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Polymer Property : CTE, linear = 5.56 µin/in-°F Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 5.00 - 10.0 µm/m-°C @Temperature 50.0 - 100 °C |
2.78 - 5.56 µin/in-°F @Temperature 122 - 212 °F |
ISO 11359-2 |
| Raschig Group 5553 DAP Glass-fiber reinforced diallyl phthalate molding compound. Good mechanical strength together with retention of high electrical isolation properties under hot humid conditions, exceptional dimensiona.. |
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| CTE, linear | 5.00 - 10.0 µm/m-°C @Temperature 50.0 - 100 °C |
2.78 - 5.56 µin/in-°F @Temperature 122 - 212 °F |
ISO 11359-2 |
| Raschig Group 5562 DAP Glass-fiber reinforced diallyl phthalate molding compound. Good mechanical strength together with retention of high electrical isolation properties under hot humid conditions, exceptional dimensiona.. |
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| CTE, linear | 5.00 - 10.0 µm/m-°C @Temperature 50.0 - 100 °C |
2.78 - 5.56 µin/in-°F @Temperature 122 - 212 °F |
ISO 11359-2 |
| Raschig Group 5563 DAP Glass-fiber reinforced diallyl phthalate molding compound. Good mechanical strength together with retention of high electrical isolation properties under hot humid conditions, exceptional dimensiona.. |
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| CTE, linear | 8.00 - 10.0 µm/m-°C | 4.44 - 5.56 µin/in-°F | DIN 51045 |
| Plansee Cu-MoCu-Cu Laminate A high performance, three-layer composite.Characteristics:High thermal conductivityLow thermal expansionIdeal for heat dissipation applications related to: IGBT modules, RF packages, and LED chips, .. |
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| CTE, linear | 1.00 - 10.0 µm/m-°C | 0.556 - 5.56 µin/in-°F | Average value: 5.67 µm/m-°C Grade Count:3 |
| Overview of materials for Phenolic, Carbon Fiber Composite This property data is a summary of similar materials in the MatWeb database for the category "Phenolic, Carbon Fiber Composite". Each property range of values reported is minimum and maximum values .. |
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| CTE, linear | 9.60 - 10.0 µm/m-°C @Temperature 20.0 - 100 °C |
5.33 - 5.56 µin/in-°F @Temperature 68.0 - 212 °F |
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| MarkeTech Cu/Mo/Cu 1:1:1 Laminated Sheet Cu/MoCu sheets have very high in-plane thermal conductivity provide by layers of Cu and low CTEs provided by the inner layer of molybdenum. These laminated sheets spread heat from a concentrated hea.. |
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| CTE, linear | 8.00 - 10.0 µm/m-°C @Temperature 20.0 °C |
4.44 - 5.56 µin/in-°F @Temperature 68.0 °F |
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| MMCC Al/B4C Particulate Aluminum Matrix Composite Cast, discontinuously reinforced aluminum matrix composite. May be fabricated by vacuum infiltration of the ceramic preform.Data provided by the manufacturer, Metal Matrix Cast Composites (MMCC). |
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| CTE, linear | 8.00 - 10.0 µm/m-°C @Temperature 20.0 °C |
4.44 - 5.56 µin/in-°F @Temperature 68.0 °F |
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| MMCC Al/SiC Particulate Aluminum Matrix Composite Cast, discontinuously reinforced aluminum matrix composite. May be fabricated by vacuum infiltration of the ceramic preform.Data provided by the manufacturer, Metal Matrix Cast Composites (MMCC). |
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| CTE, linear | 8.00 - 10.0 µm/m-°C @Temperature 1000 °C |
4.44 - 5.56 µin/in-°F @Temperature 1830 °F |
|
| Chosun Refractories CSN-309N Plate Brick Information provided by Chosun Refractories via Korea Institute of Ceramic Engineering and Technology (KICET). |
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| CTE, linear | 8.00 - 10.0 µm/m-°C @Temperature 1000 °C |
4.44 - 5.56 µin/in-°F @Temperature 1830 °F |
|
| Chosun Refractories CSN-309NM,Body Plate Brick Information provided by Chosun Refractories via Korea Institute of Ceramic Engineering and Technology (KICET). |
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| CTE, linear | 8.00 - 10.0 µm/m-°C @Temperature 1000 °C |
4.44 - 5.56 µin/in-°F @Temperature 1830 °F |
|
| Chosun Refractories CSN-309T Plate Brick Information provided by Chosun Refractories via Korea Institute of Ceramic Engineering and Technology (KICET). |
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| CTE, linear | 8.00 - 10.0 µm/m-°C @Temperature 1000 °C |
4.44 - 5.56 µin/in-°F @Temperature 1830 °F |
|
| Chosun Refractories CSN-322T Plate Brick Information provided by Chosun Refractories via Korea Institute of Ceramic Engineering and Technology (KICET). |
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| CTE, linear | 8.00 - 10.0 µm/m-°C @Temperature 1000 °C |
4.44 - 5.56 µin/in-°F @Temperature 1830 °F |
|
| Chosun Refractories CSN-332N Plate Brick Information provided by Chosun Refractories via Korea Institute of Ceramic Engineering and Technology (KICET). |
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| CTE, linear | 9.00 - 10.0 µm/m-°C @Temperature 1000 °C |
5.00 - 5.56 µin/in-°F @Temperature 1830 °F |
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| Chosun Refractories CUN-B937 Nozzle Brick Information provided by Chosun Refractories via Korea Institute of Ceramic Engineering and Technology (KICET). |
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| CTE, linear | 8.00 - 10.0 µm/m-°C @Temperature 1000 °C |
4.44 - 5.56 µin/in-°F @Temperature 1830 °F |
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| Chosun Refractories SSN-787N Plate Brick Information provided by Chosun Refractories via Korea Institute of Ceramic Engineering and Technology (KICET). |
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| CTE, linear | 8.00 - 10.0 µm/m-°C @Temperature 1000 °C |
4.44 - 5.56 µin/in-°F @Temperature 1830 °F |
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| Chosun Refractories ZNS Plate Brick Information provided by Chosun Refractories via Korea Institute of Ceramic Engineering and Technology (KICET). |
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| CTE, linear | 8.00 - 10.0 µm/m-°C @Temperature 1000 °C |
4.44 - 5.56 µin/in-°F @Temperature 1830 °F |
|
| Chosun Refractories CSN-601N Plate Brick Information provided by Chosun Refractories via Korea Institute of Ceramic Engineering and Technology (KICET). |
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| CTE, linear | 8.00 - 10.0 µm/m-°C @Temperature 50.0 - 150 °C |
4.44 - 5.56 µin/in-°F @Temperature 122 - 302 °F |
IPC TM-650 2.4.41 |
| Arlon AD1000 PTFE/Woven Fiberglass/Ceramic Filled Laminate for Microwave Printed Circuit Boards Only Woven Glass Reinforced PTFE/Ceramic with Dk of 10.2 or greaterHigh Copper Peel Strength allows for thinner etched line widthsLowest insertion loss availableLarger Panel sizes availableLow moist.. |
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