Physical Properties | Metric | English | Comments |
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Density | 1.76 g/cc | 0.0636 lb/in³ | |
Park Electrochemical Nelcote® S-860 Silicone Prepreg, 1581-112NPH E-Glass Reinforced Nelcote® S-860 is a MIL-P-25518 type silicone resin with a good combination of electrical and high temperature properties. GMS4001 qualified specificationsKey Features and Benefits:500°F maximum s.. |
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Density | 1.76 g/cc | 0.0636 lb/in³ | ASTM D792 |
SABIC Innovative Plastics LNP KONDUIT OX11315 PPS (Asia Pacific) Thermally conductive electrically insulative mineral filled PPS FR compound. |
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Density | 1.76 g/cc | 0.0636 lb/in³ | ISO 1183 |
Celanese Celstran® TPU-GF60-01-US TPU, 60% Glass Reinforced
(Unverified Data**) 60% long strand glass fiber reinforced thermoplastic polyurethane60% long strand glass fiber reinforced thermoplastic polyurethaneCelstran can be processed on a standard injection molding unit.Infor.. |
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Density | 1.76 g/cc | 0.0636 lb/in³ | ISO 1183 |
Solvay Specialty Polymers Solef® 61010 PVDF Copolymer
(discontinued **) Key features of this grade: Permanent Plasticizing, Fuel Line, Piping, Formulated. Recommended processing is extrusion. Available as granules.General information about SOLEF® PVDF: SOLEF® PVDF i.. |
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Density | 1.76 g/cc | 0.0636 lb/in³ | |
LATI Laticonther 62 GR/70 PA 6, 70% Graphite Reinforced High thermal conductivity product based on Polyamide 6 (PA6). Graphite.Availability: Africa & Middle East; Asia Pacific; Europe; Latin America; North AmericaInformation provided by Lati Industria Te.. |
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Density | 1.76 g/cc | 0.0636 lb/in³ | ISO 1183 |
SABIC Innovative Plastics LNP LUBRICOMP UX05051 PPA (Europe-Africa-Middle East) Internally lubricated Polyphthalamide compound, containing Glass Fiber and PTFE. Added features include Heat Stabilized, Flame Retardant and Hot Water Moldable |
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Density | 1.76 g/cc | 0.0636 lb/in³ | ASTM D792 |
Solvay Specialty Polymers Ryton® BR42B Polyphenylene Sulfide (PPS), 40% Glass Fiber Ryton® BR42B 40% glass fiber reinforced polyphenylene sulfide compound is specially formulated to provide low coefficient of friction and reduced wear rate for use in applications requiring low s.. |
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Density | 1.76 g/cc | 0.0636 lb/in³ | ISO 1183 |
SABIC Innovative Plastics LNP THERMOCOMP 5C003 FP-V (PVDF) LNP THERMOCOMP* 5C003 is a compound based on Polyvinylidene Fluoride resin containing 15% Carbon Fiber. Added features of this material include: Electrically Conductive. |
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Density | 1.76 g/cc | 0.0636 lb/in³ | Relative Density; ASTM D792 |
Sumitomo Bakelite North America RX® 3-2-530-P Long-Glass Reinforced Diallyl Phthalate Long glass fiber reinforced, flame retardant, diallyl meta-phthalate molding compound which meets the requirements of ASTM D5948 Type GII-30F.Information provided by Vyncolit, a Sumitomo Bakelite Gr.. |
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Density | 1.76 g/cc | 0.0636 lb/in³ | ISO 1183 |
SABIC Innovative Plastics Valox® V8090 PBT+PET (Europe-Africa-Middle East) 50% Glass Fiber Reinforced PBT-PET resin |
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Density | 1.76 g/cc | 0.0636 lb/in³ | ISO 1183 |
SABIC Innovative Plastics LNP Thermocomp 5C003 LNP THERMOCOMP* 5C003 is a compound based on Polyvinylidene Fluoride resin containing Carbon Fiber. Added features of this material include: Electrically Conductive. Also known as THERMOCOMP* FP-VC.. |
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Density | 1.76 g/cc | 0.0636 lb/in³ | ASTM D792 |
SABIC Innovative Plastics LNP THERMOCOMP 5E003M FP-V (PVDF) LNP* THERMOCOMP* 5E003M is a compound based on PVDF resin containing 15% Milled Carbon Fiber. Added feature of this grade is: Electrically Conductive. |
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Density | 1.76 g/cc | 0.0636 lb/in³ | ASTM D792 |
SABIC Innovative Plastics LNP THERMOCOMP RX98372H PA 66 (Asia Pacific) LNP* Thermocomp* RX98372H is a compound based on Nylon 66 resin containing Glass Fiber. |
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Density | 1.76 g/cc | 0.0636 lb/in³ | |
UCAR Carbon UCAR® CHV Extruded Graphite Typical uses for extruded grades are in the production of molds and crucibles, heating elements and furnace furniture, liquid metal processing equipment and chemical process equipment.Tabular proper.. |
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Density | 1.76 g/cc | 0.0636 lb/in³ | |
Cosmic Plastics K31 Short Glass Fiber Filled Iso Diallyl Phthalate Molding Compound Data provided by the manufacturer. |
