Polymer Property : Dielectric Strength = 410 kV/in Product List

Electrical Properties

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Electrical Properties	Metric	English	Comments
Dielectric Strength	16.1 kV/mm	410 kV/in
Resinlab® EP1112 Clear Electronic Grade Epoxy Encapsulant Resinlab™ EP 1112 Clear is a two part unfilled fast curing electronic grade epoxy encapsulant designed for small to medium sized castings. It cures completely at room temperature to a tough, flexib..
Dielectric Strength	16.1 kV/mm	410 kV/in	in Air, 0.125 in; ASTM D149
Ravago Manufacturing Americas Hylex® P1007L Polycarbonate Information provided by Ravago
Dielectric Strength	16.1 kV/mm @Thickness 3.17 mm	410 kV/in @Thickness 0.125 in	in Air; ASTM D149
Ravago Manufacturing Americas Hylex® P1010L Polycarbonate, Unreinforced, Intermediate Flow Information provided by Ravago.
Dielectric Strength	16.1 kV/mm @Thickness 3.17 mm	410 kV/in @Thickness 0.125 in	in Air; ASTM D149
Ravago Manufacturing Americas Hylex® P1017L Polycarbonate, Unreinforced, High Flow, Mold Release Information provided by Ravago.
Dielectric Strength	16.1 kV/mm	410 kV/in	in Air, 0.125 in; ASTM D149
Ravago Manufacturing Americas Hylex® P1307L Polycarbonate Entec's proprietary products include a full range of compounds in the Nylon 6/6, Nylon 6, ABS, PBT, Polycarbonate, PC/ABS, PC/ASA, PC/PBT, and PPO/PPE resin families.Information provided by Ente..
Dielectric Strength	16.1 kV/mm	410 kV/in
Resinlab® EP1340 Medium Viscosity, Flame Retardant Epoxy Casting Resin System Resinlab™ EP1340 is a medium viscosity, flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Laboratories Inc., (File# E186034) for U..
Dielectric Strength	16.1 kV/mm	410 kV/in
Resinlab® EP691 Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP 691 Black is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wetting..
Dielectric Strength	16.1 kV/mm	410 kV/in
Resinlab® EP750 Clear Unfilled Epoxy Structural Adhesive Resinlab™ EP750 Clear is a two part unfilled epoxy structural adhesive which ingredients are listed in the Code of Federal Regulations Title 21 175.105 (Adhesives) and 175.300 (Resinous and polymer..
Dielectric Strength	16.1 kV/mm	410 kV/in
Resinlab® EP950NMF Gray Non-Metallic Filled Rubber Modified Epoxy Resinlab™ EP950NMF Gray is a non-metallic filled version of EP950G. It is a one-part rubber modified epoxy designed for bonding metal and other structural material subject to stress at elevated tem..
Dielectric Strength	16.1 kV/mm	410 kV/in	Method A (Short-Time); ASTM D149
Techmer ES HiFill FRÂ® PA6 GF33 FR HS L BK065 33% Glass Filled (Dry) Availability: North AmericaForms: PelletsFiller/Reinforcement: Glass Fiber Reinforcement, 33% Filler by WeightAdditive: Heat Stabilizer and LubricantFeatures: Flame Retardant, Heat Stabilized and Lu..
Dielectric Strength	16.1 kV/mm	410 kV/in	Method A (Short-Time); ASTM D149
Techmer ES HiFillÂ® PA6 GF30 HS BK 30% Glass Filled Availability: North AmericaForms: PelletsFiller/Reinforcement: Glass Fiber Reinforcement, 30% Filler by WeightAdditive: Lubricant and Heat StabilizerFeatures: Lubricated and Heat StabilizedAppearanc..
Dielectric Strength	16.1 kV/mm	410 kV/in	Method A (Short-Time); ASTM D149
Techmer ES HiFillÂ® PA6 GF33 HS L BK001 33% Glass Filled Availability: North AmericaForms: PelletsFiller/Reinforcement: Glass Fiber Reinforcement, 33% Filler by WeightAdditive: Lubricant and Heat StabilizerFeatures: Heat Stabilized and LubricatedAppearanc..
Dielectric Strength	16.1 kV/mm	410 kV/in	Method A (Short-Time); ASTM D149
Techmer ES HiFillÂ® PA6 GF33 L BK001 33% Glass Filled Availability: North AmericaForms: PelletsFiller/Reinforcement: Glass Fiber Reinforcement, 33% Filler by WeightAdditive: Lubricant Features: LubricatedAppearance: BlackTPCI# 8221102Information provid..
Dielectric Strength	16.1 kV/mm	410 kV/in	Method A (Short-Time); ASTM D149
Techmer ES HiFillÂ® PA6 GF5 L 5% Glass Filled Availability: North AmericaForms: PelletsFiller/Reinforcement: Glass Fiber Reinforcement, 5% Filler by WeightAdditive: Lubricant Features: LubricatedAppearance: Natural ColorInformation provided by ..
