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- Momentive Performance Materials TSE3033 Clear General Purpose Potting/Encapsulating Compound
Momentive Performance Materials TSE3033 Clear General Purpose Potting/Encapsulating Compound
| Category | Polymer , Thermoset , Rubber or Thermoset Elastomer (TSE) , Silicone , Silicone, RTV, Encapsulation Grade |
| Manufacturer | Momentive Performance Materials (Former GE Silicones) |
| Trade Name | |
| Port | Ningbo port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Momentive Performance Materials TSE3033 Clear General Purpose Potting/Encapsulating Compound.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
Two-part addition cure. Two-part addition cure RTV silicones can be cured very quickly with the use of high heat. Addition cure products have no cure by-products and can be used to unlimited depths. Typical uses: Low viscosity, clear uses.Data provided by the manufacturer, GE Silicones.GE Silicones became a part of Momentive Performance Materials in 2006.
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Density | 1.01 g/cc | 0.0365 lb/in³ | |
| Viscosity | 1000 cP @Temperature 25.0 °C |
1000 cP @Temperature 77.0 °F |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Hardness, Shore A | 30 | 30 | |
| Tensile Strength, Ultimate | 0.980 MPa | 142 psi | |
| Elongation at Break | 130 % | 130 % |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 230 µm/m-°C @Temperature 20.0 °C |
128 µin/in-°F @Temperature 68.0 °F |
|
| Thermal Conductivity | 0.170 W/m-K | 1.18 BTU-in/hr-ft²-°F | |
| Maximum Service Temperature, Air | 204 °C | 399 °F | Continuous useful temperature. |
| Minimum Service Temperature, Air | -60.0 °C | -76.0 °F | Continuous useful temperature. |
| Optical Properties | Metric | English | Comments |
|---|---|---|---|
| Refractive Index | 1.406 | 1.406 | |
| Transmission, Visible | 90 % | 90 % | clear; thickness not quantified |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Electrical Resistivity | 2.00e+15 ohm-cm | 2.00e+15 ohm-cm | |
| Dielectric Constant | 2.8 @Frequency 1000 Hz |
2.8 @Frequency 1000 Hz |
|
| Dielectric Strength | 21.0 kV/mm @Thickness 1.91 mm |
533 kV/in @Thickness 0.0750 in |
|
| Dissipation Factor | 0.0010 @Frequency 1000 Hz |
0.0010 @Frequency 1000 Hz |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Processing Temperature | 25.0 °C | 77.0 °F | Cure time 6 hours. |
| Pot Life | 360 min @Temperature 25.0 °C |
360 min @Temperature 77.0 °F |
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