Polymer Property : Thermal Conductivity = 1180 BTU-in/hr-ft²-°F Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Thermal Conductivity	170 W/m-K	1180 BTU-in/hr-ft²-°F
Poco Graphite SUPERSiC® 3C Silicon Carbide SUPERSiC that has been coated with a 75 µm CVD SiC coating, which seals the surface.Uses: Ideal for high-temperature deposition and CVD applications.Information provided by PocoGraphite
Thermal Conductivity	170 W/m-K	1180 BTU-in/hr-ft²-°F
Poco Graphite SUPERSiC® 3CX Silicon Carbide SUPERSiC that has been coated twice with a 75 µm CVD SiC coating, which seals the surface. Uses: Ideal for high-temperature anneal processesInformation provided by PocoGraphite
Thermal Conductivity	170 W/m-K	1180 BTU-in/hr-ft²-°F
Poco Graphite SUPERSiC® Basic Silicon Carbide The SUPERSiC Material System allows customization of basic silicon carbide. Select from groups of infiltration materials, cleaning options, coating materials and thicknesses to optimize material for..
Thermal Conductivity	>= 170 W/m-K	>= 1180 BTU-in/hr-ft²-°F	Through Plane; ASTM 1461-01
Plansee Cu-MoCu-Cu Laminate A high performance, three-layer composite.Characteristics:High thermal conductivityLow thermal expansionIdeal for heat dissipation applications related to: IGBT modules, RF packages, and LED chips, ..
Thermal Conductivity	>= 170 W/m-K	>= 1180 BTU-in/hr-ftÂ²-Â°F
MarkeTech AN 180 Aluminum Nitride Ceramic Substrate, 99% Purity Data provided by the supplier, MarkeTech International.Substrate Specs: Maximum dimensions 5.5 x 3.6 in. Thickness 0.12-0.60 in. Surface roughness 0.3 Âµm as fired; 0.075 Âµm lapped; 0.025 Âµ..
Thermal Conductivity	170 - 180 W/m-K	1180 - 1250 BTU-in/hr-ftÂ²-Â°F	z direction
MarkeTech Cu/Mo/Cu 1:4:1 Laminated Sheet Cu/MoCu sheets have very high in-plane thermal conductivity provide by layers of Cu and low CTEs provided by the inner layer of molybdenum. These laminated sheets spread heat from a concentrated hea..
Thermal Conductivity	170 - 180 W/m-K	1180 - 1250 BTU-in/hr-ftÂ²-Â°F	z direction
MarkeTech Cu/Mo70-Cu30/Cu 1:4:1 Laminated Sheet Cu/Mo/Cu sheets have very high in-plane thermal conductivity provide by layers of Cu and low CTEs provided by the inner layer of molybdenum. These laminated sheets spread heat from a concentrated he..
Thermal Conductivity	170 - 180 W/m-K	1180 - 1250 BTU-in/hr-ftÂ²-Â°F
MarkeTech WCu10 Tungsten Copper Alloy Used to fabricate parts to near net size and several processes to produce high quality tungsten based materials.Tungsten heavy alloys have very high melting point and have a density twice that of st..
Thermal Conductivity	>= 170 W/m-K	>= 1180 BTU-in/hr-ftÂ²-Â°F
H.C. Starck MoCu 80/20 Molybdenum-Copper Composite Material Description of Product: Molybdenum-copper composite materials are produced by copper infiltration of porous sintered molybdenum. They are available with different copper contents (15 - 35 %). A t..
Thermal Conductivity	170 W/m-K	1180 BTU-in/hr-ft²-°F	ASTM E1461
M Cubed Technologies SSC-702 Reaction-Bonded Silicon Carbide Medium-grained reaction-bonded SiC for high wear applications. Bullnoses, fan liners, hydrocyclone liners, etc. Can be cast into very large shapes (greater than 4 ft. square, 5-6 inches thick)Info..