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Density | 1.76 g/cc | 0.0636 lb/in³ | ASTM D792 |
Plenco 6401 Phenolic, Briquette, Transfer Molded PLENCO 06401 is a glass fiber and mineral filled two-stage phenolic molding compound. UL recognized under component file E40654. 06401 is available in black.Information supplied by Plenco. |
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Density | 1.76 g/cc | 0.0636 lb/in³ | |
Toho Tenax Besfight® G30-500 12K HTA-7C EP01 Continuous Filament Carbon Fiber Standard Modulus; Collimated; Polyacrylonitrile (PAN) based fiberTypical values; measured by Toho Strand Test Method based on JIS R7601 for fiber selection purposes. Information provided by Toho Car.. |
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Density | 1.76 - 1.88 g/cc | 0.0636 - 0.0679 lb/in³ | ASTM D792 |
Zeus PVDF Tubing PVDF, polyvinylidene fluoride, delivers high performance at a competitive cost. Its inherent purity positions it as ideal for a variety of applications which involve extreme conditions. PVDF is char.. |
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Density | 1.76 g/cc | 0.0636 lb/in³ | |
Hexcel® HexTow™ IM6 Carbon Fiber HexTow™ IM6 carbon fiber is a continuous, high performance, intermediate modulus, PAN based fiber available in 12,000 (12K) filament count tows. The fiber has been surface treated and can be sized .. |
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Density | 1.76 g/cc | 0.0636 lb/in³ | ISO 1183 |
EMS-Grivory Grivory® 1SVX-65H nat PA1010-GF65 Product Description: Grilamid 1SVX-65H natural is a 65% glass fiber reinforced Polyamide 1010 injection molding grade with the following product profile: Raw materials based on renewable resources E.. |
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Density | 1.76 g/cc | 0.0636 lb/in³ | ISO 1183 |
DSM Stanyl® TW241F12 (DAM) Nylon 46 60% Glass Reinforced, Heat Stabilized, High Flow (North America) Information provided by DSM Engineering Plastics. |
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Density | 1.76 g/cc | 0.0636 lb/in³ | |
Cytec Thornel® T-300 3K Carbon Fiber, Polyacrylonitrile (PAN) Precursor Data provided by the manufacturer, Amoco Performance Products, Inc.Continuous length, high strength, high modulus fiber made from a polyacrylonitrile precursor. The fiber surface has been treated t.. |
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Density | 1.76 g/cc | 0.0636 lb/in³ | |
Epoxyset Epoxibond EB-348 Low Expansion Epoxy Adhesive EB-348 is a highly filled, extremely low expansion, epoxy adhesive. This low out-gassing adhesive exhibits excellent wettability without preheating metal bonding surfaces and has a good dimensional .. |
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Density | 1.76 g/cc | 0.0636 lb/in³ | DAM; ISO 1183 |
DuPont Performance Polymers Zytel® HTN FR52G45BL BK337 Polyphthalamide (PPA)
(Unverified Data**) 45% Glass Reinforced Flame Retardant PPA High Performance Polyamide Zytel HTNFR52G45BL BK337 is a 45% glass reinforced flame retardant lubricated high performance polyamide resin that has been devel.. |
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Density | 1.76 g/cc | 0.0636 lb/in³ | ASTM D792 |
Chem Polymer Durlex 740-10 GB PBT, 40% Short Glass Fiber, 10% Glass Bead Reinforced A 40% short glass fiber, 10% glass bead reinforced PBT, offering a combination of tensile strength, warpage control and dimensional stability for close tolerance applications.Data provided by the ma.. |
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Density | 1.76 g/cc | 0.0636 lb/in³ | ASTM D792 |
Applied Composites 8049 Polyester SMC Industry Application: High StrengthProduct Application: MilitaryDistinct Features: High Impact Low Profile; Paintable/In Mold Coatable; Low Shrink; Low Moisture Absorption; Bondable; Formulated for .. |
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Density | 1.76 g/cc | 0.0636 lb/in³ | ISO 1183 |
Celanese VECTRA S471 LCP, 45% Mineral / Glass Reinforced High flow, High Heat resistance, Low Warpage, for Thick Walled (>0.2mm) or thin ( |
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Density | 1.76 g/cc | 0.0636 lb/in³ | ISO 1183 |
3M Dyneon™ PVDF 32008/0003 Polyvinylidene Fluoride
(discontinued **) Copolymer of VF2 and CTFEUltra-flexibleVery low shrinkage ratesWide operating temperature windowProcessable using a variety of thermoplastic conversion techniquesExcellent low flame and low smoke pe.. |
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Density | 1.76 g/cc | 0.0636 lb/in³ | ASTM D792 |
Sumitomo Bakelite North America Epiall® 1960B-1 Mineral and Glass Filled Electrical Encapsulation Grade Epoxy Epiall 1960B-1 is a mineral and short fiberglass filled epoxy compound, formulated for the encapsulation of passive electronic devices.Information provided by Sumitomo Bakelite North America, Inc. |