Bulk Molding Compounds BMC 1401 Encapsulating Material, Electrical Grade

Category	Polymer , Thermoset , Polyester, TS
Manufacturer	BMC - Bulk Molding Compounds Inc.
Trade Name	BMC
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Bulk Molding Compounds BMC 1401 Encapsulating Material, Electrical Grade.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

BMC 1401 is an electrical grade of encapsulating material characterized by a balance of soft flow and cure rate to ensure complete and proper encapsulation without voiding. Generally too soft for compression molding but excellent in transfer or injection processes. Directly competitive against epoxy encapsulants on cost and cycle times. Very stable shelf life. UL® recognized. This material was formerly known as Glastic® 1401.

Physical Properties	Metric	English	Comments
Specific Gravity	1.73 - 1.79 g/cc	1.73 - 1.79 g/cc
Water Absorption	0.20 - 0.30 %	0.20 - 0.30 %	24 hours, 23°C
Linear Mold Shrinkage	0.0010 - 0.0030 cm/cm	0.0010 - 0.0030 in/in

Mechanical Properties	Metric	English
Hardness, Barcol	40 - 50	40 - 50
Tensile Strength, Ultimate	241 - 310 MPa	35000 - 45000 psi
Flexural Strength	75.8 - 89.6 MPa	11000 - 13000 psi
Flexural Modulus	11.7 - 13.1 GPa	1700 - 1900 ksi
Compressive Strength	103 - 117 MPa	15000 - 17000 psi
Izod Impact, Notched	0.534 - 1.07 J/cm	1.00 - 2.00 ft-lb/in

Thermal Properties	Metric	English	Comments
Deflection Temperature at 1.8 MPa (264 psi)	>= 260 °C	>= 500 °F
Flammability, UL94	V-0	V-0

Electrical Properties	Metric	English	Comments
Dielectric Strength	11.4 kV/mm	290 kV/in	Short Time
Dissipation Factor	0.015 @Frequency 60 Hz	0.015 @Frequency 60 Hz
Arc Resistance	190 sec	190 sec

Processing Properties	Metric	English	Comments
Mold Temperature	138 - 166 °C	280 - 330 °F

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