Polymer Property : Cure Time = 10100 min Product List

Processing Properties

Tips: 30 items are displayed at most. For the rest of the results, please contact customer service.

Processing Properties	Metric	English	Comments
Cure Time	10100 min @Temperature 24.0 °C	168 hour @Temperature 75.2 °F	produces lower electrical conductivity
Parker Chomerics CHO-BOND 592 Conductive Epoxy Highly conductive silver-filled epoxy adhesive which combines the best properties of metals and organics. This two-component system is unique in that it combines long pot life, good electrical condu..
Cure Time	10100 min @Temperature 24.0 °C	168 hour @Temperature 75.2 °F
Parker Chomerics CHO-BOND® 592 Conductive Adhesive Description: CHO-BOND® 500 Series Adhesive/Sealant Compounds; These pure silver-filled materials are used where tight tolerances require thin bond lines. Various cure cycles are available, and the ..
Cure Time	10100 min @Temperature 15.5 - 21.0 °C	168 hour @Temperature 59.9 - 69.8 °F	40-60% RH
Parker Chomerics CHO-SHIELD® 4994 Conductive Flexible Coating Description: CHO-SHIELD® 4994 is a smooth, highly conductive flexible silver-filled polyurethane coating designed for military/aerospace airframe applications. Both coatings provide superior adhesi..
Cure Time	10100 min @Temperature 23.8 °C	168 hour @Temperature 74.8 °F
Parker Chomerics CHO-SHIELD® 576 Platable Silver Epoxy Coating Description: CHO-SHIELD® 576 coating is a two component, silver filled, highly conductive epoxy paint designed to provide EMI shielding when applied to a dielectric plastic substrate. This coating ..
Cure Time	10100 min @Temperature 23.0 °C	168 hour @Temperature 73.4 °F
Parker Chomerics CHO-SHIELD® 610 A/B Conductive Epoxy Paint Highly Conductive Epoxy Paint. This is a two-component, silver plated, copper-filled, highly conductive epoxy paint. This coating was developed for application to non-conductive plastic substrates t..
Cure Time	10100 min @Temperature 24.0 °C	168 hour @Temperature 75.2 °F
Parker Chomerics CHO-SHIELD® 610 A/B Epoxy Conductive Coating Description: CHO-SHIELD® 610 A/B is a highly conductive, two-component silver-plated-copper filled epoxy coating for application to non-conductive plastic substrates, particularly those subject to ..
Cure Time	10100 min @Temperature 25.0 °C	168 hour @Temperature 77.0 °F
Parker Chomerics CHO-THERM 1642 Thermally Conductive Silicone Thermally Conductive Silicone Compound. This compound is a two-component thermally conductive adhesive/sealant/caulk/potting compound that also combines the features of silicone and ceramics. It is ..
Cure Time	10100 min @Temperature 24.0 °C	168 hour @Temperature 75.2 °F
Parker Chomerics Tecknit® 0036 Two Part Flexible Adhesive-Sealant Silver-Glass Silicone Description: TECKNIT 0036 is an electrically conductive, medium viscosity, RTV silicone adhesive-sealant. This silver-plated glass filled system is formulated with a special conductive material pro..
Cure Time	10100 min @Temperature 25.0 °C	168 hour @Temperature 77.0 °F	50%; Full Cure
Parker Chomerics Tecknit® 72-00151 Silver-Filled Flexible Resin Caulking System Description: TECKNIT standard electrically conductive caulks consist of four one-component resin systems filled with silver plated glass or copper particles. These systems are formulated to provide ..
Cure Time	10100 min @Temperature 25.0 °C	168 hour @Temperature 77.0 °F	50%; Full Cure
Parker Chomerics Tecknit® 72-00152 Silver-Filled Flexible Resin Caulking System Description: TECKNIT standard electrically conductive caulks consist of four one-component resin systems filled with silver plated glass or copper particles. These systems are formulated to provide ..
Cure Time	10100 min @Temperature 23.0 °C	168 hour @Temperature 73.4 °F
Parker Chomerics THERM-A-FORM 1642 Cure-in-Place Potting and Underfill Material Description: THERM-A-FORM™ thermally conductive silicone elastomer products are dispensable form-in-place compounds designed for heat transfer without excessive compressive force in electronics co..
Cure Time	10100 min @Temperature 25.0 °C	168 hour @Temperature 77.0 °F	50%; Full Cure
Parker Chomerics Tecknit TeckBond™-C Silver-Plated Copper-Filled Adhesive Description: TECKBOND-C is a silicone rubber base filled with silver-plated copper particles to produce a highly conductive one-component adhesive sealant. The system is an RTV moisture-cured compou..
Cure Time	10100 min @Temperature 25.0 °C	168 hour @Temperature 77.0 °F	50%; Full Cure
