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Arlon 85N Polyimide Laminate and Prepreg

Category Polymer , Thermoset , Polyimide, TS
Manufacturer Arlon
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Arlon 85N Polyimide Laminate and Prepreg.pdf
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Material Notes:
85N is a polyimide and laminate prepreg system for PWBs requiring resistance to high temperature, both in process and in end-use application. Bromine-free chemistry provides thermal stability for applications with sustained high in-use temperatures as well as for use in lead-free soldering applications.Low Z-expansion minimizes the risk of latent PTH defects caused during solder reflow and device attachment.Up to 50% or more reduction in cure time compared with traditional polyimide cyclesElectrical and mechanical properties meeting the requirements of IPC-4101/40 and /41Toughened, Non-MDA chemistry resists drill crackingTypical Applications:PCBs that are subjected to high temperatures during processing, such as lead-free solderingApplications with significant lifetimes at high temperatures, such as aircraft engine instrumentation, down-hole drilling, under-hood automotive controls, burn-in-boards, or industrial sensorsThis data represents typical values for the production material and should not be used as material specifications.Information provided by ARLON Silicone Technologies Division.
Physical Properties Metric English Comments
Water Absorption 0.27 %
0.27 %
IPC TM-650 2.6.2.1
Mechanical Properties Metric English Comments
Modulus of Elasticity 22.1 GPa
3200 ksi
IPC TM-650 2.4.18.3
Poissons Ratio 0.15
0.15
ASTM D3039
Peel Strength 1.24 kN/m
7.10 pli
To Copper (1 oz./35 micron); After Process Solutions; IPC TM-650 2.4.8
1.24 kN/m
7.10 pli
To Copper (1 oz./35 micron); After Thermal Stress; IPC TM-650 2.4.8
1.24 kN/m
7.10 pli
To Copper (1 oz./35 micron); At Elevated Temperatures; IPC TM-650 2.4.8.2
Thermal Properties Metric English Comments
CTE, linear 16.0 µm/m-°C
8.89 µin/in-°F
IPC TM-650 2.4.41
CTE, linear, Transverse to Flow 55.0 µm/m-°C

@Temperature <=250 °C
30.6 µin/in-°F

@Temperature <=482 °F
z (< Tg); IPC TM-650 2.4.24
149 µm/m-°C

@Temperature >=250 °C
82.8 µin/in-°F

@Temperature >=482 °F
z (> Tg); IPC TM-650 2.4.24
Thermal Conductivity 0.200 W/m-K
1.39 BTU-in/hr-ft²-°F
ASTM E1461
Glass Transition Temp, Tg 250 °C
482 °F
TMA; IPC TM-650 2.4.24
Decomposition Temperature 387 °C
729 °F
Onset; IPC TM-650 2.3.41
407 °C
765 °F
5 percent; IPC TM-650 2.3.41
Flammability, UL94 HB
HB
Electrical Properties Metric English Comments
Volume Resistivity 1.50e+14 ohm-cm
1.50e+14 ohm-cm
C96/35/90; IPC TM-650 2.5.17.1
3.00e+14 ohm-cm
3.00e+14 ohm-cm
E24/125; IPC TM-650 2.5.17.1
Surface Resistance 1.60e+15 ohm
1.60e+15 ohm
C96/35/90; IPC TM-650 2.5.17.1
1.60e+15 ohm
1.60e+15 ohm
E24/125; IPC TM-650 2.5.17.1
Dielectric Constant 4.2

@Frequency 1.00e+6 Hz
4.2

@Frequency 1.00e+6 Hz
May vary with resin %; IPC TM-650 2.5.5.3
Dielectric Strength 57.1 kV/mm
1450 kV/in
IPC TM-650 2.5.6.2
Dissipation Factor 0.010

@Frequency 1.00e+6 Hz
0.010

@Frequency 1.00e+6 Hz
IPC TM-650 2.5.5.3
Arc Resistance 143 sec
143 sec
IPC TM-650 2.5.1
Descriptive Properties Value Comments
IPC Delamination - T260 (minutes) > 60
IPC TM-650 2.4.24.1
IPC Delamination - T288 (minutes) > 60
IPC TM-650 2.4.24.1
IPC Delamination - T300 (minutes) > 60
IPC TM-650 2.4.24.1
Z-Axis Expansion (%) 1.2
IPC TM-650 2.4.24 (50-260°C)
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