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Tra-Con Tra-Bond 2222 One-Part Surface Mount Epoxy Adhesive

Category Polymer , Adhesive , Thermoset , Epoxy
Manufacturer Tra-Con, Inc.
Trade Name Tra-Bond
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Tra-Con Tra-Bond 2222 One-Part Surface Mount Epoxy Adhesive.pdf
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Material Notes:
TRA-BOND 2222 is a solvent-free, one-part thixotropic, epoxy adhesive recommended for SMD (Surface Mount Device) bonding and sealing applications where its easy handling, high strength and superior electrical insulation features are required. This smooth paste adhesive can be dispensed pneumatically, or by screen or pin transfer without stringing or tailing, and can position components before cure. TRA-BOND 2222 has a six month shelf life and develops strong, durable, solvent-resistant bonds - after a required high temperature cure cycle - to and between many different materials such as semiconductors, ceramics, glass, metals, and laminates. It is ideal for bonding chip-on-board, active and/or passive chip-type components in the fabrication of printed, integrated and hybrid circuits, and is just right for screen printing and epoxy die mounting applications, or for the assembly and repair of printed circuits, wave guides and electrical modules. Information provided by Tra-Con Inc.
Physical Properties Metric English Comments
Specific Gravity 1.30 g/cc
1.30 g/cc
Mixed
Solids Content 100 %
100 %
Reactive Solids Content
Volatile Organic Compounds (VOC) Content 2.29 g/l
2.29 g/l
Water Absorption 0.010 %
0.010 %
After 24 hours
Viscosity 286000 cP
286000 cP
Mixed, degassed
Mechanical Properties Metric English Comments
Hardness, Shore D 86
86
Adhesive Bond Strength 5.03 MPa
730 psi
Lap shear, alum to alum, 15 min @ 100°C
5.07 MPa
735 psi
Lap shear, alum to alum, 15 min @ 120°C
11.3 MPa
1640 psi
Lap shear, alum to alum, 8 min @ 150°C
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 125 °C
257 °F
Minimum Service Temperature, Air -50.0 °C
-58.0 °F
Glass Transition Temp, Tg 75.0 °C
167 °F
Ultimate Tg
Electrical Properties Metric English Comments
Volume Resistivity 5.00e+15 ohm-cm
5.00e+15 ohm-cm
Dielectric Constant 3.5

@Frequency 1000 Hz
3.5

@Frequency 1000 Hz
Dielectric Strength 19.7 kV/mm
500 kV/in
Dissipation Factor 0.010

@Frequency 1000 Hz
0.010

@Frequency 1000 Hz
Processing Properties Metric English Comments
Cure Time 8.00 min

@Temperature 150 °C
0.133 hour

@Temperature 302 °F
15.0 min

@Temperature 120 °C
0.250 hour

@Temperature 248 °F
for higher property development
>= 15.0 min

@Temperature 100 °C
>= 0.250 hour

@Temperature 212 °F
Descriptive Properties Value Comments
Color Red-Brown
Outgassing, NASA Passes
Working Life months 3
At 25°C
6
At 20°C
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