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Loctite® 3532 High viscosity Dam Encapsulant

Category Polymer , Adhesive , Thermoset
Manufacturer Loctite
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Loctite® 3532 High viscosity Dam Encapsulant.pdf
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Material Notes:
COB/DCA Encapsulants are essential to the reliability of flip chip assemblies because they minimize the thermal mismatch between the flip chip and substrate.Loctite® Underfills and Encapsulants improve assembly operations by providing superior reliability and faster throughput. Improved reliability is achieved through products that have a high Tg, low CTE, high throughput and excellent adhesion. Faster throughput and higher yields are achieved through faster flow characteristics and increased cure speeds.Loctite® 3532 High viscosity Dam EncapsulantUtilized in applications where COB density favors square or rectangular footprints, or where potting wells or indentations are not provided. "Dam" material controls flow of liquid encapsulant.
Physical Properties Metric English Comments
Density 1.76 g/cc
0.0636 lb/in³
Viscosity 250000 cP
250000 cP
Haake cone and plate rheometer @ 5/sec (35mm/2° cone)
Thermal Properties Metric English Comments
CTE, linear 19.0 µm/m-°C

@Temperature 20.0 °C
10.6 µin/in-°F

@Temperature 68.0 °F
Glass Transition Temp, Tg 155 °C
311 °F
Electrical Properties Metric English Comments
Volume Resistivity 3.10e+15 ohm-cm
3.10e+15 ohm-cm
Surface Resistance 2.40e+16 ohm
2.40e+16 ohm
Processing Properties Metric English Comments
Cure Time 30.0 min

@Temperature 150 °C
0.500 hour

@Temperature 302 °F
Full Cure
Shelf Life 3.00 Month

@Temperature -40.0 °C
3.00 Month

@Temperature -40.0 °F
Descriptive Properties Value Comments
Color Black
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