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Parker Chomerics THERM-A-FORM 1642 Cure-in-Place Potting and Underfill Material

Category Polymer , Thermoset , Silicone
Manufacturer Parker Chomerics
Trade Name THERM-A-FORM
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Parker Chomerics THERM-A-FORM 1642 Cure-in-Place Potting and Underfill Material.pdf
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Material Notes:
Description: THERM-A-FORM™ thermally conductive silicone elastomer products are dispensable form-in-place compounds designed for heat transfer without excessive compressive force in electronics cooling applications. These versatile liquid reactive materials can be dispensed and cured into complex geometries for cooling of multi-height components on a PCB without the expense of a molded sheet. Each compound is available in ready-to-use cartridge systems, eliminating weighing, mixing, and degassing procedures.Product Attributes: General duty, economical thermal solution and two-component thermally conductive encapsulant/sealant/caulk/potting compound, supplied with primer 1087. (primer is not required for cure but promotes adhesion)Information provided by Chomerics
Physical Properties Metric English Comments
Specific Gravity 2.30 g/cc
2.30 g/cc
ASTM D792
Viscosity 3.0 cP
3.0 cP
ASTM D2196
Outgassing - Total Mass Loss 0.18 %
0.18 %
CVCM; ASTM D595
0.40 %
0.40 %
TML; ASTM D595
Mechanical Properties Metric English Comments
Hardness, Shore A 76
76
ASTM D2240
Thermal Properties Metric English Comments
CTE, linear 200 µm/m-°C
111 µin/in-°F
ASTM E831
Specific Heat Capacity 1.00 J/g-°C
0.239 BTU/lb-°F
ASTM E1269
Thermal Conductivity 0.950 W/m-K
6.59 BTU-in/hr-ft²-°F
ASTM D5470
Maximum Service Temperature, Air 200 °C
392 °F
Minimum Service Temperature, Air -70.0 °C
-94.0 °F
Brittleness Temperature -75.0 °C
-103 °F
ASTM D2137
Electrical Properties Metric English Comments
Volume Resistivity 1.00e+13 ohm-cm
1.00e+13 ohm-cm
ASTM D257
Dielectric Constant 3.9

@Frequency 1.00e+6 Hz
3.9

@Frequency 1.00e+6 Hz
ASTM D150
Dielectric Strength 20.0 kV/mm
508 kV/in
ASTM D149
Dissipation Factor 0.010

@Frequency 1.00e+6 Hz
0.010

@Frequency 1.00e+6 Hz
Chomerics
Processing Properties Metric English Comments
Cure Time 60.0 min

@Temperature 100 °C
1.00 hour

@Temperature 212 °F
240 min

@Temperature 65.0 °C
4.00 hour

@Temperature 149 °F
10100 min

@Temperature 23.0 °C
168 hour

@Temperature 73.4 °F
Pot Life 60.0 min

@Temperature 23.0 °C
60.0 min

@Temperature 73.4 °F
2X Starting Viscosity
Shelf Life 12.0 Month
12.0 Month
From date of Manufacture
Descriptive Properties Value Comments
Binder Silicone
Color Purple
Filler Aluminum Oxide
Mix Ratio 100:3
Number of Components 2-part
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