Thermal Conductivity	170 W/m-K	1180 BTU-in/hr-ft²-°F
UCAR Carbon UCAR® CSX Extruded Graphite Densified prior to graphitization, Grade CSX is an extruded graphite, higher in strength and lower in permeability than CS. It is a material for applications requiring higher densities, better mecha..
Thermal Conductivity	170 W/m-K	1180 BTU-in/hr-ft²-°F
UCAR Carbon UCAR® SLX Extruded Graphite Densified prior to graphitization, Grade SLX is an extruded graphite with increased densities and strength over SL.Typical Applications:CZ silicon crystal growth Quartz processing Purified electroni..
Thermal Conductivity	170 W/m-K	1180 BTU-in/hr-ft²-°F	ASTM-C408
CeramTec Alunit® HS Aluminum Nitride Alunit® HS offers an extremely high thermal conductivity of 170 W/mK and outstanding electrical insulation properties. The thermal expansion coefficient of this material is comparable to silicon. I..
Thermal Conductivity	170 W/m-K	1180 BTU-in/hr-ft²-°F	ASTM E1461
M Cubed Technologies ASC-701 Aluminum alloy-70% SiC Metal Matrix Composite High stiffness, low density, low CTE composite. Components can be formed with complicated features, and can be machined to tight tolerances. Applications in high-precision equipment--semiconductor..
Thermal Conductivity	170 W/m-K	1180 BTU-in/hr-ft²-°F	ASTM E1461
M Cubed Technologies SSC-903 Reaction-Bonded Silicon Carbide Coards-grained reaction-bonded SiC for high wear applications. Bullnoses, fan liners, hydrocyclone liners, etc. Can be cast into very large shapes (greater than 4 ft. square, 5-6 inches thick)Info..
Thermal Conductivity	>= 170 W/m-K	>= 1180 BTU-in/hr-ft²-°F	ASTM E1461
CoorsTek AIN-170 Hot Pressed Aluminum Nitride Aluminum Nitride Advantages: High heat dissipation with thermal conductivity of 170 W/m K Non-toxic alternative to BeO Thermal expansion coefficient similar to Si, GaN, and GaAs semiconductors H..
Thermal Conductivity	170 W/m-K	1180 BTU-in/hr-ft²-°F
CMW® ELKONITE® 35S Silver Tungsten contact material ASTM B631, Class B, infiltrated For arcing and current carrying electrical contacts; household and power circuit breakers.Information provided by CMW Inc.
Thermal Conductivity	170.0 - 220.0 W/m-K	1180 - 1527 BTU-in/hr-ft²-°F
ALIMEX PLANAL 6082 T651 Aluminum Alloy Aluminium rolled plates which have been machined on both sides. Has a precise surface finish and high tensile strength. The temper values and the material conditions are not changed by surface-machi..
Thermal Conductivity	170 W/m-K	1180 BTU-in/hr-ft²-°F
Ceradyne Ceralloy® 1370CS Aluminum Nitride Features:high thermal conductivityApplications:semiconductor componentsInformation provided by Ceradyne Company
Thermal Conductivity	170 W/m-K	1180 BTU-in/hr-ft²-°F
Ceradyne Ceralloy® 1370DP Aluminum Nitride Features:high thermal conductivityApplications:semiconductor componentsmicrowave componentsInformation provided by Ceradyne Company
Thermal Conductivity	170.0 - 220.0 W/m-K	1180 - 1527 BTU-in/hr-ft²-°F
ALIMEX 6082 T651 Aluminum Alloy Rolled Rolled aluminium material according to DIN EN standard. Information provided by ALIMEX GmbHSolution heat treated, stress relieved by stretching a controlled amount and then artificially aged.
Thermal Conductivity	170 W/m-K	1180 BTU-in/hr-ft²-°F
Plansee MoCu15 Molybdenum-Copper Characteristics:High thermal conductivityLow thermal expansionLow densityApplications:Electronic components - passive cooling elementsAutomotive industry - carrier plates for IGBT modules in electri..