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Loctite® 3563 Epoxy Snap Cure Underfill

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced
Manufacturer Loctite
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Loctite® 3563 Epoxy Snap Cure Underfill.pdf
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Material Notes:
COB/DCA Encapsulants are essential to the reliability of flip chip assemblies because they minimize the thermal mismatch between the flip chip and substrate.Loctite® Underfills and Encapsulants improve assembly operations by providing superior reliability and faster throughput. Improved reliability is achieved through products that have a high Tg, low CTE, high throughput and excellent adhesion. Faster throughput and higher yields are achieved through faster flow characteristics and increased cure speeds.Loctite® 3563 Epoxy Snap Cure UnderfillDesigned specifically for high volume production of flip chip packaging in consumer electronics applications.
Physical Properties Metric English Comments
Density 1.52 g/cc
0.0549 lb/in³
Viscosity 8000 cP
8000 cP
Haake cone and plate rheometer @ 5/sec (35mm/2° cone)
Mechanical Properties Metric English Comments
Tensile Modulus 2.76 GPa
400 ksi
Thermal Properties Metric English Comments
CTE, linear 35.0 µm/m-°C

@Temperature 20.0 °C
19.4 µin/in-°F

@Temperature 68.0 °F
Glass Transition Temp, Tg 130 °C
266 °F
Processing Properties Metric English Comments
Cure Time 5.00 min

@Temperature 150 °C
0.0833 hour

@Temperature 302 °F
Shelf Life 3.00 Month

@Temperature -40.0 °C
3.00 Month

@Temperature -40.0 °F
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