Master Bond EP112 Low Viscosity Structural Epoxy Adhesive System

Category	Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive , Epoxy, High Temperature
Manufacturer	Master Bond Inc.
Trade Name
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Master Bond EP112 Low Viscosity Structural Epoxy Adhesive System.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical and electronic structural applications.

Physical Properties	Metric	English	Comments
Viscosity	300 - 400 cP @Temperature 23.0 °C	300 - 400 cP @Temperature 73.4 °F

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	260 °C	500 °F
Minimum Service Temperature, Air	-51.1 °C	-60.0 °F

Processing Properties	Metric	English	Comments
Cure Time	120 - 180 min	2.00 - 3.00 hour	At 200°F plus 8-10 hrs at 300°F

Descriptive Properties	Value	Comments
Color Code	"A" Clear; "B" Clear
Mix Ratio By Weight	100/80
Set-Up Time	min 24 hrs	At Room Temperature

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