability through manufacture, assembly and in serviceUp to 50% or more reduction in cure time compared with traditional polyimide cyclesElectrical and mechanical properties meeting the requirements of IPC-4101/40 and /41Toughened, Non-MDA chemistry resists drill crackingHalogen-free chemistryCompatible with lead-free solder processingRoHS/WEEE compliantTypical Applications:MLB's that are designed with clearance holes in metal cores or for thick metal powder and ground planes that require the thermal stability of polyimideApplications requiring significant lifetimes at elevated temperatures, such as aircraft engine instrumentation, down hole drilling, under-hood automotive applications, industrial sensor systems and burn-in testing of IC's.This data represents typical values for the production material and should not be used as material specifications.Information provided by ARLON Silicone Technologies Division.
Physical Properties Metric English Comments
Density 1.65 g/cc
0.0596 lb/in³
ASTM D792 Method A
Water Absorption 0.15 %
0.15 %
IPC TM-650
Mechanical Properties Metric English Comments
Modulus of Elasticity 20.7 GPa
3000 ksi
IPC TM-650
Poissons Ratio 0.15
ASTM D3039
Peel Strength 1.24 kN/m
7.10 pli
To Copper (1 oz./35 micron); After Process Solutions; IPC TM-650 2.4.8
1.24 kN/m
7.10 pli
To Copper (1 oz./35 micron); After Thermal Stress; IPC TM-650 2.4.8
1.24 kN/m
7.10 pli
To Copper (1 oz./35 micron); At Elevated Temperatures; IPC TM-650
Thermal Properties Metric English Comments
CTE, linear 14.0 - 16.0 µm/m-°C
7.78 - 8.89 µin/in-°F
CTE, linear, Transverse to Flow 48.0 µm/m-°C
26.7 µin/in-°F
z, below Tg; IPC TM-650 2.4.24
150 µm/m-°C
83.3 µin/in-°F
z, above Tg; IPC TM-650 2.4.24
Thermal Conductivity 0.250 W/m-K
1.74 BTU-in/hr-ft²-°F
ASTM E1461
Glass Transition Temp, Tg 250 °C
482 °F
TMA; IPC TM-650 2.4.24
Decomposition Temperature 387 °C
729 °F
Initial; IPC TM-650 2.3.41
407 °C
765 °F
5 percent; IPC TM-650 2.3.41
Flammability, UL94 HB
Electrical Properties Metric English Comments
Volume Resistivity 1.50e+14 ohm-cm
1.50e+14 ohm-cm
C96/35/90; IPC TM-650
3.00e+14 ohm-cm
3.00e+14 ohm-cm
E24/125; IPC TM-650
Surface Resistance 1.60e+15 ohm
1.60e+15 ohm
C96/35/90; IPC TM-650
1.60e+15 ohm
1.60e+15 ohm
E24/125; IPC TM-650
Dielectric Constant 4.2

@Frequency 1.00e+6 Hz

@Frequency 1.00e+6 Hz
may vary with resin %; IPC TM-650
Dielectric Strength 47.2 kV/mm
1200 kV/in
IPC TM-650
Dissipation Factor 0.010

@Frequency 1.00e+6 Hz

@Frequency 1.00e+6 Hz
IPC TM-650
Arc Resistance 140 sec
140 sec
IPC TM-650 2.5.1
Descriptive Properties Value Comments
IPC Delamination - T260 (minutes) >60
IPC TM-650
IPC Delamination - T288 (minutes) >60
IPC TM-650
IPC Delamination - T300 (minutes) >60
IPC TM-650
Z-Axis Expansion (%) 1
IPC TM-650 2.4.24 (50-260°C)
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