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Dow SiLK™ I 260 Semiconductor Dielectric Resin

Category Polymer
Manufacturer Dow Chemical
Trade Name SiLK™
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Dow SiLK™ I 260 Semiconductor Dielectric Resin.pdf
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Material Notes:
SiLK™ I 260 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 260 is compatible with standard IC processing tools in todays fabrications. SiLK™ I 260 is fluorine-free, thus is compatible with Ti and Ta barrier materials.Information provided by Dow
Physical Properties Metric English Comments
Water Absorption 0.24 %
0.24 %
80% R.H.
Thickness 0.260 microns
0.0102 mil
3000 rpm
0.230 - 0.320 microns
0.00906 - 0.0126 mil
2000-4000 rpm
Mechanical Properties Metric English Comments
Tensile Strength, Ultimate 89.0 MPa
12900 psi
Tensile Strength, Yield 60.0 MPa
8700 psi
Tensile Modulus 2.45 GPa
355 ksi
Thermal Properties Metric English Comments
CTE, linear 62.0 µm/m-°C

@Temperature 50.0 - 410 °C
34.4 µin/in-°F

@Temperature 122 - 770 °F
Thermal Conductivity 0.190 W/m-K
1.32 BTU-in/hr-ft²-°F
0.230 W/m-K

@Temperature 125 °C
1.60 BTU-in/hr-ft²-°F

@Temperature 257 °F
Glass Transition Temp, Tg >= 490 °C
>= 914 °F
Decomposition Temperature 450 °C
842 °F
1% weight loss per hour
Optical Properties Metric English Comments
Refractive Index 1.63
1.63
Electrical Properties Metric English Comments
Dielectric Constant 2.6

@Frequency 100000 Hz
2.6

@Frequency 100000 Hz
Dielectric Strength >= 400 kV/mm
>= 10200 kV/in
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