Parker Chomerics Tecknit TeckBond™-NC Nickel Coated Graphite-Filled Adhesive Description: TECKBOND-NC is a silicone rubber base filled with nickel coated graphite particles to produce a highly conductive one-component adhesive sealant. The system is an RTV moisture-cured com..
Cure Time	10100 min @Temperature 24.0 °C	168 hour @Temperature 75.2 °F
Parker Chomerics CHO-BOND 1029 Conductive Adhesive CHO-BOND® 1029 is a highly conductive silicone adhesive, intended for bonding Chomerics’ conductive silicone EMI gaskets to electrically conductive substrates. It is a two-component, siliver-plate..
Cure Time	10100 min @Temperature 24.0 °C	168 hour @Temperature 75.2 °F
Parker Chomerics CHO-BOND 2165 Polyurethane Sealant Conductive sealant is a stabilized copper filled, two component polyurethane. It has excellent electrical and physical properties for aerospace and military applications. CHO-BOND® 2165 sealant is ..
Cure Time	10100 min @Temperature 25.0 Â°C	168 hour @Temperature 77.0 Â°F	UR312
Lord Adhesives Thermosetâ„¢ UR312 / UR324 Urethane Encapsulating Gel UR312 A/B and UR324 A/B are the same components used at different mix ratios, therefore, giving different properties.LORD UR312 and UR324 are two-component, room temperature curing urethane gels. Th..
Cure Time	10100 min @Temperature 25.0 Â°C	168 hour @Temperature 77.0 Â°F	UR324
Lord Adhesives Thermosetâ„¢ UR312 / UR324 Urethane Encapsulating Gel UR312 A/B and UR324 A/B are the same components used at different mix ratios, therefore, giving different properties.LORD UR312 and UR324 are two-component, room temperature curing urethane gels. Th..
Cure Time	10100 min @Temperature 24.0 °C	168 hour @Temperature 75.2 °F
Tra-Con Tra-Bond 9392 Flexible Potting Epoxy Adhesive TRA-BOND 9392 is a low viscosity, two-part polyurethane formulation recommended for potting and molding where flexibility and temperature resistance are required. TRA-BOND 9349 is a room temperature..
Cure Time	10100 min @Thickness 10.5 mm	168 hour @Thickness 0.413 in	room temp
Loctite® 5920™ RTV Silicone Sealant LOCTITE® 5920™ is a moisture-curing, non-corrosive silicone. The thixotropic nature of LOCTITE® 5920™ reduces the migration of liquid product after application to the substrate. It has been desi..
Cure Time	10100 min @Temperature 25.0 °C	168 hour @Temperature 77.0 °F	Full Chemical
Chesterton ARC 791 Composite Description: A quartz reinforced composite designed to resurface and restore concrete surfaces, to protect new concrete, and to repair concrete damaged by chemical and physical abuse. ARC 791 has ex..
Cure Time	10100 min @Temperature 32.0 °C	168 hour @Temperature 89.6 °F	Chemical Resistance
Chesterton ARC 982 100% Novolac acid resistant coating Description: An advanced polymer composite formulated to protect equipment from extreme chemical attack and corrosion. A low viscosity composite that is applied by brush, squeegee, or a plural compo..
Cure Time	10100 min @Temperature 16.0 °C	168 hour @Temperature 60.8 °F	Full Mechanical/Chemical
Chesterton ARC MXHT High temperature severe wear compound Description: An advanced ceramic composite for the protection of all metal surfaces subjected to severe erosion, abrasion and chemical attack at elevated temperatures. It is applied at a thickness o..
Cure Time	10100 min @Temperature 25.0 °C	168 hour @Temperature 77.0 °F	Full Chemical
Chesterton ARC PW Potable Water Coating Description: ARC PW is a 100% solids lining certified for NSF/ANSI 61 potable water, cold water service. It is recommended to be applied by brush, roll or spray at 500-750 microns (20-30 mils) total..
Cure Time	10100 min @Temperature 25.0 °C	168 hour @Temperature 77.0 °F	Full Chemical
Chesterton ARC S1 General purpose coating Description: An advanced polymer composite formulated to protect metal surfaces from corrosion and chmical attack. It is normally applied at a thickness of 250 microns (10 mils) per coat. Non-shrink..
Cure Time	10100 min @Temperature 24.0 °C	168 hour @Temperature 75.2 °F
Parker Chomerics CHO-SHIELD® 596 A/B Silver-Epoxy Coating Silver-Epoxy Coating. This is a two-component, silver bearing, highly conductive epoxy paint designed to provide EMI shielding when applied to a dielectric substrate. It is also useful for coating f..
Cure Time	10100 min @Temperature 23.9 °C	168 hour @Temperature 75.0 °F
Parker Chomerics CHO-SHIELD® 598 A/B Silver-Epoxy Coating Silver-Epoxy Coating. This coating is a two-component, silver bearing, highly conductive epoxy paint designed to provide EMI shielding when applied to a plastic, non-conductive substrate. Used as a ..