Dielectric Strength	16.1 kV/mm	410 kV/in	Method A (Short-Time); ASTM D149
Techmer ES HiFillÂ® PA6/6 GB10 L 10% Glass Bead Filler Availability: North AmericaForms: PelletsFiller/Reinforcement: Glass Bead, 10% Filler by WeightAdditive: LubricantFeatures: LubricatedInformation provided by TP Composites, Inc.
Dielectric Strength	16.1 kV/mm	410 kV/in	Method A (Short-Time); ASTM D149
Techmer ES HiFillÂ® PA6/6 GB15 15% Glass Bead Filler Availability: North AmericaForms: PelletsFiller/Reinforcement: Glass Bead, 15% Filler by WeightAdditive: LubricantFeatures: LubricatedInformation provided by TP Composites, Inc.
Dielectric Strength	16.1 kV/mm	410 kV/in	Method A (Short-Time); ASTM D149
Techmer ES HiFillÂ® PA6/6 GB30 L 30% Glass Bead Filler Availability: North AmericaForms: PelletsFiller/Reinforcement: Glass Bead, 30% Filler by WeightAdditive: LubricantFeatures: LubricatedInformation provided by TP Composites, Inc.
Dielectric Strength	16.1 kV/mm	410 kV/in	Method A (Short-Time); ASTM D149
Techmer ES HiFillÂ® PBT 613 RD Availability: North AmericaForms: PelletsUL File Number: E157318Appearance: Red8661111Information provided by TP Composites, Inc.
Dielectric Strength	16.1 kV/mm	410 kV/in	Method A (Short-Time); ASTM D149
Techmer ES HiFillÂ® PBT 620 Availability: North AmericaForms: PelletsFeatures: Medium FlowAppearance: Natural ColorInformation provided by TP Composites, Inc.
Dielectric Strength	16.1 kV/mm	410 kV/in	Method A (Short-Time); ASTM D149
Techmer ES HiFillÂ® PBT G/CF30 40% Glass Bead Filler Availability: North AmericaForms: PelletsFiller/Reinforcement: Glass Bead, 40% Filler by WeightInformation provided by TP Composites, Inc.
Dielectric Strength	16.1 kV/mm	410 kV/in	Method A (Short-Time); ASTM D149
Techmer ES HiFillÂ® PBT HS BK Availability: North AmericaForms: PelletsAdditive: Heat StabilizerFeatures: Good Flow, Good Processability and Heat StabilizedAppearance: BlackInformation provided by TP Composites, Inc.
Dielectric Strength	16.1 kV/mm	410 kV/in	Method A (Short-Time); ASTM D149
Techmer ES StatiblendÂ® PA6 GF30 AS BK 30% Glass Filled Availability: North AmericaForms: PelletsFiller/Reinforcement: Glass Fiber, 30% Filler by WeightAdditive: AntistaticFeatures: AntistaticAppearance: BlackInformation provided by TP Composites, Inc.
Dielectric Strength	16.1 kV/mm	410 kV/in	Method A (Short-Time); ASTM D149
Techmer ES HiFill FRÂ® PET GF15 IM FR X 15% Glass Filled Availability: North AmericaForms: PelletsFiller/Reinforcement: Glass Fiber, 15% Filler by WeightAdditive: Impact Modifier and Mold ReleaseFeatures: Flame Retardant, Good Mold Release and Impact Modi..
Dielectric Strength	16.1 kV/mm	410 kV/in
Tra-Con Tra-Bond 2114 Water White Transparent Epoxy Adhesive TRA-BOND 2114 is a transparent, low viscosity epoxy resin formulation recommended for industrial adhesive and laminating applications where sparkling clarity and excellent structural, mechanical and..
Dielectric Strength	16.1 kV/mm	410 kV/in
Tra-Con Tra-Bond 216L01 Clear Low Viscosity Epoxy Adhesive TRA-BOND 216L01 is a clear, low viscosity epoxy adhesive system that contains no solvents, cures at room temperature, has excellent flowability and wetting characteristics, and adheres strongly to g..
Dielectric Strength	16.1 kV/mm	410 kV/in
Tra-Con Tra-Bond 2104 Rigid Epoxy Staking Compound TRA-BOND 2104 is a thixotropic epoxy system recommended for critical electronic, aerospace and industrial bonding, laminating and reinforcing applications requiring an adhesive with high-fill, non-s..
Dielectric Strength	16.1 kV/mm	410 kV/in
Atom Adhesives AA-BOND 2153 Epoxy Adhesive AA-BOND 2153 is a thixotropic (smooth paste) thermal conductive epoxy system that passes the NASA Outgassing Specification. It is used for staking transistors, diodes, resistors, integrated circuits..
Dielectric Strength	16.1 kV/mm	410 kV/in
Resinlab® EP1112 Black Electronic Grade Epoxy Encapsulant Resinlab™ EP 1112 Black is a two part unfilled fast curing electronic grade epoxy encapsulant designed for small to medium sized castings. It cures completely at room temperature to a tough, flexib..