Polymer Property : Thermal Conductivity = 3.46 W/m-K Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Thermal Conductivity	0.140 - 3.46 W/m-K	0.972 - 24.0 BTU-in/hr-ft²-°F	Average value: 0.723 W/m-K Grade Count:74
Overview of materials for Epoxy Encapsulant, Unreinforced This property data is a summary of similar materials in the MatWeb database for the category "Epoxy Encapsulant, Unreinforced". Each property range of values reported is minimum and maximum values o..
Thermal Conductivity	3.17 - 3.46 W/m-K	22.0 - 24.0 BTU-in/hr-ft²-°F
Master Bond EP21ANHT Two Component, Room Temperature Curing Epoxy Adhesive Product Description: Master Bond Polymer Adhesive EP21ANHT is a two component room temperature curing adhesive, sealant and coating that combines high thermal conductivity and electrical insulation ..
Thermal Conductivity	3.17 - 3.46 W/m-K	22.0 - 24.0 BTU-in/hr-ft²-°F
Master Bond EP37-3FLFAN Electrically Isolating, Flexible Epoxy Description: Master Bond Polymer System EP37-3FLFAN is a two component system for high performance potting, bonding, sealing and coating that is formulated to cure at room temperature or more rapidl..
Thermal Conductivity	3.17 - 3.46 W/m-K	22.0 - 24.0 BTU-in/hr-ft²-°F
Master Bond Supreme 11ANHT Fast Curing Epoxy Paste System Description: Master Bond Polymer System SUPREME 11ANHT is a two component epoxy resin system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevat..
Thermal Conductivity	3.31 - 3.46 W/m-K	23.0 - 24.0 BTU-in/hr-ft²-°F
Master Bond Supreme 3AN One Component, Heat Curing Epoxy Adhesive Description: Master Bond Polymer System SUPREME 3AN is a one component, heat cured epoxy adhesive and sealant, featuring high peel and shear strength along with excellent thermal conductivity and co..
Thermal Conductivity	3.31 - 3.46 W/m-K	23.0 - 24.0 BTU-in/hr-ft²-°F
Master Bond Supreme 3ANHT Epoxy Adhesives for Bonding Stainless Steel Description: Master Bond Polymer System Supreme 3ANHT is a one component, heat cured epoxy adhesive and sealant, featuring high peel and shear strength along with good thermal conductivity and conve..