Polymer Property : Cure Time = 30.0 min Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Cure Time	30.0 min	0.500 hour	With Primer (Full)
ND Industries 542 Shaft & Bearing Retainer Retaining Compound Very high strength retainer for gears, wheels, pulleys, fans, cams, collars, flywheels, rotors to shaftMeets military spec Mil-R-46082B Type III
Cure Time	30.0 min @Temperature 24.0 °C	0.500 hour @Temperature 75.2 °F
Parker Chomerics Tecknit® 239 Primer Typical Applications: Primer for TECKNIT 0192 & 0193Information provided by Chomerics
Cure Time	30.0 - 60.0 min	0.500 - 1.00 hour	working strength
Permabond TA440 Toughened Acrylic Adhesive PERMABOND TA440 is a two component structural acrylic adhesive suitable for bonding metals, glass, wood, ferrites, ceramics and some rigid plastics. This adhesive may be used in a variety of structu..
Cure Time	30.0 min @Temperature 152 °C	0.500 hour @Temperature 305 °F
TSE Industries Millathane® 5004 Millable Polyurethane Elastomer with 20 PHR N330 (HAF) Black MILLATHANE 5004 is a millable polyurethane elastomer having excellent processing characteristics. MILLATHANE 5004 stocks can be readily processed on conventional rubber equipment. Vulcanization is c..
Cure Time	30.0 min @Temperature 150 Â°C	0.500 hour @Temperature 302 Â°F
Lord Adhesives Thermosetâ„¢ ME-455 Epoxy Board Level Encapsulant LORD Thermosetâ„¢ ME-455 encapsulant is a onecomponent, semiconductor grade epoxy designed for the encapsulation of wire-bonded or flip chip die in PPGA, BGA, MCM and other cavity packages. It is..
Cure Time	30.0 - 40.0 min	0.500 - 0.667 hour	Working time
ITW Devcon Safety Clear Coatâ„¢ Epoxy, Water Clear Information provided by ITW Devcon
Cure Time	30.0 min @Temperature 130 Â°C	0.500 hour @Temperature 266 Â°F
Gwent Electronic Materials C2010903D2 Curable Silver Range This product is based on a unique curing process that results in the low temperature formation of a thermosetting conductive adhesive that combines good adhesion with excellent electrical properties..
Cure Time	30.0 - 60.0 min @Temperature 150 Â°C	0.500 - 1.00 hour @Temperature 302 Â°F
Gwent Electronic Materials C2050425D1 Curable Carbon Ink This product is based on a unique curing process that results in the low temperature formation of a thermosetting conductive coating that combines good adhesion with excellent chemical, solvent and ..
Cure Time	30.0 - 45.0 min	0.500 - 0.750 hour	At 160°F plus 2-3 hrs at 300°F
Master Bond EP30-3 High Temperature Resistant Two Component Epoxy Master Bond Polymer System EP30-3 is a two component, low viscosity epoxy featuring optical clarity and high temperature serviceability up to 450°F along with superior chemical resistance. EP30-3 h..
Cure Time	30.0 min @Temperature 150 °C	0.500 hour @Temperature 302 °F	Full Cure
Loctite® 3532 High viscosity Dam Encapsulant COB/DCA Encapsulants are essential to the reliability of flip chip assemblies because they minimize the thermal mismatch between the flip chip and substrate.Loctite® Underfills and Encapsulants imp..
Cure Time	30.0 min @Temperature 70.0 °C	0.500 hour @Temperature 158 °F
Dow Corning SE 1885 KIT Two-part, clear, 1:1, addition cure, low temperature cure, low temperature capable, low viscosity.Information provided by Dow Corning
Cure Time	30.0 min @Temperature 120 °C	0.500 hour @Temperature 248 °F
Dow Corning SE 4440 LP KIT Two-part, grey, 1:1, addition cure gel, good thermal conductivity, low viscosity.Information provided by Dow Corning
Cure Time	30.0 min @Temperature 180 °C	0.500 hour @Temperature 356 °F
Dow BETAMATE™ XW 1185 Epoxy BETAMATE™ XW 1185 is a one component heat curing Epoxy paste adhesive. The material is readily pumped at ambient temperatures. It shows excellent adhesion to automotive steel and aluminum, is resi..
Cure Time	30.0 min @Temperature 120 °C	0.500 hour @Temperature 248 °F
Dow Corning SE 4446 CV KIT Two-part, grey, 1:1, addition cure gel, good thermal conductivity, controlled volatility.Information provided by Dow Corning
Cure Time	30.0 - 60.0 min	0.500 - 1.00 hour	Dry to touch, RT @ 50%RH
3M CP 25WB+ Fire Barrier Sealant 3M Fire Barrier Sealant CP 25WB+ is a high-performance, ready-to-use, gun-grade, latex-based, intumescent sealant that dries to form a monolithic fire-stop seal that also acts as a barrier to airbor..
Cure Time	30.0 min @Temperature 93.3 °C	0.500 hour @Temperature 200 °F	0.25 hr at 480°F, 0.20 hr at 1000°F
Aremco Glass-Coat™ SGC4000 High Temperature Specialty Coatings Silicone-Glass Silicone-glass-ceramic, gray, low viscosity, scratch resistant coating for stainless steel to 900°F (482°C)
Cure Time	30.0 min	0.500 hour
3M Scotch-Weld™ 3535 B/A Two-Part Structural Adhesive 3M™ Scotch-Weld™ Urethane Adhesives are two-component, polyurethane adhesives which cure at room temperature or with heat to form tough, impact-resistant structural bonds. Their adhesion propertie..